Memory array architecture with two-terminal memory cells
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G11C-011/00
G11C-013/00
G11C-011/16
G11C-011/56
H01L-045/00
H01L-027/24
출원번호
US-0692677
(2015-04-21)
등록번호
US-9620206
(2017-04-11)
발명자
/ 주소
Nazarian, Hagop
Jo, Sung Hyun
Lu, Wei
출원인 / 주소
CROSSBAR, INC.
대리인 / 주소
Amin, Turocy & Watson, LLP
인용정보
피인용 횟수 :
1인용 특허 :
193
초록▼
A non-volatile memory device includes a word line extending along a first direction; a bit line extending along a second direction; a memory unit having a read transistor coupled to the bit line, at least one two-terminal memory cell, and a select transistor, the two-terminal memory cell having a fi
A non-volatile memory device includes a word line extending along a first direction; a bit line extending along a second direction; a memory unit having a read transistor coupled to the bit line, at least one two-terminal memory cell, and a select transistor, the two-terminal memory cell having a first end coupled to the word line and a second end coupled to a gate of the read transistor. The second end of the two-terminal memory cell is coupled to a common node shared by a drain of the select transistor and the gate of the read transistor.
대표청구항▼
1. A non-volatile memory device, comprising: a word line extending along a first direction;a bit line extending along a second direction;a memory unit having a read transistor coupled to the bit line, at least one resistive memory cell comprising a resistive memory device in series with a selector d
1. A non-volatile memory device, comprising: a word line extending along a first direction;a bit line extending along a second direction;a memory unit having a read transistor coupled to the bit line, at least one resistive memory cell comprising a resistive memory device in series with a selector device, and a select transistor, the at least one resistive memory cell having a first end coupled to the word line and a second end coupled to a gate electrode of the read transistor. 2. The device of claim 1, wherein the second end is coupled to a common node shared by a drain electrode of the select transistor and the gate electrode of the read transistor. 3. The device of claim 2, wherein the device has a plurality of word lines, and wherein the memory unit has a plurality of resistive memory cells, each resistive memory cell having the first end coupled to one of the word lines and the second end coupled to the common node. 4. The device of claim 3, further comprising: a source line coupled to a source electrode of the select transistor; anda select line coupled to a gate electrode of the select transistor. 5. The device of claim 4, further comprising: the word line being one of the plurality of word lines, wherein the plurality of word lines has a first group of word lines, a second group of word lines, and a third group of word lines;a plurality of memory units, the memory unit being one of the plurality of memory units, wherein the plurality of memory units has a first row of memory units, a second row of memory units, and a third row of memory units, andwherein the first group of word lines is associated with the first row of memory units, the second group of word lines is associated with the second row of memory units, and the third group of word lines is associated with the third row of memory units. 6. The device of claim 5, wherein each memory unit includes a plurality of resistive memory cells, each memory cell in each memory unit having one end connected to one of the word lines and the other end connected to the common node. 7. The device of claim 6, wherein the resistive memory cells in each memory unit are configured to be accessed independently from other resistive memory cells in the same memory unit. 8. The device of claim 7, where in each resistive memory cell includes a top electrode, a switching medium, and a bottom electrode, wherein the top electrode includes silver, the switching medium includes amorphous silicon, and the bottom electrode includes polysilicon. 9. The device of claim 8, wherein a resistive memory cell is configured to have a high resistance state and a low resistance state. 10. The device of claim 1, wherein the at least one resistive memory cell is an amorphous-silicon-based resistive memory cell. 11. The device of claim 1, further comprising: a source line coupled to a source electrode of the select transistor; anda select line coupled to a gate electrode of the select transistor,wherein the second end of the at least one resistive memory cell is coupled to a common node shared by a drain electrode of the select transistor and the gate electrode of the read transistor,wherein the device has a plurality of word lines, and wherein the memory unit has a plurality of resistive memory cells, each resistive memory cell having a first end coupled to one of the word lines and a second end coupled to the common node, andwherein each resistive memory cell includes a switching medium provided between the first and second ends, wherein the first end includes silver, the switching medium includes amorphous silicon, and the second end includes poly silicon. 12. A non-volatile memory device, comprising: a plurality of memory units arranged in an array of rows and columns, each memory unit having a plurality of resistive memory cells, each resistive memory cell having a first end and a second end;a plurality of word lines extending along a first direction and having a first group of word lines associated with a first row of memory units, a second group of word lines associated with a second row of memory units, and a third group of word lines associated with a third row of memory units;a plurality of bit lines extending along a second direction and having a first bit line associated with a first column of memory units, a second bit line associated with a second column of memory units, and a third bit line associated with a third column of memory units;a plurality of read transistors, each read transistor being associated with one of the memory units and having a drain electrode coupled to one of the bit lines;a plurality of select transistors, each select transistor being associated with one of the memory units;a plurality of select lines having a first select line coupled to gate electrodes of the select transistors associated with the first column of memory units, a second select line coupled to gate electrodes of the select transistors associated with the second column of memory units, and a third select line coupled to gate electrodes of the select transistors associated with the third column of memory units; anda plurality of source lines having a first source line coupled to source electrodes of select transistors associated with the first row of memory units, a second source line coupled to source electrodes of select transistors associated with the second row of memory units, and a third source line coupled to source electrodes of select transistors associated with the third row of memory units; wherein:the first ends of the resistive memory cells are coupled to the corresponding word lines and the second ends of the resistive memory cells are coupled to corresponding common nodes, each common node being shared by the drain electrode of one of the select transistor and the gate electrode of the corresponding read transistor. 13. The non-volatile memory device of claim 12, wherein a resistive memory cell of the plurality of resistive memory cells includes a resistive switching device in series with a selector device. 14. The non-volatile memory device of claim 13, wherein the resistive memory device is a non-volatile resistive memory. 15. The non-volatile memory device of claim 13, wherein the resistive memory device comprises a top electrode, a switching medium and a bottom electrode. 16. The non-volatile memory device of claim 15, wherein the top electrode comprises a metal selected from a group consisting of: aluminum, nickel, gold, chromium, iron, manganese, tungsten, vanadium and cobalt. 17. The non-volatile memory device of claim 15, wherein the top electrode is silver. 18. The non-volatile memory device of claim 15, wherein the switching medium contains amorphous silicon. 19. The non-volatile memory device of claim 13, wherein the resistive memory cell can be controlled to exhibit either rectifying or non-rectifying characteristics in response to an amount of current flowing through the resistive memory cell.
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