초록 ▼

Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remain

Peel ply for surface preparation and a method of surface preparation prior to adhesive bonding. A resin-rich peel ply is applied onto a curable, resin-based composite substrate, followed by co-curing. After co-curing, the composite substrate is fully cured but the matrix resin in the peel ply remains partially cured. When the peel ply is removed, a roughened, bondable surface with chemically-active functional groups is revealed. The composite substrate with the chemically-active, bondable surface may be bonded to another composite substrate to form a covalently-bonded structure.

대표청구항 ▼

1. A method for surface preparation prior to adhesive bonding comprising: (a) providing a composite substrate comprising reinforcing fibers impregnated with a curable, first matrix resin;(b) applying a removable, resin-rich peel ply onto a surface of the composite substrate, said peel ply comprising

1. A method for surface preparation prior to adhesive bonding comprising: (a) providing a composite substrate comprising reinforcing fibers impregnated with a curable, first matrix resin;(b) applying a removable, resin-rich peel ply onto a surface of the composite substrate, said peel ply comprising a woven fabric impregnated with a curable, second matrix resin different from the first matrix resin;(c) co-curing the composite substrate and the peel ply until the composite substrate is fully cured but the second matrix resin in the peel ply remains partially cured; and(d) removing the peel ply from the composite substrate's surface, leaving a thin film of partially cured second matrix resin on the composite substrate's surface, said thin film providing a roughened, bondable surface with chemically-active functional groups. 2. The method of claim 1, wherein the second matrix resin comprises one or more multifunctional epoxy resins, and after removal of the peel ply, the chemically-active functional groups on the roughened, bondable surface comprise epoxy functional groups. 3. The method of claim 1, wherein the second matrix resin comprises at least one thermoset resin and at least one curing agent for crosslinking the thermoset resin, and the molar ratio of thermoset resin to curing agent is such that there is unreacted, non-crosslinked thermoset resin in the peel ply after co-curing at step (c). 4. The method of claim 3, wherein the ratio of curing agent to thermoset resin is such that there is a deficiency in the amount of curing agent that is necessary for reacting with 100% of the thermoset resin. 5. The method of claim 1, wherein the second matrix resin comprises one or more multifunctional epoxy resins, but does not contain any curing agent for cross-linking the epoxy resins. 6. The method of claim 1, wherein the thin film of partially cured second matrix resin remaining on the composite substrate's surface has a lower glass transition temperature (Tg) than that of the composite substrate's matrix resin due to incomplete curing. 7. A bonding method comprising: (a) providing a first composite substrate comprising reinforcing fibers impregnated with a curable, first matrix resin;(b) applying a removable, resin-rich peel ply onto a surface of the first composite substrate, said peel ply comprising a woven fabric impregnated with a curable, second resin matrix different from the first matrix resin;(c) co-curing the first composite substrate and the peel ply until the first composite substrate is fully cured but the second matrix resin in the peel ply remains partially cured;(d) removing the peel ply from the first composite substrate's surface, leaving a thin film of partially cured second matrix resin on the first composite substrate's surface, said thin film providing a roughened, bondable surface with chemically-active functional groups;(e) joining the cured, first composite substrate to a second composite substrate with a curable adhesive film in between the composite substrates, said adhesive film being in contact with the bondable surface of the first composite substrate, wherein the curable adhesive film comprises chemically-active functional groups capable of reacting with the chemically-active functional groups on the bondable surface of the first composite substrate; and(f) curing the adhesive film to form a covalently bonded structure, whereby the functional groups on the adhesive film react with the functional groups on the bondable surface of the first composite substrate to form covalent bonds. 8. The bonding method of claim 7, wherein the second composite substrate is cured prior to being joined to the cured, first composite substrate. 9. The bonding method of claim 8, wherein the cured, second composite substrate comprises a roughened, bondable surface having chemically-active functional groups prepared by the same method used for forming the roughened, bondable surface of the cured, first composite substrate. 10. The bonding method of claim 8, wherein the second composite substrate is uncured or partially cured prior to being joined to the first composite substrate, and during step (f), the adhesive film and the second composite substrate are cured simultaneously. 11. The bonding method of claim 8, wherein the second matrix resin comprises one or more multifunctional epoxy resins, and after removal of the peel ply, the chemically-active functional groups on the roughened, bondable surface of the first composite substrate comprise epoxy functional groups. 12. The bonding method of claim 11, wherein the curable adhesive film comprises at least one multifunctional epoxy resins and at least one aliphatic or cyclic amine compound capable of reacting with multifunctional epoxy resins. 13. The bonding method of claim 8, wherein the second matrix resin comprises at least one thermoset resin and at least one curing agent for crosslinking the thermoset resin, and the molar ratio of thermoset resin to curing agent is such that there is a deficiency in the amount of curing agent that is necessary for reacting with 100% of the thermoset resin, and consequently, there is unreacted, non-crosslinked thermoset resin in the peel ply after co-curing at step (c).