초록 ▼

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishin

A polishing apparatus polishes a periphery of a substrate by bringing a polishing tool into sliding contact with the substrate. The polishing apparatus includes a substrate-holding mechanism configured to hold a substrate and rotate the substrate, a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery, and a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid. The periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side or the same side of the periphery of the substrate.

대표청구항 ▼

1. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate, said substrate-holding mechanism having a substrate stage configured to contact a central portion of the substrate;a polishing mechanism configured to press a polishing tool ag

1. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate, said substrate-holding mechanism having a substrate stage configured to contact a central portion of the substrate;a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery; anda periphery-supporting mechanism configured to support the periphery of the substrate by ejecting a fluid toward the periphery. 2. The polishing apparatus according to claim 1, wherein said periphery-supporting mechanism is configured to support a surface of the substrate from an opposite side of the periphery of the substrate. 3. The polishing apparatus according to claim 1, wherein said periphery-supporting mechanism is configured to support a surface of the substrate from the same side of the periphery of the substrate. 4. The polishing apparatus according to claim 1, further comprising: a moving mechanism configured to move said polishing mechanism in a radial direction of the substrate held on said substrate-holding mechanism. 5. The polishing apparatus according to claim 1, wherein said polishing mechanism is located above the substrate and said periphery-supporting mechanism is located below the substrate, when the substrate is held on said substrate-holding mechanism. 6. The polishing apparatus according to claim 1, wherein said periphery-supporting mechanism is configured not to rotate. 7. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate;a polishing mechanism configured to press a polishing tape against a periphery of the substrate so as to polish the periphery;a periphery-supporting mechanism configured to support the periphery of the substrate by a fluid; anda polishing-tape supply mechanism configured to supply the polishing tape to said polishing mechanism. 8. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate;a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery; anda periphery-supporting mechanism configured to support the periphery of the substrate by a fluid, whereinsaid polishing mechanism includes a spring configured to press the polishing tool against the periphery of the substrate so as to polish the periphery. 9. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate;a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery; anda periphery-supporting mechanism configured to support the periphery of the substrate by a fluid, whereinsaid polishing mechanism includes a cylinder and a rod whose end is housed in said cylinder, said cylinder and said rod being configured to press the polishing tool against the periphery of the substrate so as to polish the periphery. 10. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate, said substrate-holding mechanism having a substrate stage configured to contact a central portion of the substrate;a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery; anda periphery-supporting mechanism configured to support the periphery of the substrate by a fluid,wherein said periphery-supporting mechanism is movable in a radial direction of the substrate when the substrate is held on said substrate-holding mechanism. 11. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate, said substrate-holding mechanism having a substrate stage configured to contact a central portion of the substrate;a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery; anda periphery-supporting mechanism configured to support the periphery of the substrate by a fluid,wherein said substrate stage is rotatable relative to said periphery-supporting mechanism. 12. A polishing apparatus comprising: a substrate-holding mechanism configured to hold a substrate and rotate the substrate, said substrate-holding mechanism having a substrate stage configured to contact a central portion of the substrate;a polishing mechanism configured to press a polishing tool against a periphery of the substrate so as to polish the periphery; anda periphery-supporting mechanism configured to support the periphery of the substrate by a fluid,wherein said periphery-supporting mechanism is movable relative to said substrate-holding mechanism.