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A dielectric header sub-assembly includes a header body with opposed first and second surfaces and a side wall. The first and second surfaces define a header axis extending therebetween. The side wall extends from the first surface to the second surface. The second surface includes a tapered portion

A dielectric header sub-assembly includes a header body with opposed first and second surfaces and a side wall. The first and second surfaces define a header axis extending therebetween. The side wall extends from the first surface to the second surface. The second surface includes a tapered portion. A dielectric header sub-assembly includes a bore. The bore extends from the first surface to the second surface. A first bore opening of the bore proximate to the first surface is greater in area than a second bore opening of the bore proximate the second surface. A method of assembling a header sub-assembly includes inserting an electrical connector into a bore of a header body, applying an active braze filler material into the bore and applying heat to braze the active braze filler material to the header body and the electrical connector.

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1. A dielectric header sub-assembly comprising: a header body including opposed first and second surfaces defining a header axis extending therebetween, a side wall extending from the first surface to the second surface, wherein the second surface includes a tapered portion,and a sensor die mounted

1. A dielectric header sub-assembly comprising: a header body including opposed first and second surfaces defining a header axis extending therebetween, a side wall extending from the first surface to the second surface, wherein the second surface includes a tapered portion,and a sensor die mounted to the first surface of the header body opposite of the second surface, wherein the surface area of the first surface is greater than the surface area of a non-tapered portion of the second surface. 2. A dielectric header sub-assembly as recited in claim 1, wherein the tapered portion is on an outer periphery of the second surface. 3. A dielectric header sub-assembly as recited in claim 1, wherein the tapered portion is tapered from a first end proximate the side wall to a second end proximate a non-tapered portion of the second surface, wherein the first surface and at least a portion of the non-tapered portion the second surface are substantially parallel to each other over temperatures ranging from 22° C. to 1045° C. 4. A dielectric header sub-assembly as recited in claim 1, wherein a portion of the header body having a cross-section with a trapezoidal shape is defined between the second surface, and a line parallel to the first surface. 5. A dielectric header sub-assembly as recited in claim 1, further comprising a ring mounted around the periphery of the header body for hermetically isolating the sensor die. 6. A dielectric header sub-assembly as recited in claim 5, wherein a portion of the second surface protrudes beyond the ring in an axial direction.