[특허]LED lamp

[미국특허] LED lamp 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F21K-099/00 F21V-029/00 F21V-029/70 F21K-009/232 F21V-003/00 F21Y-115/10 F21Y-107/00
출원번호	US-0207847 (2014-03-13)
등록번호	US-9664369 (2017-05-30)
발명자 / 주소	Richards, Charles Keeney, Shawn Youmans, Mark Leung, Michael Desilva, Nicholas Nava, Dante Higley, Robert
출원인 / 주소	Cree, Inc.
대리인 / 주소	Williamson, Dennis J.
인용정보	피인용 횟수 : 0 인용 특허 : 65

초록 ▼

A LED lamp has a base and an at least partially optically transmissive enclosure connected to the base. A heat sink is partially disposed in the enclosure and supports a plurality of LEDs. The heat sink comprising a mounting portion positioned in the enclosure for supporting the LEDs and a heat dissipating portion exposed to the ambient environment where the interior of the enclosure is exposed to the ambient environment. The heat sink have a plurality of separate heat sink structures that are mounted to the lamp independently of one another. Each heat sink structure may have a thickness of approximately 1-5 mm. Each heat sink structure may in some embodiments weigh approximately 3.8 to 7.7 grams and in other embodiments weigh approximately 27 grams.

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1. A LED lamp comprising: a base;an at least partially optically transmissive enclosure connected to the base defining a longitudinal axis of the lamp extending from the base to the enclosure;a frame comprising a first end connected to the base and a second end connected to the enclosure, the frame narrowing from the second end to the first end and comprising openings for allowing access to the interior of the enclosure;a heat sink partially disposed in the enclosure and supporting a plurality of LEDs operable to emit light when energized where the interior of the enclosure is exposed to the ambient environment, the heat sink comprising a plurality of separate heat sink structures that are mounted to the lamp independently of one another, wherein each of the plurality of heat sink structures comprises a mounting portion positioned in the enclosure for supporting the LEDs and a heat dissipating portion located outside of the enclosure and exposed to the ambient environment, the mounting portion comprising a first mounting surface supporting at least one first LED of the plurality of LEDs and a second mounting surface supporting at least one second LED of the plurality of LEDs, the first mounting surface being disposed parallel to the longitudinal axis of the lamp and and a second end spaced from the first mounting surface, the second mounting surface extending away from the longitudinal axis from the first end to the second end such that the second mounting surface is disposed at an included angle with the first mounting surface of less than 180 degrees where the second end of the second mounting surface extends from the longitudinal axis a first distance and the heat dissipating portion extends from adjacent the second end of the second mounting surface to the first end where the first end extends from the longitudinal axis a second distance where the first distance is greater than the second distance such that the heat dissipating portion narrows as the heat dissipating portion extends from the second mounting surface to the first end, the heat dissipating portion being at least partially disposed in the openings and extending from the first end to the second end. 2. The lamp of claim 1 wherein the lamp has a color rendering index of approximately at least 80 with a correlated color temperature (CCT) of less than approximately 3000. 3. The lamp of claim 1 wherein the base comprises an Edison base. 4. The lamp of claim 1 wherein the plurality of LEDs are mounted on at least one thermally conductive submount. 5. The lamp of claim 4 wherein the at least one submount is arranged such that the plurality of LEDs surround a longitudinal axis of the lamp and emit light generally toward the enclosure. 6. The lamp of claim 4 wherein the at least one submount comprises at least one of a PCB, metal core printed circuit board, FR4 board, lead frame or flex circuit. 7. The lamp of claim 4 wherein the at least one submount is bent into a three-dimensional shape. 8. The lamp of claim 4 wherein the at least one submount is approximately 20 square mm. 9. The lamp of claim 1 wherein lamp electronics are in the electrical path and are contained in a housing comprising a first portion that is connected to the base and a second portion that extends into the heat sink. 10. The lamp of claim 1 comprising an opening in the enclosure that communicates the interior of the enclosure with the exterior of the lamp. 11. The lamp of claim 1 wherein each of the plurality of heat sink structures comprises a fin structure that is exposed to the exterior of the lamp. 12. The lamp of claim 1 comprising at least one passage formed adjacent the plurality of heat sink structures that allow air to circulate from the ambient environment around the heat sink. 13. The lamp of claim 1 wherein each of the plurality of heat sink structures having a thickness of approximately 3 to 5 mm and each of the plurality of heat sink structures weigh approximately 20 and 35 grams such that the heat sink has a total weight of approximately 110 to 170 grams, wherein the lamp has a lumen output of approximately at least 1600 lumens in a steady state operation and an efficiency of at least approximately 80 lumens per Watt (LPW) with a total power of approximately 21 Watts and a junction temperature of the plurality of LEDs between approximately 105 and 111° C. 14. The lamp of claim 1 wherein each of the plurality of heat sink structures have a thickness of approximately 1 to 3 mm and each of the plurality of heat sink structures weigh approximately 3.8 to 10.0 grams each such that the heat sink has a total weight of approximately 15 to 50 grams, wherein the lamp has a lumen output of approximately at least 1600 lumens in a steady state operation and an efficiency of at least approximately 80 lumens per Watt (LPW) with a total power of approximately 21 Watts and a junction temperature of the plurality of LEDs between approximately 105 and 111° C. 15. The lamp of claim 1 wherein the first mounting surface extends from a first side of the second mounting surface and the heat dissipating portions extend from a second side of the second mounting surface. 16. The lamp of claim 12 wherein the heat sink structures comprise heat dissipating portions that are at least partially disposed in the openings.

이 특허에 인용된 특허 (65) 인용/피인용 타임라인 분석

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