An indicia-reading module is capable of integration into the smallest face of thin-profile smart device. The module employs chip-on-board packaging and a customized sensor enclosure to eliminate the stack-up height found in conventional packaging. The module also employs a customized frame to reduce
An indicia-reading module is capable of integration into the smallest face of thin-profile smart device. The module employs chip-on-board packaging and a customized sensor enclosure to eliminate the stack-up height found in conventional packaging. The module also employs a customized frame to reduce volume by integrating circuit subassembly circuit boards into a unique architecture and by serving as the lenses for the illuminator and the aimer, thereby eliminating the need for any extra lenses or holders.
대표청구항▼
1. An indicia-reading module, comprising: a sensor module including an adjustable imaging lens for imaging the indicia-reading module's field of view onto a sensor circuit that includes a plurality of pixels;an illuminator-aimer circuit subassembly (i) for projecting electromagnetic radiation toward
1. An indicia-reading module, comprising: a sensor module including an adjustable imaging lens for imaging the indicia-reading module's field of view onto a sensor circuit that includes a plurality of pixels;an illuminator-aimer circuit subassembly (i) for projecting electromagnetic radiation toward indicia within the indicia reading module's field of view and (ii) for projecting a sighting pattern that corresponds with the indicia-reading module's field of view;a processing circuit subassembly for rendering indicia information; andan interface circuit subassembly for connecting the indicia-reading module to a host device;wherein the indicia-reading module is configured to facilitate narrow-edge integration into a thin-profile smart device; andwherein the adjustable imaging lens is focused out of a narrow edge of the smart device;wherein the sensor module, the illuminator-aimer circuit subassembly, the processor circuit subassembly, and the interface circuit subassembly circuit boards are positioned within and secured to a clear module frame that serves as at least one of an illuminator lens and an aimer lens for the illuminator-aimer circuit subassembly in the indicia-reading module. 2. The indicia-reading module according to claim 1, wherein the sensor module comprises a sensor integrated circuit die attached to a substrate, the sensor integrated circuit die hermetically sealed within a structure formed by the substrate, a housing, and a filter. 3. The indicia-reading module according to claim 2, wherein the sensor integrated circuit die is electrically connected to the substrate via wire bonding with no wire crossover. 4. The indicia-reading module according to claim 1, wherein the illuminator-aimer circuit subassembly comprises an illuminator light source and an illuminator aperture for projecting an illumination pattern via the clear module frame serving as the illuminator lens toward indicia within the indicia reading module's field of view. 5. The indicia-reading module according to claim 1, wherein the illuminator-aimer circuit subassembly comprises an aimer light source and an aimer aperture for projecting a sighting pattern via the clear module frame serving as the aimer lens, the sighting pattern corresponding with the indicia-reading module's field of view. 6. The indicia-reading module according to claim 1, wherein the illuminator-aimer circuit subassembly is positioned on a single, rigid-flex circuit board. 7. The indicia-reading module according to claim 1, wherein the processor circuit subassembly is positioned on a single, rigid-flex circuit board. 8. The indicia-reading module according to claim 1, wherein the interface circuit subassembly is positioned on a single, rigid-flex circuit board. 9. The indicia-reading module according to claim 1, wherein: the illuminator-aimer circuit subassembly is positioned on a first single, rigid-flex circuit board;the processor circuit subassembly is positioned on a second single, rigid-flex circuit board; andthe interface circuit subassembly is positioned on a third single, rigid-flex circuit board. 10. The indicia-reading module according to claim 9, wherein the sensor module, the illuminator-aimer circuit subassembly, the processor circuit subassembly, and the interface circuit subassembly circuit boards are connected via flexible cable. 11. The indicia-reading module according to claim 10, wherein the sensor module, the illuminator-aimer circuit subassembly, the processor circuit subassembly, and the interface circuit subassembly circuit boards are positioned within and secured to the clear module frame using snap fittings. 12. A smart phone having indicia-reading capability, comprising: a smart phone including a computer, a display, and an indicia-reading module physically integrated within a slim hand supportable housing, the smart phone possessing a substantially rectangular cuboid shape whose thickness is substantially smaller than both its height and its width;wherein the indicia-reading module comprises (i) a sensor module including an adjustable lens for imaging the indicia-reading module's field of view onto an imaging sensor that includes a plurality of pixels, (ii) an illuminator-aimer circuit subassembly for projecting electromagnetic radiation toward indicia within the indicia reading module's field of view and for projecting a sighting pattern that corresponds with the indicia-reading module's field ofview, (iii) a processing circuit subassembly for rendering indicia information, (iv) an interface circuit subassembly for connecting the indicia-reading module to a host device;wherein the indicia-reading module is narrow-edge integrated into the smart phone; wherein the adjustable lens is focused out of a narrow edge of the smart phone;wherein the sensor module, the illuminator-aimer circuit subassembly, the processor circuit subassembly, and the interface circuit subassembly circuit are positioned within and secured to a clear module frame that serves as at least one of an illuminator lens and an aimer lens for the illuminator-aimer circuit subassembly in the indicia-reading module. 13. The smart phone according to claim 12, wherein the sensor module comprises a sensor integrated circuit die that is (i) physically attached to a substrate, (ii) electrically connected to the substrate via wirebonds, and (iii) hermetically sealed within a structure formed by a substrate, a housing, and a filter. 14. The smart phone according to claim 12, wherein the illuminator-aimer circuit subassembly comprises (i) an illuminator including an illuminator light source and an illuminator aperture for projecting an illumination pattern via the clear module frame serving as the illuminator lens toward indicia within the indicia reading module's field of view and (ii) an aimer including an aimer light source and an aimer aperture for projecting a sighting pattern via the clear module frame serving as the aimer lens, the sighting pattern corresponding that corresponds with the indicia-reading module's field of view. 15. The smart phone according to claim 12, wherein the sensor module, the illuminator-aimer circuit subassembly, the processor circuit subassembly, and the interface circuit subassembly each utilize a distinct circuit board. 16. The smart phone according to claim 12, wherein the sensor module, the illuminator-aimer circuit subassembly, the processor circuit subassembly, and the interface circuit subassembly circuit boards are positioned within and secured to the clear module frame using snap fittings. 17. The smart phone according to claim 12, wherein the indicia reading module's frame is integrated with mounting pins and screws to prevent the deformation of the module frame. 18. The smart phone according to claim 12, wherein the smart phone's thickness is no more than 20 percent of either the smart phone's height or the smart phone's width.
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이 특허에 인용된 특허 (129)
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