초록 ▼

An apparatus for freeze drying a substrate is provided. A chamber for receiving a substrate is provided. An electrostatic chuck (ESC) for supporting and electrostatically clamping the substrate is within the chamber. A temperature controller controls the temperature of the electrostatic chuck. A con

An apparatus for freeze drying a substrate is provided. A chamber for receiving a substrate is provided. An electrostatic chuck (ESC) for supporting and electrostatically clamping the substrate is within the chamber. A temperature controller controls the temperature of the electrostatic chuck. A condenser is connected to the chamber. A vacuum pump is in fluid connection with the chamber.

대표청구항 ▼

1. A method for freeze drying a drying chemistry liquid filling high aspect ratio features on a wet substrate, comprising: displacing liquid in the high aspect ratio features with a liquid form of a drying chemistry by flowing the liquid form of the drying chemistry over the substrate, such that the

1. A method for freeze drying a drying chemistry liquid filling high aspect ratio features on a wet substrate, comprising: displacing liquid in the high aspect ratio features with a liquid form of a drying chemistry by flowing the liquid form of the drying chemistry over the substrate, such that the liquid form of the drying chemistry fills at least a portion of the high aspect ratio features, wherein the drying chemistry comprises at least one of tert-butanol, dimethyl sulfoxide (DSMO), cyclohexane, acetic acid, carbon tetrachloride, isopropanol, and dimethyl carbonate, wherein the high aspect ratio features have a critical dimension (CD) of less than 40 nm and a pitch of less than 80 nm;transferring the wet substrate into a drying chamber;sealing the drying chamber;placing the wet substrate on an electrostatic chuck in the chamber;chucking the substrate to the electrostatic chuck;using the electrostatic chuck to back side cool the substrate below the freezing point of the drying chemistry to freeze the drying chemistry;reducing the pressure in the chamber to remove the frozen drying chemistry; andheating the substrate in a temperature-controlled manner to vaporize the drying chemistry without melting the drying chemistry. 2. The method, as recited in claim 1, further comprising precooling the electrostatic chuck to a temperature below the freezing point of the drying chemistry before placing the substrate on the electrostatic chuck. 3. The method, as recited in claim 1, further comprising providing an inert or reducing gas to provide an oxygen free atmosphere within the chamber. 4. The method, as recited in claim 1, wherein the using the electrostatic chuck to back side cool the substrate causes the drying chemistry to freeze to complete solidification, while eliminating meta stable states of the drying chemistry. 5. The method, as recited in claim 1, wherein the drying chemistry comprises water and tert-butanol. 6. The method, as recited in claim 1, wherein heating the substrate in a temperature-controlled manner comprises using the electrostatic chuck to back side heat the substrate, while controlling the temperature of at least a portion of the electrostatic chuck. 7. The method, as recited in claim 6, wherein using the electrostatic chuck to back side heat the substrate comprises heating the back side of the substrate with a thermoelectric unit embedded in the electrostatic chuck. 8. The method, as recited in claim 7, further comprising providing a cooling source to the electrostatic chuck and heating the back side of the substrate with the thermoelectric unit. 9. The method, as recited in claim 7, wherein a temperature differential is provided between a part of the electrostatic chuck in which the at least one thermoelectric unit is embedded and a remainder of the electrostatic chuck. 10. The method, as recited in claim 1, wherein heating the substrate in a temperature-controlled manner comprises heating the substrate with one or more heat lamps while controlling the temperature of the substrate. 11. The method, as recited in claim 1, wherein the step of transferring takes place at ambient pressure.