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A board assembly including a cooling system includes: a wiring board; a first heat generating component mounted on a surface of the wiring board; a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough; a second heat genera

A board assembly including a cooling system includes: a wiring board; a first heat generating component mounted on a surface of the wiring board; a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough; a second heat generating component mounted on another surface of the wiring board; a second heat receiving portion mounted on the second heat generating component and configured to allow the coolant to pass therethrough; and a support post disposed through the wiring board so as to extend between the first heat receiving portion and the second heat receiving portion, the support post having a space through which the coolant flows from the first heat receiving portion to the second heat receiving portion or from the second heat receiving portion to the first heat receiving portion.

대표청구항 ▼

1. A board assembly including a cooling system comprising: a wiring board;a first heat generating component mounted on a surface of the wiring board;a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough;a second heat gene

1. A board assembly including a cooling system comprising: a wiring board;a first heat generating component mounted on a surface of the wiring board;a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough;a second heat generating component mounted on another surface of the wiring board;a second heat receiving portion mounted on the second heat generating component and configured to allow the coolant to pass therethrough; anda support post disposed through the wiring board so as to extend between the first heat receiving portion and the second heat receiving portion, the support post having a space through which the coolant flows from the first heat receiving portion to the second heat receiving portion or from the second heat receiving portion to the first heat receiving portion,wherein the support post extends through the first heat receiving portion,wherein the support post defines, along a longitudinal direction, a hole at an upper peripheral side portion thereof, andwherein the space of the support post is in fluid communication with a first channel in the first heat receiving portion via the hole. 2. The board assembly including the cooling system according to claim 1, wherein the support post includes: a spacer having a larger diameter than remaining portions of the support post; a threaded peripheral portion positioned away from the spacer; and a fixation screw screwed on the threaded peripheral portion such that the wiring board is sandwiched between the fixation screw and the spacer. 3. The board assembly including the cooling system according to claim 1, wherein the support post includes a plurality of support posts including a first support post and a second support post, the first heat receiving portion has a coolant inlet, a coolant outlet, and a second channel through which the coolant flows,the second heat receiving portion has a third channel through which the coolant flows,the first channel extends between the coolant inlet and the first support post so as to allow communication therebetween,the third channel allows the space in the first support post to be in communication with the space in the second support post, andthe second channel allows the second support post to be in communication with the coolant outlet. 4. The board assembly including the cooling system according to claim 3, wherein at least one of the support posts has a hole at an upper portion thereof, and the space in the support post is in communication with the second channel through the hole. 5. The board assembly including the cooling system according to claim 1, wherein the support post is secured to the second heat receiving portion, and the space in the support post is in communication with the third channel at a lower portion of the support post. 6. The board assembly including the cooling system according to claim 1, wherein the first heat receiving portion and the second heat receiving portion each have a plurality of channels connected in parallel. 7. The board assembly including the cooling system according to claim 1, wherein the support post includes four support posts. 8. An electronic apparatus comprising: a chassis; anda board assembly including a cooling system disposed in the chassis, the board assembly including the cooling system comprisinga wiring board,a first heat generating component mounted on a surface of the wiring board,a first heat receiving portion mounted on the first heat generating component and configured to allow a coolant to pass therethrough,a second heat generating component mounted on another surface of the wiring board,a second heat receiving portion mounted on the second heat generating component and configured to allow the coolant to pass therethrough, anda support post disposed through the wiring board so as to extend between the first heat receiving portion and the second heat receiving portion, the support post having a space through which the coolant flows from the first heat receiving portion to the second heat receiving portion or from the second heat receiving portion to the first heat receiving portion,wherein the support post extends through the first heat receiving portion,wherein the support post defines, along a longitudinal direction, a hole at an upper peripheral side portion thereof, andwherein the space of the support post is in fluid communication with a first channel in the first heat receiving portion via the hole. 9. The electronic apparatus according to claim 8, wherein the chassis further comprising a heat dissipater configured to cool the coolant expelled from the first heat receiving portion and supply the coolant to the first heat receiving portion.