A flexible circuit board includes a substrate and a circuit unit formed on the substrate. The substrate has two carrying segments and a connecting segment, and the two carrying segments are connected by the connecting segment. The circuit unit has a plurality of conductive lines and at least one con
A flexible circuit board includes a substrate and a circuit unit formed on the substrate. The substrate has two carrying segments and a connecting segment, and the two carrying segments are connected by the connecting segment. The circuit unit has a plurality of conductive lines and at least one connecting line, and each conductive line and the connecting line are separated from each other. The conductive lines are respectively formed on the two carrying segments, and the connecting line is formed on the connecting segment and the two carrying segments. Two opposite ends of each carrying segment are configured to connect with each other to form a tubular structure, and two opposite ends of the connecting line are configured to connect to two adjacent conductive lines respectively formed on the two tubular structures, thereby the circuit unit is formed as a coil.
대표청구항▼
1. An electromagnet, comprising: an ring-shaped core; anda flexible circuit board, comprising: a substrate including two carrying segments and a connecting segment, wherein the connecting segment connects the two carrying segments; anda circuit unit formed on the substrate and including a plurality
1. An electromagnet, comprising: an ring-shaped core; anda flexible circuit board, comprising: a substrate including two carrying segments and a connecting segment, wherein the connecting segment connects the two carrying segments; anda circuit unit formed on the substrate and including a plurality of conductive lines and a connecting line, wherein each conductive line and the connecting line are independent lines, the conductive lines are respectively formed on the two carrying segments, and the connecting segment is formed on the connecting segment and the two carrying segments;wherein the number of the conductive lines formed on each one of the carrying segments is several,wherein the two opposite end portions of each one of the carrying segments include a first end portion and an opposite second end portion, the first end portions and the second end portions of the substrate are arranged in two rows, and each one of the carrying segments is bendable to overlap the first end portion onto the second end portion thereof; each conductive line is arranged from the first end portion to the second end portion of the corresponding carrying segment, and the connecting line is arranged from the first end portion of one of the two carrying segments to the second end portion or the first end portion of the other carrying segment through the connecting segment,wherein each one of the conductive lines includes a first welding pad and a second welding pad arranged at two opposite ends thereof, the first welding pad and the second welding pad of each one of the conductive lines are respectively formed on the first end portion and the second end portion of the corresponding carrying segment; wherein each one of the conductive lines defines a virtual line passing through the first welding pad and the second welding pad thereof, and each virtual line and a longitudinal direction of the corresponding carrying segment have an acute angle,wherein the two carrying segments and the connecting segment are formed in an H shape,wherein the two opposite end portions of each carrying segment are connected to each other to construct a tubular structure, and two opposite ends of the connecting line are respectively connected to two adjacent conductive lines respectively formed on the two tubular structures, so the conductive lines and the connecting line are in a series connection to construct a coil;wherein the tubular structures are sleeved at the core, and the coil is wound around the core, wherein the coil is configured to receive a current for making the core to have magnetism. 2. The electromagnet as claimed in claim 1, wherein each one of the conductive lines includes two metallic layers and at least one connecting portion connecting the two metallic layers, the two metallic layers of each one of the conductive lines are respectively formed on two opposite surfaces of the substrate, and the at least one connecting portion of each one of the conductive lines is embedded in the substrate. 3. The electromagnet as claimed in claim 2, wherein the metallic layers of each one of the conductive lines are only connected to the substrate and the corresponding connecting portion, and a thickness of the flexible circuit board is 100 μm˜150 μm. 4. The electromagnet as claimed in claim 2, wherein the flexible circuit board includes a bonding layer, the bonding layer is formed on one of the two opposite surfaces of the substrate to cover the corresponding metallic layers, and a thickness of the flexible circuit board is 125 μm˜175 μm. 5. The electromagnet as claimed in claim 2, wherein the flexible circuit board includes two bonding layers respectively formed on the two opposite surfaces of the substrate, the metallic layers of the conductive lines are embedded in the two bonding layers, and a thickness of the flexible circuit board is 150 μm˜200 μm. 6. The electromagnet as claimed in claim 1, wherein the connecting segment is arranged inside the core and faces toward an inner wall of the core. 7. The electromagnet as claimed in claim 1, wherein the conductive lines formed on each one of the tubular structures are connected one by one in an end-to-end connection to construct a spiral shape. 8. The electromagnet as claimed in claim 7, wherein the first welding pad of one of two adjacent conductive lines formed on the same carrying segment is connected to the second welding pad of the other conductive line. 9. A flexible circuit board, comprising: a substrate including two carrying segments and a connecting segment, wherein the connecting segment connects the two carrying segments; anda circuit unit formed on the substrate and including a plurality of conductive lines and a connecting line, wherein each conductive line and the connecting line are independent lines, the conductive lines are respectively formed on the two carrying segments, and the connecting segment is formed on the connecting segment and the two carrying segments;wherein two opposite end portions of each carrying segment are configured to connect to each other to construct a tubular structure, and two opposite ends of the connecting line are configured to respectively connect to two adjacent conductive lines respectively formed on the two tubular structures, so the conductive lines and the connecting line are configured in a series connection to construct a coil,wherein the number of the conductive lines formed on each one of the carrying segments is several,wherein the two opposite end portions of each one of the carrying segments include a first end portion and an opposite second end portion, the first end portions and the second end portions of the substrate are arranged in two rows, and each one of the carrying segments is bendable to overlap the first end portion onto the second end portion thereof; each conductive line is arranged from the first end portion to the second end portion of the corresponding carrying segment, and the connecting line is arranged from the first end portion of one of the two carrying segments to the second end portion or the first end portion of the other carrying segment through the connecting segment,wherein each one of the conductive lines includes a first welding pad and a second welding pad arranged at two opposite ends thereof, the first welding pad and the second welding pad of each one of the conductive lines are respectively formed on the first end portion and the second end portion of the corresponding carrying segment; wherein each one of the conductive lines defines a virtual line passing through the first welding pad and the second welding pad thereof, and each virtual line and a longitudinal direction of the corresponding carrying segment have an acute angle, andwherein the two carrying segments and the connecting segment are formed in an H shape. 10. The flexible circuit board as claimed in claim 9, wherein each one of the conductive lines includes two metallic layers and at least one connecting portion connecting the two metallic layers, the two metallic layers of each one of the conductive lines are respectively formed on two opposite surfaces of the substrate, and the at least one connecting portion of each one of the conductive lines is embedded in the substrate; the metallic layers of each one of the conductive lines are only connected to the substrate and the corresponding connecting portion, and a thickness of the flexible circuit board is 100 μm˜150 μm.
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이 특허에 인용된 특허 (3)
Blackman David R. (Vermilion OH) Wilhelm Gregory S. (Fremont OH), Field coil insulation shield.
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