[특허]Adhesive having structural integrity and insulative properties

[미국특허] Adhesive having structural integrity and insulative properties 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	C09J-011/08 B32B-007/12 B32B-003/28 B32B-001/02 D21H-019/54 D21H-027/10 D21H-027/36 D21H-019/10 D21H-019/24 D21H-021/52 D21H-021/54 C08K-009/10 C08L-003/02
출원번호	US-0092110 (2013-11-27)
등록번호	US-9771499 (2017-09-26)
발명자 / 주소	Huang, Tianjian Sandilla, Robert Waski, Daniel Thompson, Kristina Meccia, John
출원인 / 주소	HENKEL IP & HOLDING GMBH
대리인 / 주소	Lehmann, Sun Hee
인용정보	피인용 횟수 : 0 인용 특허 : 15

초록

An adhesive composition that provides improved structural integrity and insulative properties when applied to a substrate is provided. The adhesive composition includes an emulsion-based polymer, a plurality of microspheres; and optionally, water and plasticizer.

대표청구항 ▼

1. An adhesive composition to decrease the basis weight of a substrate comprising: (a) about 50 to about 70 weight percent of an emulsion polymer selected from the group consisting of vinyl acetate-ethylene copolymer, polyvinyl acetate-polyvinyl alcohol copolymer, dextrin-stabilized polyvinyl acetate copolymer, polyvinyl acetate copolymers, and mixtures thereof;(b) about 0.1 to about 10 weight percent of a plurality of expandable microspheres that are expandable in the presence of heat and/or radiation; and(c) water; andwherein the total adhesive composition weight percent is calculated without component (c) water;wherein the emulsion polymer has a solids level of from about 40 weight percent to about 60 weight percent, based on the emulsion polymer;wherein the adhesive composition is a water-based resin emulsion. 2. The adhesive composition of claim 1, wherein said expandable microspheres comprise polymeric microspheres have an initial expansion temperature (Texp) and a maximum expansion temperature (Tmax). 3. The adhesive composition of claim 1, wherein said plurality of expandable microspheres are present in an amount of from about 0.5 weight percent to about 5 weight percent. 4. The adhesive composition of claim 1, further comprising a plasticizer and/or a preservative. 5. The adhesive composition of claim 2, wherein said expandable microspheres has a Texp of about 80° C. to about 90° C. and a (Tmax) about 120° C. to about 140° C. 6. The adhesive composition of claim 1, wherein the adhesive further comprises a crosslinker, filler, pigment, dye, stabilizer, rheology modifier, polyvinyl alcohol, humectant and mixtures thereof. 7. The adhesive composition of claim 1, wherein the adhesive further comprises an accelerator that is a multivalent water-soluble salt. 8. An expanded adhesive composition prepared by (1) forming an unexpanded adhesive, which is a water-based resin emulsion comprising: (a) about 50 to about 70 weight percent of an emulsion polymer, having a solids level of from about 40 to about 60 weight percent based on the emulsion polymer, selected from the group consisting of vinyl acetate-ethylene copolymer, polyvinyl acetate-polyvinyl alcohol copolymer, dextrin-stabilized polyvinyl acetate copolymer, polyvinyl acetate copolymers, and mixtures thereof(b) about 0.1 to about 10 weight percent of a plurality of expandable microspheres; and(c) water; andwherein the total adhesive weight percent is calculated without component (c) water;(2) expanding the expandable microspheres with heat and/or radiation; and(3) drying the water from the water-based resin emulsion;wherein the dry volume of the expanded adhesive composition is at least 400% greater than the dry volume of the unexpanded adhesive.

이 특허에 인용된 특허 (15) 인용/피인용 타임라인 분석

Skrzyniarz, Ronald J.; Brown, Lisa, Adhesive and use thereof.
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Erland Sandstrom ; Kenneth J. Shanton ; Dean Swoboda, Bulk enhanced paperboard and shaped products made therefrom.
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Swoboda, Dean P.; Swiontek, Anthony J.; Hartjes, Timothy P.; Shanton, Kenneth J.; Sandstrom, Erland R., Coated paperboards and paperboard containers having improved tactile and bulk insulation properties.
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Swiezkowski, Frank J.; Billmers, Robert L.; Mwonya, Patrick B.; Seaman, Gordon W., Corrugating adhesive.
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Egolf Scott L. (Lansdale PA) Smart Reginald T. (Horsham PA), Expandable coating composition.
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DiStefano Frank V. (Macungie PA), High performance solvent-free contact adhesive.
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Blankenship Robert Mitchell ; Finch William Christopher ; Mlynar Lubomir ; Schultz Barbara Jean, Hollow sphere organic pigment for paper or paper coatings.
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Andersen Per Just ; Hodson Simon K., Laminated articles of manufacture fashioned from sheets having a highly inorganically filled organic polymer matrix.
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Mohan,Kosaraju Krishna; Koukoulas,Alexander A.; Froass,Peter Matthew; Reed,David Verd, Low density paperboard articles.
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Georgeau Phillip Carl (Kalamazoo MI) Winebrenner Lester I. (Kalamazoo MI), Resilient organic microspheres in mastic adhesives, sealants, caulks, coating compounds and related products, and method.
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Shimokawa Wataru (Hachioji JPX) Ito Yoshiaki (Itami JPX) Kobayashi Koichi (Ibaraki JPX) Fukumori Katuaki (Kashiwa JPX) Iwase Nobukazu (Tokyo JPX), Synthetic resin emulsion and its uses.
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Andersen Per Just ; Hodson Simon K., Thermoplastic starch compositions incorporating a particulate filler component.
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Wolinski Leon E. (Cheektowaga NY) Endress Arthur R. (Hamburg NY) Teloh David W. (Depew NY), Washable and dry-cleanable raised printing on fabrics.
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Figiel, Edmund W.; Allen, Melissa; Pierce, Peter D.; Thompson, Kristina L., Water based adhesive composition with release properties.
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Philbin Michael T. ; Albrecht Norman G., Water-resistant, viscosity stable, alkaline corrugating adhesive composition.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

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[미국특허] Adhesive having structural integrity and insulative properties 원문보기