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다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
NTIS 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
DataON 바로가기다음과 같은 기능을 한번의 로그인으로 사용 할 수 있습니다.
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Kafe 바로가기국가/구분 | United States(US) Patent 등록 |
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국제특허분류(IPC7판) |
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출원번호 | US-0839557 (2015-08-28) |
등록번호 | US-9798072 (2017-10-24) |
발명자 / 주소 |
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출원인 / 주소 |
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대리인 / 주소 |
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인용정보 | 피인용 횟수 : 0 인용 특허 : 438 |
According to one aspect, an optical waveguide comprises a waveguide body exhibiting total internal reflection, a substrate, and a plurality of light extraction features disposed on a surface of the substrate. The light extraction features are non-adhesively bonded to the waveguide body or may be dis
According to one aspect, an optical waveguide comprises a waveguide body exhibiting total internal reflection, a substrate, and a plurality of light extraction features disposed on a surface of the substrate. The light extraction features are non-adhesively bonded to the waveguide body or may be disposed on opposing sides of the substrate. A method of forming an optical element is also disclosed.
1. An optical element, comprising: an optically transparent substrate;first and second pluralities of light extraction features of optically transparent material that exhibit total internal reflection respectively disposed on opposing first and second sides of the substrate; anda waveguide body wher
1. An optical element, comprising: an optically transparent substrate;first and second pluralities of light extraction features of optically transparent material that exhibit total internal reflection respectively disposed on opposing first and second sides of the substrate; anda waveguide body wherein the light extraction features of one of the first and second pluralities secure the substrate to the waveguide body;wherein the first and second pluralities of light extraction features are non-adhesively bonded to the optically transparent substrate;wherein the light extraction features of one of the first and second pluralities are non-adhesively bonded to the waveguide body; andwherein the optical element comprises non-adhesive bonds on at least three surfaces thereof. 2. The optical element of claim 1, wherein the light extracting features are disposed in one of a non-random arrangement and a random arrangement on each of the opposing sides of the substrate. 3. The optical element of claim 1, wherein the light extraction features are bonded to the sides of the substrate using thermal compression. 4. The optical element of claim 1, wherein the light extraction features are hot embossed to the sides of the substrate. 5. The optical element of claim 1, wherein the light extraction features are formed on the sides of the substrate using a process comprising the steps of producing a sub-master element comprising features that are larger than microfeatures disposed on a master and reducing sizes of the features to obtain the master comprising the microfeatures. 6. The optical element of claim 5, wherein the sizes of the features are reduced by exposing the sub-master element to heat. 7. The optical element of claim 6, wherein the sizes of the features are reduced by electroforming the sub-master. 8. The optical element of claim 1, wherein a bonding chuck at least partially surrounds a portion of the light extraction features during securing of the optical element to a waveguide body. 9. The optical element of claim 1, wherein ends of a first portion of light extraction features are initially disposed on a surface of a further substrate and the further substrate is removed from the ends of the first portion of light extraction features after a second portion of light extraction features are bonded to the waveguide body.
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