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Semiconductor package with conductive clip 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/12
  • H01L-023/00
  • H01L-023/13
  • H01L-023/492
  • H01L-023/498
  • H01L-025/16
  • H01L-023/04
  • H01L-023/06
  • H01L-023/14
  • H01L-023/495
출원번호 US-0190466 (2016-06-23)
등록번호 US-9799623 (2017-10-24)
발명자 / 주소
  • Standing, Martin
출원인 / 주소
  • Infineon Technologies Americas Corp.
대리인 / 주소
    Shumaker & Sieffert, P.A.
인용정보 피인용 횟수 : 0  인용 특허 : 57

초록

A semiconductor package that includes a conductive can, a power semiconductor device electrically and mechanically attached to the inside surface of the can, and an IC semiconductor device copackaged with the power semiconductor device inside the can.

대표청구항 ▼

1. A semiconductor package comprising: a conductive clip;a dielectric body mounted to said conductive clip;an integrated circuit mounted to said dielectric body;at least one output terminal electrically connected to said integrated circuit, and said dielectric body electrically insulating said at le

이 특허에 인용된 특허 (57)

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