초록 ▼

A composite module includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention include

A composite module includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate (26), a second substrate (28) that is so disposed as opposed to the other principal surface (48b) of the first substrate (26), and a housing (12) that has accommodation sections (38) and (54) for accommodating the first substrate (26) and the second substrate (28). Further, substrate-support projections for supporting one principal surface and the other principal surface of each of the first substrate (26) and the second substrate (28), are formed on inner wall surfaces (40) and (56) of the accommodation sections (38) and (54) in the housing (12).

대표청구항 ▼

1. A composite module comprising: a first substrate having one principal surface and another principal surface;a second substrate having one principal surface and another principal surface and disposed as opposed to the another principal surface of the first substrate;an electronic component device

1. A composite module comprising: a first substrate having one principal surface and another principal surface;a second substrate having one principal surface and another principal surface and disposed as opposed to the another principal surface of the first substrate;an electronic component device disposed on the one principal surface of the second substrate;a heat dispersion member disposed on the another principal surface of the first substrate and adjacent to the electronic component device;an external connector mounted on the one principal surface of the first substrate, wherein the first substrate is thicker in dimension than the second substrate, and wherein the external connector is aligned with and located vertically above the heat dissipation member; anda housing having accommodation sections for accommodating the first substrate and the second substrate,wherein the accommodation sections comprise substrate-support projections each configured to support the one principal surface and the another principal surface of the first substrate and the one principal surface and the another principal surface of the second substrate, and each of the substrate-support projections is formed on an inner wall surface of the accommodation section in the housing. 2. The composite module according to claim 1, wherein positions of one end of each of the substrate-support projections are different from one another when viewing the first and second substrates from above. 3. The composite module according to claim 1, wherein the second substrate comprises recesses, and each of the recesses is formed in an edge portion of the second substrate and corresponds to each of the substrate-support projections configured to support the first substrate. 4. The composite module according to claim 1, wherein the housing has a first housing and a second housing, the first housing is disposed on a side of the one principal surface of the first substrate, the second housing is disposed on a side of the other principal surface of the second substrate, the substrate-support projections formed in the first housing support the one principal surface of the second substrate, and the substrate-support projections formed in the second housing support the other principal surface of the first substrate. 5. The composite module according to claim 2, wherein the second substrate comprises recesses, and each of the recesses is formed in an edge portion of the second substrate and corresponds to each of the substrate-support projections configured to support the first substrate. 6. The composite module according to claim 2, wherein the housing has a first housing and a second housing, the first housing is disposed on a side of the one principal surface of the first substrate, the second housing is disposed on a side of the other principal surface of the second substrate, the substrate-support projections formed in the first housing support the one principal surface of the second substrate, and the substrate-support projections formed in the second housing support the other principal surface of the first substrate. 7. The composite module according to claim 3, wherein the housing has a first housing and a second housing, the first housing is disposed on a side of the one principal surface of the first substrate, the second housing is disposed on a side of the other principal surface of the second substrate, the substrate-support projections formed in the first housing support the one principal surface of the second substrate, and the substrate-support projections formed in the second housing support the other principal surface of the first substrate.