Housing for an electronic device internal walls
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-003/30
F24F-011/00
G05D-023/32
G01K-007/42
H05K-001/11
H01R-004/34
H05K-003/32
H05K-007/14
H02H-009/04
H02H-009/00
H05K-005/00
H05K-013/00
G02F-001/1333
H05K-009/00
H02G-003/14
G05D-023/19
출원번호
US-0214462
(2014-03-14)
등록번호
US-9803882
(2017-10-31)
발명자
/ 주소
Khoury, Tarik
Adamik, Petr
Lentz, Tracy
Mcpherson, Steven J.
Aljabari, Mohammad
Kalla, Arnie
출원인 / 주소
Honeywell International Inc.
대리인 / 주소
Seager, Tufte & Wickhem, LLP
인용정보
피인용 횟수 :
0인용 특허 :
16
초록▼
An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend
An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend inwardly toward the printed circuit board. In some cases, the inward extending walls, the outer shell, and the printed circuit board define two or more internal pockets within the housing. The pockets may, in some cases, separate one region of the printed circuit board from another region of the printed circuit board. In some instances, the one or more inward extending walls may be configured to provide support to a back side of the printed circuit board, which may be particularly useful when a touch screen display is mounted on a front side of the printed circuit board.
대표청구항▼
1. An electronic assembly, comprising: a housing including a front cover and a back cover;a printed circuit board that is at least substantially enclosed between the front cover and the back cover, the printed circuit board having one or more electrical components that generate heat during operation
1. An electronic assembly, comprising: a housing including a front cover and a back cover;a printed circuit board that is at least substantially enclosed between the front cover and the back cover, the printed circuit board having one or more electrical components that generate heat during operation;a first temperature sensor secured to the printed circuit board;wherein the back cover has an outer shell, and one or more inward extending walls that extend from the outer shell towards the printed circuit board;wherein the inward extending walls, the outer shell and the printed circuit board are configured to define two or more pockets within the housing and the first temperature sensor is located in one of the two or more pockets; andwherein the one or more electrical components that generate heat cause the air in another of the two or more pockets to be warmer than air in the one of the two or more pockets in which the first temperature sensor is located in. 2. The electronic assembly of claim 1, wherein one or more of the inward extending walls define a first pocket and a second pocket, wherein during operation of the electronic assembly, the one or more electrical components that generate heat cause air in the first pocket to be warmer than air in the second pocket. 3. The electronic assembly of claim 1, wherein one or more of the inward extending walls define a first pocket and a second pocket, and wherein the printed circuit board and the first temperature sensor are arranged to locate the first temperature sensor in the first pocket, and a second temperature sensor is secured to the printed circuit board and arranged to be located in the second pocket. 4. The electronic assembly of claim 2, wherein the printed circuit board comprises a humidity sensor in one of the first pocket and second pocket. 5. The electronic assembly of claim 2, wherein the one or more of the inward extending walls also define a third pocket, and the printed circuit board comprises a humidity sensor in the third pocket. 6. The electronic assembly of claim 5, wherein the third pocket includes an air vent through the housing to an external environment. 7. The electronic assembly of claim 6, wherein the first pocket and the second pocket are free from air vents through the housing. 8. The electronic assembly of claim 1, wherein at least some of the inward extending walls engage the printed circuit board and provide support to the printed circuit board. 9. The electronic assembly of claim 1, wherein the outer shell includes an aperture through the back cover, and at least some of the inward extending walls form a side wall of the aperture that extends substantially to the printed circuit board, wherein the aperture provides access to a first region of the printed circuit board. 10. The electronic assembly of claim 9, wherein the first region of the printed circuit board, which is accessible via the aperture, is substantially free from ESD sensitive electrical components. 11. The electronic assembly of claim 9, wherein the first region of the printed circuit board, which is accessible via the aperture, is substantially free from electronic components. 12. The electronic assembly of claim 9, wherein the first region of the printed circuit board, which is accessible via the aperture, is substantially free from electronic components other than one or more connectors. 13. The electronic assembly of claim 12, wherein the one or more connectors comprise a battery connector for accepting and connecting a battery. 14. The electronic assembly of claim 12, wherein the one or more connectors comprise a pin connector for connecting the printed circuit board of the electronic assembly to a wall plate that has a mating connector. 15. The electronic assembly of claim 1, wherein the back cover includes an alignment member, and the printed circuit board includes an opening that receives the alignment member. 16. An electronic assembly, comprising: a housing including a front cover and a back cover, wherein the front cover has an opening;a printed circuit board that is at least substantially enclosed between the front cover and the back cover, wherein at least part of the printed circuit board extends behind and overlaps with the opening in the front cover from a vantage point perpendicular to the printed circuit board, and wherein the printed circuit board has one or more electrical components that generate heat during operation;a first temperature sensor secured to the printed circuit board;a touch screen display mounted to a first side of the printed circuit board and viewable through the opening in the front cover, the touch screen display configured to receive an input from a user in the form of a touch, and to transfer a corresponding touch force to the printed circuit board;the back cover has an outer shell, and one or more inward extending walls that extend from the outer shell towards a second side of the printed circuit board, wherein at least some of the inward extending walls engage the second side of the printed circuit board in the part of the printed circuit board that extends behind and overlaps with the opening in the front cover to provide support to the printed circuit board and thus the touch screen display against the touch force;wherein the inward extending walls, the outer shell and the printed circuit board are configured to define a plurality of pockets within the housing, wherein the first temperature sensor is located in one of the plurality of pockets; andwherein the one or more electrical components that generate heat cause the air in another of the plurality of pockets to be warmer than air in the one of the plurality of pockets in which the first temperature sensor is located in. 17. The electronic assembly of claim 16, wherein the printed circuit board includes at least two different sensor components that are each mounted in a different one of the plurality of pockets. 18. The electronic assembly of claim 17, wherein the at least two different sensor components include a first temperature sensor component, a second temperature sensor component and a humidity sensor component.
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이 특허에 인용된 특허 (16)
Rhodes, William D.; Mueller, Carl J.; Heller, John J., Apparatus and method for isolating a temperature sensing device in a thermostat.
McHugh Thomas K. (127 Hewett Rd. Wyncote PA 19095) Steadman ; Jr. Arthur L. (4727 Melon St. Philadelphia PA 19139), Setpoint limiting for thermostat, with tamper resistant temperature comparison.
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