Controlled release, wood preserving composition for treating in-service utility poles, posts, pilings, cross-ties and other wooden structures
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A01N-059/20
A01N-025/04
C09D-005/14
C09D-007/00
A01N-059/14
A01N-059/10
A01N-043/653
A01N-053/00
B27K-003/16
B27K-003/22
B27K-003/30
B27K-003/32
B27K-003/12
출원번호
US-0420959
(2017-01-31)
등록번호
US-9808015
(2017-11-07)
발명자
/ 주소
Herdman, Douglas J.
Zhang, Jun
Pope, Thomas
Marquardt, Randy C.
출원인 / 주소
OSMOSE UTILITIES SERVICES, INC.
대리인 / 주소
Troutman Sanders LLP
인용정보
피인용 횟수 :
1인용 특허 :
16
초록▼
Disclosed herein are compositions comprising a dispersion of solid particles of a substantially insoluble copper compound; a boron-containing compound, a fluoride-containing compound, or a combination thereof; wherein at least 20% of the particles of the composition comprise particles having particl
Disclosed herein are compositions comprising a dispersion of solid particles of a substantially insoluble copper compound; a boron-containing compound, a fluoride-containing compound, or a combination thereof; wherein at least 20% of the particles of the composition comprise particles having particle size greater than 25 microns. Also disclosed herein are methods of making and using the same.
대표청구항▼
1. A composition comprising: a dispersion of solid particles of a substantially insoluble copper compound;a boron-containing compound, a fluoride-containing compound, or a combination thereof; andwherein at least 20% of the particles of the composition comprise particles having particle size greater
1. A composition comprising: a dispersion of solid particles of a substantially insoluble copper compound;a boron-containing compound, a fluoride-containing compound, or a combination thereof; andwherein at least 20% of the particles of the composition comprise particles having particle size greater than 25 microns. 2. The composition of claim 1, wherein the dispersion of solid particles of the substantially insoluble copper compound is in an amount from 0.001% to 10% by weight of the composition. 3. The composition of claim 1, wherein less than 20% of the particles of the composition comprise particles having particle size greater than 100 microns. 4. The composition of claim 1, wherein the composition contains from 1% to 5% copper atoms by weight of the composition. 5. The composition of claim 1, wherein the copper compound comprises copper hydroxide, cupric oxide, cuprous oxide, copper carbonate, basic copper carbonate, copper oxychloride, copper dimethyldithiocarbamate, copper omadine, copper borate, or a combination thereof. 6. The composition of claim 1, wherein the boron-containing compound comprises a boric acid, a metal borate, a sodium borate, a potassium borate, or a combination thereof. 7. A method for remedial treatment of wood, comprising applying the composition of claim 1 to a wooden structure. 8. The method of claim 7, wherein the wooden structure is an in-service wood product. 9. The method of claim 7, wherein the composition is applied onto or into the wooden structure. 10. The method of claim 8, wherein the in-service wood product is a utility pole, a railroad tie, or a wooden bridge. 11. A method comprising blending particles of a substantially insoluble copper compound; and a boron-containing compound, a fluoride-containing compound, or a combination thereof; to produce a composition, wherein at least 20% of the particles of the composition comprise particles having particle size greater than 25 microns. 12. The method of claim 11, wherein at least 30% of the particles of the composition comprise particles having particle size greater than 25 microns. 13. The method of claim 11, wherein the composition contains from 1% to 5% copper atoms by weight of the composition. 14. The method of claim 11, wherein the copper compound comprises copper hydroxide, cupric oxide, cuprous oxide, copper carbonate, basic copper carbonate, copper oxychloride, copper dimethyldithiocarbamate, copper omadine, copper borate, or a combination thereof. 15. The method of claim 11, wherein the boron-containing compound comprises a boric acid, a metal borate, a sodium borate, a potassium borate, or a combination thereof. 16. A method of delivering a fungitoxic amount of copper ion to an interior portion of a wooden product comprising: applying a composition comprising a dispersion of solid particles of a substantially insoluble copper compound; and a boron-containing compound, a fluoride-containing compound, or a combination thereof;wherein at least 20% of the particles of the composition comprise particles having particle size greater than 25 microns; andwherein applying the composition to the wooden structure produces penetration of copper ions into an interior portion of the wooden structure to a fungicidally effective level. 17. The method of claim 16, wherein at least 30% of the particles of the composition comprise particles having particle size greater than 25 microns. 18. The method of claim 16, wherein the composition contains from 1% to 5% copper atoms by weight of the composition. 19. The method of claim 16, wherein the copper compound comprises copper hydroxide, cupric oxide, cuprous oxide, copper carbonate, basic copper carbonate, copper oxychloride, copper dimethyldithiocarbamate, copper omadine, copper borate, or a combination thereof. 20. The method of claim 16, wherein the boron-containing compound comprises a boric acid, a metal borate, a sodium borate, a potassium borate, or a combination thereof.
Zhang, Jun; Herdman, Douglas J.; Ziobro, Richard J., Wood preserving composition for treatment of in-service poles, posts, piling, cross-ties and other wooded structures.
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