Feedthrough with integrated brazeless ferrule
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
A61N-001/375
C23C-024/08
C23C-004/134
출원번호
US-0225321
(2016-08-01)
등록번호
US-9814891
(2017-11-14)
발명자
/ 주소
Markham, Jacob
Hausch, Ulrich
출원인 / 주소
HERAEUS DUETSCHLAND GMBH & CO. KG
대리인 / 주소
Dicke, Billig & Czaja, PLLC
인용정보
피인용 횟수 :
0인용 특허 :
114
초록▼
One aspect provides a feedthrough device for an implantable medical device. The feedthrough includes a ferrule having a metal that is configured to be welded to a case of the implantable device. An insulator is substantially surrounded by the ferrule and shares an interface therewith, the insulator
One aspect provides a feedthrough device for an implantable medical device. The feedthrough includes a ferrule having a metal that is configured to be welded to a case of the implantable device. An insulator is substantially surrounded by the ferrule and shares an interface therewith, the insulator being a glass or ceramic material. Conductive elements are formed through the insulator providing an electrically conductive path through the insulator. There is no braze, solder, or weld joint at the interface between the ferrule and the insulator and that there is no braze or solder at interfaces between the insulator and the conductive elements.
대표청구항▼
1. A feedthrough for a medical implantable device comprising: a ferrule comprising a metal that is configured to be welded to a case of the implantable device;an insulator substantially surrounded by the ferrule and sharing an interface therewith, the insulator comprising a glass or ceramic material
1. A feedthrough for a medical implantable device comprising: a ferrule comprising a metal that is configured to be welded to a case of the implantable device;an insulator substantially surrounded by the ferrule and sharing an interface therewith, the insulator comprising a glass or ceramic material; conductive elements formed through the insulator providing an electrically conductive path through the insulator; characterized in that there is no braze, solder, or weld joint at the interface between the ferrule and the insulator and that there is no braze or solder at interfaces between the insulator and the conductive elements. 2. The feedthrough of claim 1, wherein the metal forming the ferrule comprises one of a group consisting of niobium, titanium, titanium alloy, tantalum, tungsten, molybdenum, cobalt, zirconium, chromium, platinum, and alloy combinations thereof. 3. The feedthrough of claim 1, wherein the insulator comprises aluminum oxide and the conductive elements comprise a cermet. 4. The feedthrough of claim 1, wherein the ferrule has a thickness in a range from 200 micrometers to 800 micrometers. 5. The feedthrough of claim 1, further comprising a metallized layer at the interface between the ferrule and the insulator. 6. The feedthrough of claim 5, wherein the metallized layer has a thickness in a range from 0.2 micrometers to 10 micrometers. 7. The feedthrough of claim 6, wherein the metallized layer is of a metal comprising one selected from a group consisting of titanium, niobium, platinum, palladium, and gold. 8. A feedthrough for a medical implantable device comprising: a ferrule comprising a metal having a thickness in a range from 200 to 800 micrometers that is configured to be welded to a case of the implantable device;an insulator substantially surrounded by the ferrule and sharing an interface therewith, the insulator comprising a glass or ceramic material;conductive elements formed through the insulator providing an electrically conductive path through the insulator;characterized in that there is no braze, solder, or weld joint at the interface between the ferrule and the insulator. 9. The feedthrough of claim 8, wherein the metal forming the ferrule comprises one of a group consisting of niobium, titanium, titanium alloy, tantalum, tungsten, molybdenum, cobalt, zirconium, chromium, platinum, and alloy combinations thereof. 10. The feedthrough of claim 8, wherein the insulator comprises aluminum oxide and the conductive elements comprise a cermet. 11. The feedthrough of claim 8, further characterized in that there is no braze or solder at interfaces between the insulator and the conductive elements. 12. The feedthrough of claim 8, further comprising a metallized layer at the interface between the ferrule and the insulator. 13. The feedthrough of claim 12, wherein the metallized layer has a thickness in a range from 0.2 micrometers to 10 micrometers. 14. The feedthrough of claim 13, wherein the metallized layer is of a metal comprising one selected from a group consisting of titanium, niobium, platinum, palladium, and gold.
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