[특허]Method of forming an electrical connector

Method of forming an electrical connector 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01R-013/04 H01R-013/6461 H01R-013/6473 H01R-013/6587
출원번호	US-0445957 (2014-07-29)
등록번호	US-9825391 (2017-11-21)
발명자 / 주소	Cohen, Thomas S. Ren, Huilin Cartier, Jr., Marc B. Do, Trent K. Gailus, Mark W.
출원인 / 주소	Amphenol Corporation
대리인 / 주소	Blank Rome LLP
인용정보	피인용 횟수 : 0 인용 특허 : 29

초록 ▼

A broadside coupled connector assembly has two sets of conductors, each separate planes. By providing the same path lengths, there is no skew between the conductors of the differential pair and the impedance of those conductors is identical. The conductor sets are formed by embedding the first set of conductors in an insulated housing having a top surface with channels. The second set of conductors is placed within the channels so that no air gaps form between the two sets of conductors. A second insulated housing is filled over the second set of conductors and into the channels to form a completed wafer. The ends of the conductors are received in a blade housing. Differential and ground pairs of blades have one end that extends through the bottom of the housing having a small footprint. An opposite end of the pairs of blades diverge to connect with the wafers. The ends of the first and second sets of conductors and the blades are jogged in both an x- and y-coordinate to reduce crosstalk and improve electrical performance.

대표청구항 ▼

1. A method of forming an electrical connector, said method comprising: providing a first plurality of conductors, each having a first end and a second end;forming a first housing around the first plurality of conductors with the first and second ends extending outside the first housing, the first housing having a top surface with channels formed in the top surface;providing a second plurality of conductors;placing the second plurality of conductors on the first housing so that each of the second plurality of conductors is received in one of the channels; and,forming a second housing around the second plurality of conductors and within the channels. 2. The method of claim 1, wherein the first plurality of conductors is connected to a first lead frame and the second plurality of conductors is connected to a second lead frame, the method further comprising separating the first and second plurality of conductors from the first and second lead frames after forming the second housing. 3. The method of claim 1, wherein the steps of forming the first and second housings comprise forming the first and second insulated housings by injection molding. 4. The method of claim 1, wherein said first and second housings are made of an electrically insulative material. 5. The method of claim 1, wherein said first and second housings are at least partially made of a lossy material. 6. The method of claim 1, wherein each of said second plurality of conductors are positioned at a bottom of the channels. 7. The method of claim 6, wherein there is no air gap between the bottom of the channels and the second plurality of conductors. 8. The method of claim 1, wherein the channels define a distance between said first plurality of conductors and said second plurality of conductors, and a characteristic impedance between a signal conductor of said first plurality of conductors and a signal conductor of said second plurality of conductors based on the distance. 9. The method of claim 1, wherein said first and second pluralities of conductors each comprise at least one ground conductor and at least one signal conductor, the at least one ground conductor of said first plurality of conductors being aligned with the at least one ground conductor of said second plurality of conductors to form at least one ground pair, and the at least one signal conductor of said first plurality of conductors being aligned with the at least one signal conductor of said second plurality of conductors to form at least one differential signal pair. 10. The method of claim 1, wherein said first and second plurality of conductors each have a tail end, wherein the tail ends extend beyond said first and second housings.

이 특허에 인용된 특허 (29)

Davis, Wayne Samuel; Whiteman, Jr., Robert Neil; Minnick, Timothy R., Connector assembly.
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Mickievicz Scott Keith (Denver PA), Connector assembly with shielded modules.
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Preputnick George ; Fedder James Lee ; Mickievicz Scott Keith ; Whyne Richard Nicholas, Connector assembly with shielded modules and method of making same.
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Allan L Astbury, Jr. ; Thomas S. Cohen, Connector molding method and shielded waferized connector made therefrom.
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Cohen,Thomas S.; Gallus,Mark W.; Dunham,John R., Differential electrical connector assembly.
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Stokoe Philip T., Differential signal electrical connector.
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Cohen, Thomas S.; Gailus, Mark W.; Stokoe, Philip T., Differential signal electrical connectors.
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Cohen, Thomas S.; Gailus, Mark W.; Stokoe, Philip T., Differential signal electrical connectors.
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McNamara, David M.; Kiani, Sepehr; Howard, William E.; Stokoe, Philip; Marvin, Edward Gerald, Electrical connector.
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Scott Kline, Richard; Andrews, Howard Wallace, Electrical connector and assembly with aligned contacting arms.
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Cohen, Thomas S.; Kirk, Brian; Chan, Jason E.; Pfahnl, Andreas C.; Cartier, Jr., Marc B.; Manter, David, Electrical connector lead frame.
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Davis, Wayne Samuel; Whiteman, Jr., Robert Neil, Electrical connector system.
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Glover, Douglas W.; Wickes, Evan C., Electrical connector system.
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Cohen, Thomas S.; Kirk, Brian, Electrical connector with complementary conductive elements.
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Cohen, Thomas S.; Richard, Robert A., Electrical connector with conductive plastic features.
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Amleshi, Peerouz; Laurx, John, High speed connector with spoked mounting frame.
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Cohen,Thomas S.; Kirk,Brian; Cartier, Jr.,Marc B., High speed high density electrical connector.
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Cohen,Thomas S.; Kirk,Brian; Cartier, Jr.,Marc B., High speed, high density electrical connector.
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Gailus,Mark W., High speed, high density electrical connector.
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Stokoe, Philip T.; Payne, Jason J.; Ren, Huilin, High speed, high density electrical connector.
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Stokoe, Philip T.; Bacon, Neil J.; Payne, Jason J.; Ren, Huilin, High speed, high density electrical connector and connector assembly.
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Kirk, Brian; Cohen, Thomas S., High speed, high density electrical connector with selective positioning of lossy regions.
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Laurx, John C.; Amleshi, Peerouz; Dunham, David E., High-density, robust connector.
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Laurx,John C.; Bixler,Craig A.; Regnier,Kent E.; Dunham,David E.; O'Malley,Brian P., High-density, robust connector.
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Laurx,John C.; Dunham,David E.; Humbert,Gary, High-density, robust connector with castellations.
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Laurx, John C.; Dunham, David E.; Amleshi, Peerouz, High-density, robust connector with dielectric insert.
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Gailus, Mark W., Interconnection system with improved high frequency performance.
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Provencher, Daniel B; Cohen, Thomas S.; Stokoe, Philip T., Matrix connector with integrated power contacts.
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Cohen,Thomas S.; Cartier, Jr.,Marc B.; Gallus,Mark W., Midplane especially applicable to an orthogonal architecture electronic system.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
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Method of forming an electrical connector 원문보기

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Method of forming an electrical connector 원문보기

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