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Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending i

Components and methods of making the same are disclosed herein. In one embodiment, a method of forming a component comprises forming metal anchoring elements at a first surface of a support element having first and second oppositely facing surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has a downwardly facing overhang surface; and then forming posts having first ends proximate the first surface and second ends disposed above the respective first ends and above the first surface, wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the respective anchoring element and extends downwardly therefrom, and the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements.

대표청구항 ▼

1. A method of forming a component, comprising: forming metal anchoring elements at a first surface of a support element having oppositely facing first and second surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each ancho

1. A method of forming a component, comprising: forming metal anchoring elements at a first surface of a support element having oppositely facing first and second surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has an overhang surface, the metal anchoring elements comprising metal elements that are each supported by a structure, each metal element having an upper surface facing away from the first surface and a lower surface remote from the upper surface, wherein a portion of the lower surface, which extends beyond the structure which supports each metal element respectively, defines the overhang surface;then forming posts in corresponding openings of a mold overlying the anchoring elements respectively, the posts having first ends proximate the first surface and second ends disposed above the first ends respectively and above the first surface,wherein a laterally extending portion of each post contacts at least a first area of the overhang surface of the anchoring element respectively; andremoving the mold to expose the posts above the first anchoring elements, wherein each said post projects above an exterior surface of the component and is configured for insertion into and electrical connection with a corresponding electrically conductive socket at an exterior surface of a separate second component which surface faces the exterior surface of the component, wherein the component and the separate second component are each one of a microelectronic element, package substrate, interposer or circuit panel, andwherein the overhang surface of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements, the axial and shear forces including those caused by removal of the mold. 2. The method of claim 1, wherein the structure is associated with at least a portion of the support element. 3. The method of claim 1, wherein the posts have heights and widths, the height of each said post being 1.5 times the width of each said post respectively. 4. The method of claim 1, wherein the posts include polymer elements having electrically conductive coatings at exterior surfaces thereof. 5. The method of claim 4, wherein forming the posts further comprises: injecting polymer materials into the mold overlying the anchoring elements to form the posts. 6. The method of claim 1, wherein the metal element defines an opening and the respective structure at least partially defines a cavity aligned with the opening, and the overhang surface extends beyond a wall of the cavity. 7. The method of claim 1, wherein the overhang surface extends beyond a periphery of the respective structure. 8. The method of claim 1, wherein forming the anchoring elements further comprises: forming the metal elements overlying the structures, respectively; andundercutting material of the structures to form the overhang surfaces of the metal elements. 9. The method of claim 8, wherein forming the anchoring elements further comprises: patterning openings in the metal elements,wherein the undercutting of the material of the structures is formed by processing applied through the openings. 10. The method of claim 9, wherein patterning openings in the metal elements further comprises: forming photoresist layers overlying portions of upper surfaces of the structures;forming the metal elements overlying remaining portions of the upper surfaces of the structures; andremoving the photoresist layers to expose the openings in the metal elements. 11. The method as claimed in claim 1, further comprising assembling the component with the second component such that the posts are inserted into the corresponding sockets of the second component, thereby electrically coupling the posts with the sockets of the second component. 12. A method of forming a component, comprising: forming metal anchoring elements at a first surface of a support element having oppositely facing first and second surfaces, the support element having a thickness extending in a first direction between the first and second surfaces, wherein each anchoring element has one or more recesses extending towards the second surface of the first and second surfaces of the support element, the metal anchoring elements comprising metal elements that are each supported by a structure, each metal element having an upper surface facing away from the first surface and a lower surface remote from the upper surface, wherein a portion of the lower surface extends beyond the structure which supports each metal element respectively;then forming posts in corresponding openings of a mold overlying the anchoring elements respectively, the posts having first ends proximate the first surface and second ends disposed above the first ends respectively, and above the first surface,wherein an axially extending portion of each post contacts at least a portion of the one or more recesses of the anchoring element respectively; andremoving the mold to expose the posts above the first anchoring elements, wherein each said post projects above an exterior surface of the component and is configured to electrically connect the component with a corresponding electrically conductive element at an exterior surface of a separate second component which faces the exterior surface of the component wherein the component and the separate second component are each one of a microelectronic element, interposer or circuit panel, and wherein the one or more recesses of the anchoring element resists axial and shear forces applied to the posts at positions above the anchoring elements, the axial and shear forces including those caused by removal of the mold. 13. The method as claimed in claim 1, wherein each said post has a height of 50 to 500 microns. 14. The method as claimed in claim 12, wherein each said post has a height of 50 to 500 microns. 15. The method as claimed in claim 12, further comprising assembling the component with the second component such that the posts are inserted into the corresponding sockets of the second component, thereby electrically coupling the posts with the sockets of the second component.