Planar heat pipe with architected core and vapor tolerant arterial wick
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F28D-015/04
B23P-015/26
출원번호
US-0211839
(2014-03-14)
등록번호
US-9835383
(2017-12-05)
발명자
/ 주소
Roper, Christopher S.
Cumberland, Robert W.
출원인 / 주소
HRL Laboratories, LLC
대리인 / 주소
Lewis Roca Rothgerber Christie LLP
인용정보
피인용 횟수 :
0인용 특허 :
14
초록▼
A planar heat pipe for transferring heat between a higher temperature region and a lower temperature region includes a bottom facesheet, a top facesheet, a vapor-venting arterial wick between the bottom facesheet and the top facesheet and including a high permeability layer and a high capillary pres
A planar heat pipe for transferring heat between a higher temperature region and a lower temperature region includes a bottom facesheet, a top facesheet, a vapor-venting arterial wick between the bottom facesheet and the top facesheet and including a high permeability layer and a high capillary pressure layer each having pores such that an average pore hydraulic diameter in the high permeability layer is greater than an average pore diameter in the high capillary pressure layer. The pipe also includes an architected mechanical core structure between the arterial wick and the top facesheet, and a working fluid between the bottom facesheet and the top facesheet. The architected mechanical core structure may have a vapor region, and the vapor-venting arterial wick may have a liquid region.
대표청구항▼
1. A planar heat pipe for transferring heat between a higher temperature region and a lower temperature region, the heat pipe comprising: a bottom facesheet;a top facesheet;a hierarchical vapor venting arterial wick between the bottom facesheet and the top facesheet, the hierarchical vapor venting a
1. A planar heat pipe for transferring heat between a higher temperature region and a lower temperature region, the heat pipe comprising: a bottom facesheet;a top facesheet;a hierarchical vapor venting arterial wick between the bottom facesheet and the top facesheet, the hierarchical vapor venting arterial wick comprising a permeability layer comprising at least one permeability sub-layer and a capillary pressure layer comprising at least two capillary pressure sub-layers, each sub-layer comprising pores;a liquid region defined by the permeability layer; anda vapor region, wherein the vapor region and the liquid region are on opposite sides of the capillary pressure layer, wherein one of the at least two capillary pressure sub-layers is a middle capillary pressure sub-layer and another one of the at least two capillary pressure sub-layers is a top capillary pressure sub-layer, wherein an average pore diameter in the permeability sub-layer is greater than an average pore diameter in each of the two capillary pressure sub-layers,wherein an average pore diameter in the middle capillary pressure sub-layer is greater than a largest pore diameter in the top capillary pressure sub-layer, andwherein, when liquid is in the liquid region, the permeability layer is configured to permit the liquid to flow laterally through the permeability layer and the hierarchical vapor venting arterial wick is configured to vent vapor bubbles forming in the liquid region of the heat pipe first through the permeability layer to the middle capillary pressure sub-layer, and then from the middle capillary pressure sub-layer to the top capillary pressure sub-layer such that the vapor bubbles are vented through progressively smaller pores from the liquid region to the vapor region. 2. The planar heat pipe of claim 1, further comprising an architected mechanical core structure between the hierarchical vapor venting arterial wick and the top facesheet, and a working fluid between the bottom facesheet and the top facesheet, wherein the bottom facesheet comprises mechanical posts spaced at intervals corresponding with the pores in the permeability layer such that the spacing between posts defines a pore diameter in the permeability layer and a height of the posts defines a thickness,the permeability layer is below the capillary pressure layer in the liquid region of the heat pipe, andthe architected mechanical core structure comprises the vapor region, and the hierarchical vapor venting arterial wick comprises the liquid region. 3. The planar heat pipe of claim 1, wherein a pore thickness and a pore diameter of a pore of the pores in the top capillary pressure sub-layer and the middle capillary pressure sub-layer, along with a height of the permeability layer, a contact angle of a working fluid in the heat pipe, and a surface tension of the working fluid satisfy inequalities, Dp,1≥τ1h1cosθ(2-τ1cosθh1), Dp,2≥τ2h2,effcosθ(2-τ2cosθh2,eff), and h2,eff=h2+Dp,22(secθ-tanθ)wherein Dp,2 is the pore diameter of the top capillary pressure sub-layer, τ2 is the pore thickness of the pore in the top capillary pressure sub-layer, h2 is a distance between the top capillary pressure sub-layer and the middle capillary pressure sub-layer, Dp,1 is the pore diameter of the middle capillary pressure sub-layer, τ1 is a distance between the bottom of the middle capillary pressure sub-layer and a top of the top capillary pressure sub-layer, h1 is a height of the permeability sub-layer, and θ is the contact angle of the working fluid in a liquid phase to a solid material of the top capillary pressure sub-layer. 4. The planar heat pipe of claim 1, wherein a pore thickness and a pore diameter of a pore of the pores in the top capillary pressure sub-layer and the middle capillary pressure sub-layer, along with a height of the permeability sub-layer, a contact angle of a working fluid in the heat pipe, and a surface tension of the working fluid satisfy a set of inequalities, 1-1-D_p,12+[1-1-(S1_D_p,1)2]/S1_≥2δ1_,wherein Dp,1=Dp,1 cos ψ/Da,1,S1=(Pvs−Pl)/(4σ cos ψ)/Da,1), andδ1=δ1 cos ψ/Da,1, and wherein1-1-D_p,22+[1-1-(S2__D_p,2)2]/S2_≥2δ2_,Dp,2=Dp,2 cos ψ/Da,2,S2=(Pvs−Pl)/(4σ cos ψ/Da,2),δ2=δ2 cos ψ/Da,2, and Da2,eff=Da2+Dp,22(secψ-tanψ),wherein Dp,1 is the pore diameter of the pore in the middle capillary pressure sub-layer, Da,1 is a is a height of the permeability sub-layer, ψ is the contact angle of the working fluid in a liquid phase to a solid material of the top capillary pressure sub-layer, δ1 is a distance between a bottom of the middle capillary pressure sub-layer and a top of the top capillary pressure sub-layer, σ is a surface tension of the working fluid, (Pvs−Pl) is a pressure difference between a vapor and a liquid in the heat pipe, Dp,2 is the pore diameter of the pore in the top capillary pressure sub-layer, Da,2 is a distance between the top capillary pressure sub-layer and the middle capillary pressure sub-layer, and, δ2 is the pore thickness of the pore in the top capillary pressure sub-layer. 5. The planar heat pipe of claim 1, further comprising a spacer in between the at least two capillary pressure sub-layers, the spacer being configured to structurally support the top capillary pressure sub-layer. 6. A planar heat pipe comprising: a bottom facesheet;a top facesheet;a hierarchical vapor venting arterial wick between the bottom facesheet and the top facesheet, the hierarchical vapor venting arterial wick comprising: a permeability layer defining a liquid region proximate to the bottom facesheet, the permeability layer comprising at least one permeability sub-layer; anda capillary pressure layer between the permeability layer and the top facesheet, the capillary pressure layer comprising at least first and second capillary pressure sub-layers, the first capillary pressure sub-layer being between the second capillary pressure sub-layer and the permeability layer,wherein each sub-layer comprises pores; anda vapor region between the capillary pressure layer and the top facesheet, the vapor region and the liquid region being on opposite sides of the capillary pressure layer, wherein an average pore diameter in the permeability sub-layer is greater than an average pore diameter in each of the first and second capillary pressure sub-layerswherein the average pore diameter in the first capillary pressure sub-layer is greater than a largest pore diameter in the second capillary pressure sub-layer, andwherein, when liquid is in the liquid region, the permeability layer is configured to permit the liquid to flow through the permeability layer and the hierarchical vapor venting arterial wick is configured to vent vapor bubbles forming in the liquid region of the heat pipe first through the permeability layer to the first capillary pressure sub-layer, and then from the first capillary pressure sub-layer to the second capillary pressure sub-layer such that the vapor bubbles are vented through progressively smaller pores from the liquid region to the vapor region. 7. The planar heat pipe of claim 6, further comprising a spacer between the first and second capillary pressure sub-layers. 8. The planar heat pipe of claim 6, further comprising an architected mechanical core structure between the vapor venting arterial wick and the top facesheet; anda working fluid in the liquid region, wherein the architected mechanical core structure is in the vapor region. 9. The planar heat pipe of claim 8, wherein the architected mechanical core structure comprises a micro-lattice layer, a micro-truss layer, ridges, and/or posts. 10. The planar heat pipe of claim 8, wherein a pore thickness and a pore diameter of a pore of the pores in the capillary pressure layer, along with a height of the permeability layer, a contact angle of the working fluid, and a surface tension of the working fluid satisfy an inequality, Dp≥τhcosθ(2-τcosθh)wherein Dp is the pore diameter of the pore in the capillary pressure layer, τ is the pore thickness of the pore in the capillary pressure layer, h is the height of the permeability layer, and θ is the contact angle of the working fluid in a liquid phase to a solid material of the capillary pressure layer. 11. The planar heat pipe of claim 10, wherein the pores in the capillary pressure layer are non-circular, and Dp is equal to an inverse of a mean of the inverses of a major and a minor diameter of the pores in the capillary pressure layer. 12. The planar heat pipe of claim 10, wherein the height of the permeability layer is measured from a lower surface of the capillary pressure layer through the liquid region. 13. The planar heat pipe of claim 10, wherein the height of the permeability layer is measured from a surface directly below the pore diameter of the pore in the capillary pressure layer through the liquid region. 14. The planar heat pipe of claim 8, wherein a pore thickness and a pore diameter of a pore of the pores in the capillary pressure layer, along with a height of the permeability layer, a contact angle of the working fluid, and a surface tension of the working fluid satisfy an inequality, 1-1-D_p2+[1-1-(S_D_p)2]/S_≥2δ_,wherein Dp is the pore diameter of the pore in the capillary pressure layer, Da is the height of the permeability layer, ψ is the contact angle of the working fluid in a liquid phase to a solid material in the capillary pressure layer, δ is the pore thickness of the pore in the capillary pressure layer, σ=is the surface tension of the working fluid, and (Pvs−Pl) is a pressure difference between a vapor and a liquid in the planar heat pipe, wherein, Dp=Dp cos ψ/Da,S=(Pvs−Pl)/(4σ cos ψ/Da), andδ=δ cos ψ/Da. 15. The planar heat pipe of claim 8, wherein the bottom facesheet comprises mechanical posts spaced at intervals corresponding with the pores in the permeability layer such that the spacing between posts defines a pore hydraulic diameter in the permeability layer and a height of the posts defines a thickness, and wherein the permeability layer is below the capillary pressure layer in the liquid region, and the pore hydraulic diameter satisfies an equation 4*[(Wetted Area)/(Liquid Volume)]. 16. The planar heat pipe of claim 15, wherein the architected mechanical core structure of the vapor region and the mechanical posts of the liquid region at least partially align and comprise at least one point of contact such that the architected mechanical core structure and the mechanical posts are coupled at this at least one point of contact. 17. The planar heat pipe of claim 15, wherein the architected mechanical core structure comprises a three-dimensional micro-lattice structure. 18. The planar heat pipe of claim 15, wherein the architected mechanical core structure comprises straight posts configured to align with the mechanical posts of the liquid region. 19. The planar heat pipe of claim 15, wherein the capillary pressure layer defines a top perimeter of the liquid region, and wherein a top surface of the capillary pressure layer comprises, in-part, a liquid-vapor interface between the liquid region and the vapor region of the planar heat pipe. 20. The planar heat pipe of claim 15, wherein the mechanical posts of the bottom facesheet are integral with the bottom facesheet such that the bottom facesheet is patterned.
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