Method of absorbing sensible and latent heat with series-connected heat sinks
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25D-017/02
F25D-025/00
F25D-023/12
H05K-007/20
F25B-023/00
F28F-003/12
F28F-009/26
F28F-013/06
F28D-015/02
출원번호
US-0723388
(2015-05-27)
등록번호
US-9854714
(2017-12-26)
발명자
/ 주소
Shedd, Timothy A.
출원인 / 주소
EBULLIENT, INC.
대리인 / 주소
Boyarski, Nicholas J.
인용정보
피인용 횟수 :
0인용 특허 :
61
초록▼
A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink
A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow.
대표청구항▼
1. A method of cooling two or more processors of a server by absorbing sensible heat and latent heat in coolant flowing through two or more series-connected heat sink modules, the method comprising: providing a flow of subcooled single-phase liquid coolant to an inlet of a first heat sink module in
1. A method of cooling two or more processors of a server by absorbing sensible heat and latent heat in coolant flowing through two or more series-connected heat sink modules, the method comprising: providing a flow of subcooled single-phase liquid coolant to an inlet of a first heat sink module in thermal communication with a first processor of a server, projecting the flow of subcooled single-phase liquid coolant, in the form of impinging jet streams, against a first surface to be cooled within the first heat sink module, wherein the subcooled single-phase liquid coolant absorbs a first amount of heat from the first processor as sensible heat; andtransporting the flow of subcooled single-phase liquid coolant from an outlet of the first heat sink module to an inlet of a second heat sink module in thermal communication with a second processor of the server, projecting the flow of subcooled single-phase liquid coolant, in the form of impinging jet streams, against a second surface to be cooled within the second heat sink module, wherein the flow of subcooled single-phase liquid absorbs a second amount of heat from the second processor as sensible heat resulting in the flow of subcooled single-phase liquid coolant reaching its saturation temperature and becoming a flow of saturated single-phase liquid coolant, wherein the flow of saturated single-phase liquid coolant absorbs a third amount of heat from the second processor as latent heat resulting in vaporization of a first portion of the flow of saturated single-phase liquid coolant thereby changing the flow of saturated single-phase liquid coolant to two-phase bubbly flow comprising saturated liquid coolant with vapor coolant dispersed as bubbles in the saturated liquid coolant. 2. The method of claim 1, further comprising: transporting the flow of two-phase bubbly flow comprising the first amount of heat, the second amount of heat, and the third amount of heat out of the server through a flexible cooling line; andrejecting the first amount of heat, the second amount of heat, and the third amount of heat from the flow of two-phase bubbly flow by directing the flow of two-phase bubbly flow through a heat exchanger fluidly connected to a heat rejection loop. 3. The method of claim 1, wherein providing the flow of subcooled single-phase liquid coolant to the inlet of the first heat sink module comprises providing a flow rate of about 0.1-10, 0.2-5, 0.3-2.5, 0.6-1.2, or 0.8-1.1 liters per minute of subcooled single-phase liquid coolant to the first inlet of the first heat sink module. 4. The method of claim 1, wherein providing the flow of subcooled single-phase liquid coolant to the inlet of the first heat sink module comprises providing a subcooled single-phase liquid coolant with a boiling point of about 15-35, 20-45, 30-55, or 40-65 degrees C. determined at a pressure of 1 atm. 5. The method of claim 1, wherein providing the flow of subcooled single-phase liquid coolant to the inlet of the first heat sink module comprises providing a dielectric coolant comprising a hydrofluoroether, a hydrofluorocarbon, or a combination thereof. 6. The method of claim 1, wherein providing the flow of subcooled single-phase liquid coolant to the first heat sink module comprises providing a flow of subcooled single-phase liquid coolant at a predetermined temperature and a predetermined pressure, wherein the predetermined temperature is below the saturation temperature of the flow of subcooled single-phase liquid coolant at the predetermined pressure. 7. The method of claim 6, wherein the predetermined temperature is about 0.5-20, 0.5-15, 0.5-10, 0.5-7, 0.5-5, 0.5-3, 0.5-1, 1-20, 1-15, 1-10, 1-7, 1-5, 1-3, 3-20, 3-15, 3-10, 3-7, 3-5, 5-20, 5-15, 5-10, 5-7, 7-20, 7-15, 7-10, 10-20, 10-15, or 15-20 degrees C. below the saturation temperature of the flow of subcooled single-phase liquid coolant at the predetermined pressure. 8. The method of claim 1, further comprising providing a pressure differential of about 0.5-5.0, 0.5-3, or 1-3 psi between the inlet of the first heat sink module and the outlet of the first heat sink module, wherein the pressure differential is suitable to promote the flow to advance from the inlet of the first heat sink module to the outlet of the first heat sink module. 9. The method of claim 1, further comprising transporting the two-phase bubbly flow having a first quality from an outlet of the second heat sink module to an inlet of a third heat sink module connected in series with the first and second heat sink modules, wherein the third heat sink module is in thermal communication with a third processor of the server, wherein the two-phase bubbly flow having the first quality absorbs a fourth amount of heat from the third processor as latent heat resulting in vaporization of a second portion of the saturated single-phase liquid coolant thereby changing the flow from two-phase bubbly flow with the first quality to two-phase bubbly flow with a second quality greater than the first quality. 10. The method of claim 1, further comprising directing the flow of subcooled single-phase liquid coolant through one or more series-connected heat sink modules prior to providing the flow of subcooled single-phase liquid coolant to the inlet of the first heat sink module. 11. A method of absorbing heat from two or more processors in an electronic device by flowing coolant through two or more fluidly connected heat sink modules arranged in a series configuration, the method comprising: providing a flow of subcooled single-phase liquid coolant to a first heat sink module, the first heat sink module comprising a first thermally conductive base member in thermal communication with a first processor in an electronic device, the flow of subcooled single-phase liquid coolant having a predetermined pressure and a predetermined temperature at a first inlet of the first heat sink module, the predetermined temperature being below a saturation temperature of the flow of subcooled single-phase liquid coolant at the predetermined pressure;projecting the flow of subcooled single-phase liquid coolant against the thermally conductive base member within the first heat sink module, wherein the flow of subcooled single-phase liquid coolant absorbs a first amount of heat from the first processor through the thermally conductive base member as sensible heat;providing a second heat sink module comprising a second thermally conductive base member in thermal communication with a second processor, the second heat sink module comprising a second inlet;providing a first section of tubing having a first end connected to the first outlet of the first heat sink module and a second end connected to the second inlet of the second heat sink module;transporting through the first section of tubing the flow of subcooled single-phase liquid coolant from the first outlet of the first heat sink module to the second inlet of the second heat sink module; andprojecting the flow of subcooled single-phase liquid coolant against the second thermally conductive base member within the second heat sink module, wherein the flow of subcooled single-phase liquid coolant absorbs a second amount of heat from the second processor through the second thermally conductive base member as sensible heat resulting in the flow of subcooled single-phase liquid coolant reaching its saturation temperature and becoming a flow of saturated single-phase liquid coolant, wherein the flow of saturated single-phase liquid coolant absorbs a third amount of heat from the second processor through the second thermally conductive base member as latent heat resulting in vaporization of a first portion of the flow of saturated single-phase liquid coolant thereby changing the flow of saturated single-phase liquid coolant to two-phase bubbly flow comprising saturated liquid coolant with vapor coolant dispersed as bubbles in the saturated liquid coolant. 12. The method of claim 11, further comprising transporting the flow of two-phase bubbly flow comprising the first amount of heat, the second amount of heat, and the third amount of heat out of the electronic device through a flexible cooling line. 13. The method of claim 11, wherein projecting the flow of subcooled single-phase liquid coolant against the thermally conductive base member within the first heat sink module comprising projecting a plurality of jet streams of subcooled single-phase liquid against the thermally conductive base member within the first heat sink module. 14. The method of claim 11, further comprising directing the flow of subcooled single-phase liquid coolant through one or more series-connected heat sink modules prior to providing the flow of subcooled single-phase liquid coolant to the inlet of the first heat sink module. 15. The method of claim 11, wherein providing a first section of tubing comprises providing a section of flexible tubing having a minimum bend radius of less than 3, 2.5, or 2 inches to permit routing within the electronic device. 16. The method of claim 11, wherein the electronic device is a server, a personal computer, a tablet computer, a power electronics device, a smartphone, an automotive electronic control unit, a battery management device, a progressive gaming device, a telecommunications system, a high performance computing system, a server-based gaming device, an avionics system, or a home automation control unit. 17. The method of claim 11, wherein the first processor is a central processing unit (CPU) or a graphics processing unit (GPU), and wherein the second processor is a CPU or a GPU. 18. A method of absorbing heat from two or more devices using a two-phase cooling apparatus configured to pump low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules, the method comprising: providing a flow of subcooled single-phase liquid coolant to an inlet of a first heat sink module in thermal communication with a first device, of subcooled single-phase liquid coolant, in the form of impinging jet streams, against a first surface to be cooled within the first heat sink module, wherein the flow of subcooled single-phase liquid coolant absorbs a first amount of heat from the first device as sensible heat within the first heat sink module;transporting the flow of subcooled single-phase liquid coolant from an outlet of the first heat sink module to an inlet of a second heat sink module, the flow of subcooled single-phase liquid coolant, in the form of impinging jet streams, against a second surface to be cooled within the second heat sink module, wherein the flow of subcooled single-phase liquid coolant absorbs a second amount of heat from the second device partially as sensible heat and partially as latent heat and becomes two-phase bubbly flow comprising saturated liquid coolant with vapor bubbles of coolant dispersed in the saturated liquid coolant; andtransporting the two-phase bubbly flow comprising the first amount of heat and the second amount of heat away from the first and second devices.
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이 특허에 인용된 특허 (61)
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