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An adapter apparatus and method of forming the adapter apparatus includes providing a substrate with a plurality of layers. The layers include at least one socket contact holding layer that includes a plurality of holding structures positioned between a plurality of other layers. A plurality of sock

An adapter apparatus and method of forming the adapter apparatus includes providing a substrate with a plurality of layers. The layers include at least one socket contact holding layer that includes a plurality of holding structures positioned between a plurality of other layers. A plurality of socket contacts (e.g., each including an end connection portion and first and second deflectable element coupled thereto) are held in corresponding openings defined through the substrate at least in part by the plurality of holding structures.

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1. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a p

1. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, andat least one socket contact holding layer comprising a plurality of holding structures positioned between the at least one end connection retention guide layer and the at least one deflection element receiving layer; anda plurality of socket contacts, wherein each of the plurality of socket contacts is provided within a corresponding opening of the plurality of openings of the substrate, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part of the end connection portion is received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein, wherein the socket contact is held in the corresponding opening of the substrate by a portion of the end connection retention guide layer and one of the plurality of holding structures of the socket contact holding layer, and further wherein the first and second deflectable elements deflect when a male pin is received in the socket opening and in contact between the first and second deflectable elements, wherein each of the plurality of holding structures of the at least one socket contact holding layer comprises a holding element separating a pair of openings through which the first and second deflectable elements are respectively inserted. 2. The adapter apparatus of claim 1, wherein the socket contacts are flat. 3. The adapter apparatus of claim 1, wherein a cross-section area of each of the plurality of end connection receiving openings orthogonal to an axis along which the socket contact lies between the pin receiving side and the connection side is smaller than a cross-section area of each of the plurality of deflection element receiving openings orthogonal to the axis along which the socket contact lies. 4. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, andat least one socket contact holding layer comprising a plurality of holding structures positioned between the at least one end connection retention guide layer and the at least one deflection element receiving layer; anda plurality of socket contacts, wherein each of the plurality of socket contacts is provided within a corresponding opening of the plurality of openings of the substrate, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part of the end connection portion is received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein, wherein the socket contact is held in the corresponding opening of the substrate by a portion of the end connection retention guide layer and one of the plurality of holding structures of the socket contact holding layer, and further wherein the first and second deflectable elements deflect when a male pin is received in the socket opening and in contact between the first and second deflectable elements, wherein each of the plurality of socket contacts is held in the corresponding opening of the substrate by a portion of the at least one end connection retention guide layer and a holding element of one of the plurality of holding structures of the socket contact holding layer extending within at least part of the socket opening proximate the coupling of the first and second deflectable elements to the end connection portion. 5. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, andat least one socket contact holding layer comprising a plurality of holding structures positioned between the at least one end connection retention guide layer and the at least one deflection element receiving layer; anda plurality of socket contacts, wherein each of the plurality of socket contacts is provided within a corresponding opening of the plurality of openings of the substrate, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part of the end connection portion is received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein, wherein the socket contact is held in the corresponding opening of the substrate by a portion of the end connection retention guide layer and one of the plurality of holding structures of the socket contact holding layer, and further wherein the first and second deflectable elements deflect when a male pin is received in the socket opening and in contact between the first and second deflectable elements, wherein each of the plurality of socket contacts comprises an open end configured to receive the male pin therein and a closed end opposite the open end and towards the end connection portion of the socket contact, wherein the each of the plurality of socket contacts is held in the corresponding opening of the substrate by a portion of the at least one end connection retention guide layer and a holding element of one of the plurality of holding structures of the at least one socket contact holding layer in contact with a portion of the closed end. 6. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, wherein each of the plurality of deflection element receiving openings comprises a center pin receiving region and first and second deflection regions, wherein each of the first and second deflection regions are defined by one or more deflection region surfaces opposite the other and adjacent the center pin receiving region, andat least one socket contact holding layer comprising a plurality of holding structures positioned between the at least one end connection retention guide layer and the at least one deflection element receiving layer; anda plurality of socket contacts, wherein each of the plurality of socket contacts is provided within a corresponding opening of the plurality of openings of the substrate, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part of the end connection portion is received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein, wherein the socket contact is held in the corresponding opening of the substrate by a portion of the end connection retention guide layer and one of the plurality of holding structures of the socket contact holding layer, and further wherein the first and second deflectable elements deflect when a male pin is received in the socket opening and in contact between the first and second deflectable elements,wherein the first deflectable element is coupled to the end connection portion and provided at least partially in the first deflection region and the second deflectable element is coupled to the end connection portion and provided at least partially in the second deflection region, andwherein the first and second deflectable elements are spaced apart by a greater distance towards the connection side of the substrate than towards the pin receiving side of the substrate, the first and second deflectable elements being spaced apart by a distance that is less than the diameter of a male pin to be received thereby towards the pin receiving side of the substrate,wherein each of the first and second deflectable elements comprises an elongate portion coupled to the end connection portion by a transition portion, the end connection portion being centered at the connection side of the substrate relative to the center pin receiving region, andfurther wherein a holding element of one of the plurality of holding structures is positioned between the transition portions coupling the elongate portions of the first and second deflectable elements to the end connection portion and in contact with the socket contact to hold the socket contact in the corresponding opening of the substrate. 7. The adaptor of claim 1, wherein a length of the end connection portion in the direction of an axis along which the socket contact lies between the pin receiving side and the connection side is greater than a thickness of the at least one end connection retention guide layer in the direction of the axis of the socket contact. 8. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, andat least one socket contact holding layer comprising a plurality of holding structures positioned between the at least one end connection retention guide layer and the at least one deflection element receiving layer; anda plurality of socket contacts, wherein each of the plurality of socket contacts is provided within a corresponding opening of the plurality of openings of the substrate, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part of the end connection portion is received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein, wherein the socket contact is held in the corresponding opening of the substrate by a portion of the end connection retention guide layer and one of the plurality of holding structures of the socket contact holding layer, and further wherein the first and second deflectable elements deflect when a male pin is received in the socket opening and in contact between the first and second deflectable elements, wherein at least a portion of each of the plurality of socket contacts is sandwiched between a holding element of one of the plurality of holding structures of the at least one socket contact holding layer and one or more portions of the at least one end connection retention guide layer. 9. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, andat least one socket contact holding layer comprising a plurality of holding structures positioned between the at least one end connection retention guide layer and the at least one deflection element receiving layer; anda plurality of socket contacts, wherein each of the plurality of socket contacts is provided within a corresponding opening of the plurality of openings of the substrate, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part of the end connection portion is received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein, wherein the socket contact is held in the corresponding opening of the substrate by a portion of the end connection retention guide layer and one of the plurality of holding structures of the socket contact holding layer, and further wherein the first and second deflectable elements deflect when a male pin is received in the socket opening and in contact between the first and second deflectable elements, wherein each of the plurality of socket contacts are not press-fit within a corresponding opening of the plurality of openings of the substrate. 10. An adapter apparatus comprising: a substrate having a pin receiving side and a connection side opposite the pin receiving side, wherein a plurality of openings are defined through the substrate between the pin receiving side and the connection side, and further wherein the substrate comprises a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, andat least one socket contact holding layer comprising a plurality of holding structures positioned between the at least one end connection retention guide layer and the at least one deflection element receiving layer; anda plurality of socket contacts, wherein each of the plurality of socket contacts is provided within a corresponding opening of the plurality of openings of the substrate, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part of the end connection portion is received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein, wherein the socket contact is held in the corresponding opening of the substrate by a portion of the end connection retention guide layer and one of the plurality of holding structures of the socket contact holding layer, and further wherein the first and second deflectable elements deflect when a male pin is received in the socket opening and in contact between the first and second deflectable elements, wherein each of the plurality of socket contacts comprises: the first and second deflectable elements and end portion coupled thereto formed as a first flat contact portion; andthird and fourth deflectable elements and an end connection portion associated therewith formed as a second flat contact portion, wherein the first and second flat contact portions are arranged orthogonal to one another to provide a four deflectable element socket opening configured to receive a male pin therein. 11. A method for use in forming an adapter apparatus, wherein the method comprises: providing a plurality of layers, wherein the plurality of layers comprise: at least one end connection retention guide layer comprising a plurality of end connection receiving openings,at least one deflection element receiving layer comprising a plurality of deflection element receiving openings, andat least one socket contact holding layer comprising a plurality of holding structures, each holding structure comprising a holding element and one or more openings defined adjacent thereto;providing a plurality of socket contacts, wherein each of the plurality of socket contacts comprises: an end connection portion, wherein at least a part the end connection portion is configured to be received in one of the plurality of end connection receiving openings, andfirst and second deflectable elements configured to be received in one of the plurality of deflectable element receiving openings, wherein the first deflectable element and the second deflectable element are coupled to the end connection portion to define a socket opening configured to receive a male pin therein;coupling the at least one socket contact holding layer and the at least one deflection element receiving layer such that the one or more openings of each holding structure of the plurality of holding structures are aligned with a corresponding deflection element receiving opening of the plurality of deflection element receiving openings;inserting the first and second deflectable elements of each of the plurality of socket contacts through one or more openings of a corresponding holding structure of the plurality of holding structures of the socket contact holding layer such that the holding element of the corresponding holding structure is in contact with a portion of the socket contact with the socket cavity; andcoupling the at least one end connection retention guide layer to the socket contact holding layer such that at least a part of the end connection portion of each of the plurality of socket contacts is received within a corresponding end connection receiving opening of the plurality of end connection receiving openings of the at least one end connection retention guide layer, wherein the first and second deflectable elements of the socket contact are located within a corresponding deflection element receiving opening of the plurality of deflection element receiving openings of the at least one deflection element receiving layer. 12. The method of claim 11, wherein the socket contacts are flat. 13. The method of claim 11, wherein a cross-section area of each of the plurality of end connection receiving openings orthogonal to an axis along which the socket contact is smaller than a cross-section area of each of the plurality of deflection element receiving openings orthogonal to the axis along which the socket contact lies. 14. The method of claim 11, wherein each of the plurality of holding structures of the at least one socket contact holding layer comprises a holding element separating a pair of openings, wherein inserting the first and second deflectable elements of the each socket contact through one or more openings of a corresponding holding structure comprises inserting each of the first and second deflectable elements of each of the plurality of socket contacts through respective openings of the pair of openings. 15. The method of claim 11, wherein each of the plurality of socket contacts is held in the corresponding opening of the substrate by a portion of the at least one end connection retention guide layer and a holding element of one of the plurality of holding structures of the at least one socket contact holding layer extending within at least part of the socket opening proximate the coupling of the first and second deflectable elements to the end connection portion. 16. The method of claim 11, wherein each of the plurality of socket contacts comprises an open end configured to receive the male pin therein and a closed end opposite the open end and towards the end connection portion of the socket contact, wherein the each of the plurality of socket contacts is held in the corresponding opening of the substrate by a portion of the at least one end connection retention guide layer and a holding element of one of the plurality of holding structures of the at least one socket contact holding layer in contact with a portion of the closed end. 17. The method of claim 11, wherein each of the plurality of deflection element receiving openings comprises: a center pin receiving region, andfirst and second deflection regions, wherein each of the first and second deflection regions are defined by one or more deflection region surfaces opposite the other and adjacent the center pin receiving region;wherein the first deflectable element is coupled to the end connection portion and provided at least partially in the first deflection region and the second deflectable element is coupled to the end connection portion and provided at least partially in the second deflection region, andwherein the first and second deflectable elements are spaced apart by a greater distance towards the connection side of the substrate than towards the pin receiving side of the substrate, the first and second deflectable elements being spaced apart by a distance that is less than the diameter of a male pin to be received thereby towards the pin receiving side of the substrate,wherein each of the first and second deflectable elements comprises an elongate portion coupled to the end connection portion by a transition portion, the end connection portion being centered at the connection side of the substrate relative to the center pin receiving region, andfurther wherein a holding element of one of the plurality of holding structures is positioned between the transition portions coupling the elongate portions of the first and second deflectable elements to the end connection portion and in contact with the socket contact to hold the socket contact in the corresponding opening of the substrate. 18. The method of claim 11, wherein a length of the end connection portion in the direction of an axis along which the socket contact lies is greater than a thickness of the at least one end connection retention guide layer in the direction of the axis of the socket contact, such that at least a part of the end connection portion of each of the plurality of socket contacts extends through and out of the corresponding end connection receiving opening of the plurality of end connection receiving openings of the at least one end connection retention guide layer. 19. The method of claim 11, wherein coupling the at least one end connection retention guide layer to the socket contact holding layer comprises using a layer of pre-preg material to couple the at least one end connection retention guide layer to the at least one socket contact holding layer. 20. The method of claim 11, wherein at least a portion of each of the plurality of socket contacts is sandwiched between a holding element of one of the plurality of holding structures of the at least one socket contact holding layer and one or more portions of the at least one end connection retention guide layer.