Forced convection liquid cooling of fluid-filled high density pulsed power capacitor with native fluid
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01G-002/14
H01G-005/017
H01G-004/002
H01G-002/08
H05K-007/20
H01G-002/10
H01G-004/38
출원번호
US-0467299
(2014-08-25)
등록번호
US-9911532
(2018-03-06)
발명자
/ 주소
Gupta, Anurag
Lopez, Robert R.
Kuznetsov, Stephen B.
출원인 / 주소
Raytheon Company
인용정보
피인용 횟수 :
0인용 특허 :
33
초록▼
A high density capacitor comprises a housing having a cavity, and a plurality of capacitors forming at least one capacitor bank disposed in the housing cavity. A native cooling fluid is disposed in the cavity, and a heat exchanger is coupled to the housing. A pump is configured to circulate the nati
A high density capacitor comprises a housing having a cavity, and a plurality of capacitors forming at least one capacitor bank disposed in the housing cavity. A native cooling fluid is disposed in the cavity, and a heat exchanger is coupled to the housing. A pump is configured to circulate the native cooling fluid from the cavity, through the heat exchanger, through the spacings along an outer surface of each of the capacitors to cool the capacitors using forced convection. The heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger. The heat exchanger may have a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank.
대표청구항▼
1. A high density capacitor, comprising: a housing having a cavity;a plurality of capacitors forming at least one capacitor bank disposed in the cavity, each of the capacitors having an outer surface, the at least one capacitor bank having spacings between the outer surfaces of the capacitors;a nati
1. A high density capacitor, comprising: a housing having a cavity;a plurality of capacitors forming at least one capacitor bank disposed in the cavity, each of the capacitors having an outer surface, the at least one capacitor bank having spacings between the outer surfaces of the capacitors;a native cooling fluid disposed in the cavity and contacting the capacitors;a heat exchanger coupled to the housing; anda pump hydraulically coupled to the heat exchanger and configured to circulate the native cooling fluid from the cavity, through the heat exchanger, through the spacings, and along and in contact with the outer surface of each of the capacitors to cool the capacitors using forced convection;wherein the heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger. 2. The high density capacitor as specified in claim 1, wherein the heat exchanger has a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank. 3. The high density capacitor as specified in claim 2, wherein the heat exchanger has a first passageway configured to communicate the native cooling fluid from the pump to the openings of the plenum, a second passageway configured to communicate the secondary fluid, and a thermally conductive member separating the first passageway from the second passageway. 4. The high density capacitor as specified in claim 3, wherein the first passageway and the second passageway are separated from each other by a planar member. 5. The high density capacitor as specified in claim 4, wherein the first passageway is planar and the second passageway is planar. 6. A high density capacitor, comprising: a housing having a cavity;a plurality of capacitors forming at least one capacitor bank disposed in the cavity, each of the capacitors having an outer surface, the at least one capacitor bank having spacings between the outer surfaces of the capacitors;a heat exchanger coupled to the housing; anda pump hydraulically coupled to the heat exchanger and configured to circulate a native cooling fluid disposed in the cavity from the cavity, through the heat exchanger, through the spacings, and along the outer surface of each of the capacitors to cool the capacitors using forced convection;wherein the heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger;wherein the heat exchanger has a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank;wherein the heat exchanger has a first passageway configured to communicate the native cooling fluid from the pump to the openings of the plenum, a second passageway configured to communicate the secondary fluid, and a thermally conductive member separating the first passageway from the second passageway;wherein the first passageway and the second passageway are separated from each other by a planar member, the first passageway is planar, and the second passageway is planar;wherein the first passageway is formed by a first plate;wherein the second passageway is formed by a second plate; andwherein each plate has a plurality of fins configured to create an even planar flow of fluid through the respective passageway. 7. The high density capacitor as specified in claim 6, wherein the first passageway is partially covered by a plate on top of the first passageway, thereby forming the plenum configured to discharge the native cooling fluid from the first passageway. 8. The high density capacitor as specified in claim 7, wherein the plates are brazed to each other to create a brazement. 9. A high density capacitor, comprising: a housing having a cavity;a plurality of capacitors forming at least one capacitor bank disposed in the cavity, each of the capacitors having an outer surface, the at least one capacitor bank having spacings between the outer surfaces of the capacitors;a heat exchanger coupled to the housing; anda pump hydraulically coupled to the heat exchanger and configured to circulate a native cooling fluid disposed in the cavity from the cavity, through the heat exchanger, through the spacings, and along the outer surface of each of the capacitors to cool the capacitors using forced convection;wherein the heat exchanger has a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank; andwherein the openings of the plenum have opening sizes graduated from one side of the plenum to another side of the plenum. 10. The high density capacitor as specified in claim 9, wherein the openings of the plenum are configured to evenly dispense the native cooling fluid across the at least one capacitor bank. 11. The high density capacitor as specified in claim 1, wherein: the at least one capacitor bank comprises a first bank of capacitors and a second bank of capacitors disposed upon the first bank of capacitors; anda spacer is disposed between the first bank of capacitors and the second bank of capacitors. 12. The high density capacitor as specified in claim 11, wherein the spacer is configured to direct a portion of the native cooling fluid from the heat exchanger laterally between the first bank of capacitors and the second bank of capacitors. 13. The high density capacitor as specified in claim 11, wherein the spacer is configured to direct a portion of the native cooling fluid from the heat exchanger in a columnar fashion to the first bank of capacitors and the second bank of capacitors. 14. The high density capacitor as specified in claim 11, wherein the spacer has an interface configured to engage a top portion of the first bank of capacitors and a lower portion of the second bank of capacitors. 15. The high density capacitor as specified in claim 14, wherein the interface is configured to secure the first bank of capacitors with respect to the second bank of capacitors and dampen any vibration of the first and second banks of capacitors. 16. A high density capacitor, comprising: a housing having a cavity;a plurality of capacitors forming at least one capacitor bank disposed in the cavity, each of the capacitors having an outer surface, the at least one capacitor bank having spacings between the outer surfaces of the capacitors;a heat exchanger coupled to the housing; anda pump hydraulically coupled to the heat exchanger and configured to circulate a native cooling fluid disposed in the cavity from the cavity, through the heat exchanger, through the spacings, and along the outer surface of each of the capacitors to cool the capacitors using forced convection;wherein the heat exchanger has a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger proximate the at least one capacitor bank;wherein the at least one capacitor bank comprises a first bank of capacitors and a second bank of capacitors; andwherein the high density capacitor further comprises: a spacer having at least one opening configured to pass a first portion of the native cooling fluid from the openings of the plenum; anda director configured to route a second portion of the native cooling fluid from the openings of the plenum laterally between the first bank of capacitors and the second bank of capacitors. 17. The high density capacitor as specified in claim 16, wherein the spacer is configured to pass the first portion of the native cooling fluid in a columnar fashion to the first and second banks of capacitors. 18. The high density capacitor as specified in claim 1, further comprising: spacers disposed between the capacitors and creating the spacings between the capacitors. 19. The high density capacitor as specified in claim 18, wherein the spacers are configured to provide columnar fluid routing of the native cooling fluid through the spacers and across major surfaces of the capacitors extending normal with respect to the heat exchanger. 20. A high density capacitor, comprising: a housing having a cavity;a plurality of capacitors fowlAAling at least one capacitor bank disposed in the cavity, each of the capacitors having an outer surface, the at least one capacitor bank having spacings between the outer surfaces of the capacitors;a heat exchanger coupled to the housing;a pump hydraulically coupled to the heat exchanger and configured to circulate a native cooling fluid disposed in the cavity from the cavity, through the heat exchanger, through the spacings, and along the outer surface of each of the capacitors to cool the capacitors using forced convection; andspacers disposed between the capacitors and creating the spacings between the capacitors, wherein the spacers are configured to provide columnar fluid routing of the native cooling fluid through the spacers and across major surfaces of the capacitors extending normal with respect to the heat exchanger;wherein the spacers are configured to provide spring-like pressure to the capacitors to maintain a preload between the capacitors. 21. The high density capacitor as specified in claim 1, wherein: the capacitors are elongated and have major surfaces extending normal with respect to the heat exchanger; andthe at least one capacitor bank is configured such that a portion of the native cooling fluid is able to flow in a column in the spacings between the major surfaces of the capacitors. 22. The high density capacitor as specified in claim 1, wherein the pump is coupled to the housing. 23. A high density capacitor, comprising: a housing having a cavity;a plurality of capacitors forming a capacitor bank disposed in the cavity, each of the capacitors having an outer surface, the capacitor bank having spacings between the outer surfaces of the capacitors;a native cooling fluid disposed in the cavity and contacting the capacitors;a heat exchanger coupled to the housing and having a first passageway configured to communicate the native cooling fluid, a second passageway configured to communicate a secondary fluid, and a thermally conductive member separating the first passageway from the second passageway; anda pump configured to circulate the native cooling fluid from the cavity, through the first passageway of the heat exchanger, through the spacings, and along and in contact with the outer surface of each of the capacitors to cool the capacitors using forced convection;wherein the second passageway is configured such that the secondary fluid flowing through the second passageway is configured to draw heat from the native cooling fluid flowing through the first passageway. 24. The high density capacitor as specified in claim 23, wherein the heat exchanger has a plenum having a plurality of openings configured to dispense the native cooling fluid from the first passageway of the heat exchanger proximate the capacitor bank. 25. A high density capacitor comprising: a housing having a cavity;a plurality of capacitors disposed in the cavity with spacings between outer surfaces of the capacitors;a native cooling fluid disposed in the cavity and contacting the capacitors;a heat exchanger coupled to the housing and having a first passageway configured to communicate the native cooling fluid, a second passageway configured to communicate a secondary fluid, and a thermally conductive member separating the first passageway from the second passageway, the heat exchanger configured to transfer heat from the native cooling fluid to the secondary fluid;an inlet and an outlet configured to respectively provide the secondary fluid to and receive the secondary fluid from the second passageway of the heat exchanger; anda pump coupled to the housing and configured to create a flow of the native cooling fluid, the pump configured to pull the native cooling fluid from the cavity and force the native cooling fluid into the first passageway of the heat exchanger;wherein the heat exchanger has a plenum having a plurality of openings configured to dispense the native cooling fluid from the heat exchanger into the cavity. 26. The high density capacitor of claim 25, wherein the native cooling fluid comprises a dielectric. 27. The high density capacitor as specified in claim 20, wherein the heat exchanger is configured to communicate a secondary fluid through the heat exchanger and draw heat from the native cooling fluid flowing through the heat exchanger.
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