An electrostatic chuck and gripping system are configured for clamping and processing workpieces having differing diameters. An ion implantation apparatus selectively provides ions to a first workpiece and a second workpiece in a process chamber, where a diameter of the first workpiece is greater th
An electrostatic chuck and gripping system are configured for clamping and processing workpieces having differing diameters. An ion implantation apparatus selectively provides ions to a first workpiece and a second workpiece in a process chamber, where a diameter of the first workpiece is greater the second workpiece. A chuck supports the respective first or second workpiece within the process chamber during exposure to the ions. A load lock chamber isolates a process environment from an external environment and has a workpiece support for the respective first or second workpiece during a transfer of the first or second workpiece between the process chamber and the external environment. A vacuum robot transfers the first or second workpiece between the chuck and workpiece support, and has a gripper mechanism configured to selectively grip the first or second workpiece between a plurality of stepped guides.
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1. An ion implantation system, comprising: an ion implantation apparatus configured to provide a plurality of ions to a process chamber;a chuck configured to selectively support one of a first workpiece and a second workpiece within the process chamber during an exposure of the respective first work
1. An ion implantation system, comprising: an ion implantation apparatus configured to provide a plurality of ions to a process chamber;a chuck configured to selectively support one of a first workpiece and a second workpiece within the process chamber during an exposure of the respective first workpiece and second workpiece to the plurality of ions, wherein the second workpiece has a diameter that is greater than a diameter of the first workpiece;a load lock chamber operably coupled to the process chamber, wherein the load lock chamber comprises a workpiece support configured to support the respective one of the first workpiece and second workpiece during a transfer of the respective one of the first workpiece and second workpiece between the process chamber and an external environment; anda robot configured to transfer the respective one of the first workpiece and second workpiece between the chuck and the workpiece support via a first gripper mechanism, wherein the first gripper mechanism comprises:a plurality of gripper arms configured to translate between a grip position and a release position; anda plurality of guides operably coupled to the plurality of gripper arms, wherein the plurality of guides have a first gripping portion associated with the diameter of the first workpiece and a second gripping portion associated with the diameter of the second workpiece, and wherein when the plurality of gripper arms are in the grip position, the first gripping portion of the plurality of guides is configured to selectively grip the first workpiece therebetween and the second gripping portion of the plurality of guides is configured to selectively grip the second workpiece therebetween, and wherein the first gripping portion and second gripping portion of the plurality of guides are configured to selectively release the respective first workpiece and second workpiece when the plurality of gripper arms are in the release position. 2. The ion implantation system of claim 1, wherein each of the plurality of guides comprise a first feature associated with the first gripping portion thereof and a second feature associated with the second gripping portion thereof. 3. The ion implantation system of claim 2, wherein each of the first feature and second feature comprise a respective notch or step in the respective plurality of guides. 4. The ion implantation system of claim 1, wherein the robot is configured to selectively retrieve one of the first workpiece and second workpiece from the respective workpiece support and chuck concurrent with the first gripper mechanism being in the grip position, and wherein the robot is configured to selectively place the first workpiece and second workpiece onto the respective workpiece support and chuck concurrent with the first gripper mechanism being in the release position. 5. The ion implantation system of claim 1, wherein the workpiece support comprises a plurality of support members fixedly coupled to a support plate, and wherein each support member comprises a first support structure associated with the diameter of the first workpiece and a second support structure associated with the diameter of the second workpiece. 6. The ion implantation system of claim 5, wherein the first support structure and second support structure each comprise a step defined in the respective support member. 7. The ion implantation system of claim 6, wherein the first support structure defines a first plane and the second support structure defines a second plane, wherein the first plane is lower than the second plane. 8. The ion implantation system of claim 1, wherein the diameter of the first workpiece is approximately 150 mm and the diameter of the second workpiece is approximately 200 mm. 9. An ion implantation system, comprising: an ion implantation apparatus configured to selectively provide a plurality of ions to a first workpiece and a second workpiece when the respective first workpiece or second workpiece is positioned in a process chamber, wherein a diameter of the first workpiece is greater than a diameter of the second workpiece;a chuck configured to support the respective first or second workpiece within the process chamber during an exposure of the respective first or second workpiece to the plurality of ions;a load lock chamber operably coupled to the process chamber, wherein the load lock chamber is configured to isolate a process environment associated with the process chamber from an external environment, and wherein the load lock chamber comprises a workpiece support configured to support the respective first or second workpiece during a transfer of the first or second workpiece between the process chamber and the external environment; anda vacuum robot configured to transfer the respective first or second workpiece between the chuck in the process chamber and the workpiece support in the load lock chamber, wherein the vacuum robot comprises a first gripper mechanism configured to selectively grip the respective first or second workpiece between a first plurality of stepped guides. 10. The ion implantation system of claim 9, wherein the first plurality of stepped guides comprise a first receiving step associated with the first workpiece and a second receiving step associated with the second workpiece. 11. The ion implantation system of claim 10, wherein the first receiving step and second receiving step comprise concave recesses defined in the first plurality of stepped guides. 12. The ion implantation system of claim 9, wherein the first gripper mechanism comprises a plurality of guides operably coupled to a plurality of gripper arms, and wherein the plurality of guides have a first gripping portion associated with a diameter of the first workpiece and a second gripping portion associated with the diameter of the second workpiece, and wherein when the plurality of gripper arms are in a grip position, the first gripping portion of the plurality of guides is configured to selectively grip the first workpiece therebetween and the second gripping portion of the plurality of guides is configured to selectively grip the second workpiece therebetween, and wherein the first gripping portion and second gripping portion of the plurality of guides are configured to selectively release the respective first workpiece and second workpiece when the plurality of gripper arms are in a release position. 13. The ion implantation system of claim 9, wherein the chuck is operably coupled to a base of a scan arm, and wherein the chuck comprises: a central electrostatic chuck member operably coupled to the base, wherein the central electrostatic chuck member has a central chuck surface configured to support and electrostatically clamp the first workpiece thereto;a first peripheral electrostatic chuck member operably coupled to the base, wherein the first peripheral electrostatic chuck member generally surrounds the central electrostatic chuck member, and wherein the first peripheral electrostatic chuck member has a first peripheral chuck surface configured to support and electrostatically clamp a peripheral region of at least the second workpiece;an elevator configured to selectively translate the first peripheral electrostatic chuck member with respect to the central electrostatic chuck member along an axis generally perpendicular to the central chuck surface between an extended position and a retracted position, wherein the first peripheral chuck surface is generally co-planar with the central chuck surface when at the extended position, and wherein the first peripheral chuck surface resides below the central chuck surface when at the retracted position; anda first peripheral shield, wherein the first peripheral shield is configured selectively cover the first peripheral chuck surface when the first peripheral electrostatic chuck member is at the retracted position. 14. A gripper mechanism for individually gripping a plurality of workpieces of differing sizes, the gripper mechanism comprising: a plurality of gripper arms configured to translate between a grip position and a release position; anda plurality of guides operably coupled to the plurality of gripper arms, wherein the plurality of guides have a first gripping portion associated with a diameter of a first workpiece and a second gripping portion associated with a diameter of a second workpiece, wherein the diameter of the second workpiece is greater than the diameter of the first workpiece, and wherein when the plurality of gripper arms are in the grip position, the first gripping portion of the plurality of guides is configured to selectively grip the first workpiece therebetween and the second gripping portion of the plurality of guides is configured to selectively grip the second workpiece therebetween, and wherein the first gripping portion and second gripping portion of the plurality of guides are configured to selectively release the respective first workpiece and second workpiece when the plurality of gripper arms are in the release position. 15. The gripper mechanism of claim 14, wherein each of the plurality of guides comprise a first feature associated with the first dripping portion thereof and a second feature associated with the second gripping portion thereof. 16. The gripper mechanism of claim 15, wherein each of the first feature and second feature comprise a respective notch or step in the respective plurality of guides.
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