A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to
A scalable liquid submersion cooling system for electronics. The system includes a plurality of modular system components, such as electronics enclosures, manifolds, pumps, and heat exchanger units. The modular system components permit the liquid submersion cooling system to be scaled up or down to accommodate changing needs. In addition, the modularity of the components facilitates portability, allowing relatively easy transport and set-up/break-down of electronic systems.
대표청구항▼
1. A scalable liquid submersion cooling system for electronics, comprising: a plurality of modular manifolds each of which is configured to fluidly connect to an electronics enclosure containing the electronics that are liquid submersion cooled by cooling liquid supplied from a respective one of the
1. A scalable liquid submersion cooling system for electronics, comprising: a plurality of modular manifolds each of which is configured to fluidly connect to an electronics enclosure containing the electronics that are liquid submersion cooled by cooling liquid supplied from a respective one of the modular manifolds; each modular manifold includes a liquid supply manifold portion and a liquid return manifold portion, a plurality of liquid supply outlets in the liquid supply manifold portion, at least one liquid supply inlet in the liquid supply manifold portion, a plurality of liquid return inlets in the liquid return manifold portion, and at least one liquid return outlet in the liquid return manifold portion; and for each of the modular manifolds; the number of liquid supply outlets and the number of liquid return inlets differ between each modular manifold but are the same within each modular manifold. 2. The scalable liquid submersion cooling system for electronics of claim 1, further comprising a plurality of modular pumps each of which is configured to fluidly connect to the modular manifolds, each pump having a different pumping performance. 3. The scalable liquid submersion cooling system for electronics of claim 1, further comprising a plurality of modular heat exchanger units each of which is configured to fluidly connect to one of the modular manifolds. 4. The scalable liquid submersion cooling system for electronics of claim 1, wherein the cooling liquid is a dielectric cooling liquid. 5. The scalable liquid submersion cooling system for electronics of claim 4, wherein the dielectric cooling liquid is a single phase liquid. 6. The scalable liquid submersion cooling system for electronics of claim 1, wherein the electronics are high-power density electronics. 7. The scalable liquid submersion cooling system for electronics of claim 6, wherein the high-power density electronics function as server computers, blade servers, disk arrays/storage systems, solid state memory devices, storage area networks, network attached storage, storage communication systems, routers, telecommunication infrastructure/switches, wired, optical and wireless communication devices, cell processor devices, printers, or power supplies. 8. The scalable liquid submersion cooling system for electronics of claim 3, wherein each of the modular heat exchanger units comprises: a cylindrical housing with an outer surface, an interior space, a first axial end, and a second axial end; anda plurality of radially extending external heat exchange fins on the outer surface extending from the first axial end to the second axial end. 9. The scalable liquid submersion cooling system for electronics of claim 8, wherein each of the modular heat exchanger units further comprises: a plurality of walls that divide the interior space into a plurality of fluid passageways;a plurality of internal heat exchange fins extending from the walls into the fluid passageways. 10. The scalable liquid submersion cooling system for electronics of claim 9, wherein the internal heat exchange fins are curved, radially spaced from each other, and increase in circumferential length as they extend away from a center of the interior space. 11. The scalable liquid submersion cooling system for electronics of claim 8, further comprising at least one first endcap at the first axial end; at least one second endcap at the second axial end; and at least one liquid inlet and at least one liquid outlet formed in the at least one first endcap, formed in the at least one second endcap, or formed in each of the at least one first endcap and the at least one second endcap. 12. The scalable liquid submersion cooling system for electronics of claim 9, further comprising first and second endcaps at the first axial end; the first end cap including passages that are in fluid communication with two of the fluid passageways; and the second end cap including passages in fluid communication with the two fluid passageways and the passages in the first end cap and passages in fluid communication with another two of the fluid passageways. 13. A scalable liquid submersion cooling system for electronics, comprising: a plurality of modular heat exchanger units each of which is configured to cool a cooling liquid after the cooling liquid submersion cools the electronics, each of the modular heat exchanger units comprises:a cylindrical housing with an outer surface, an interior space, a first axial end, and a second axial end, the interior space is divided into a plurality of separate fluid passageways through which the cooling liquid can flow to be cooled;at least one first endcap at the first axial end;at least one second endcap at the second axial end;at least one liquid inlet and at least one liquid outlet formed in the at least one first endcap, formed in the at least one second endcap, or formed in each of the at least one first endcap and the at least one second endcap, the at least one liquid inlet is in fluid communication with at least a first one of the separate fluid passageways and the at least one liquid outlet is in fluid communication with at least a second one of the separate fluid passageways;the at least one first end cap or the at least one second endcap is configured to dictate a flow path of the cooling liquid through the separate fluid passageways of the interior space; anda plurality of radially extending external heat exchange fins on the outer surface extending from the first axial end to the second axial end. 14. The scalable liquid submersion cooling system for electronics of claim 13, wherein each of the modular heat exchanger units further comprises: a plurality of walls that divide the interior space into the plurality of separate fluid passageways;a plurality of internal heat exchange fins extending from the walls into the separate fluid passageways. 15. The scalable liquid submersion cooling system for electronics of claim 13, wherein the cooling liquid is a single-phase, dielectric cooling liquid. 16. The scalable liquid submersion cooling system for electronics of claim 13, wherein the electronics are high-power density electronics. 17. The scalable liquid submersion cooling system for electronics of claim 16, wherein the high-power density electronics function as server computers, blade servers, disk arrays/storage systems, solid state memory devices, storage area networks, network attached storage, storage communication systems, routers, telecommunication infrastructure/switches, wired, optical and wireless communication devices, cell processor devices, printers, or power supplies. 18. The scalable liquid submersion cooling system for electronics of claim 13, wherein the at least one liquid inlet is formed in the at least one first end cap, and the at least one first end cap closes the second one of the separate fluid passageways to incoming flow through the at least one liquid inlet. 19. A scalable liquid submersion cooling system for electronics, comprising: a plurality of modular heat exchanger units each of which is configured to cool a cooling liquid after the cooling liquid submersion cools the electronics, each of the modular heat exchanger units comprises:a cylindrical housing with an outer surface, an interior space, a first axial end, and a second axial end;at least one first endcap at the first axial end;at least one second endcap at the second axial end;at least one liquid inlet and at least one liquid outlet formed in the at least one first endcap, formed in the at least one second endcap, or formed in each of the at least one first endcap and the at least one second endcap;a plurality of radially extending external heat exchange fins on the outer surface extending from the first axial end to the second axial end;wherein the internal heat exchange fins are curved, radially spaced from each other, and increase in circumferential length as they extend away from a center of the interior space. 20. A scalable liquid submersion cooling system for electronics, comprising: a plurality of modular heat exchanger units each of which is configured to cool a cooling liquid after the cooling liquid submersion cools the electronics, each of the modular heat exchanger units comprises:a cylindrical housing with an outer surface, an interior space, a first axial end, and a second axial end;at least one first endcap at the first axial end;at least one second endcap at the second axial end;at least one liquid inlet and at least one liquid outlet formed in the at least one first endcap, formed in the at least one second endcap, or formed in each of the at least one first endcap and the at least one second endcap;a plurality of radially extending external heat exchange fins on the outer surface extending from the first axial end to the second axial end; anda second endcap at the first axial end; the first end cap including passages that are in fluid communication with two of the fluid passageways; and the second end cap at the first axial end including passages in fluid communication with the two fluid passageways and the passages in the first end cap and passages in fluid communication with another two of the fluid passageways.
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