RFID tag and method of securing same to object
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06K-019/077
G06K-019/04
B65D-025/20
G06K-007/10
출원번호
US-0896224
(2014-06-16)
등록번호
US-9928457
(2018-03-27)
국제출원번호
PCT/US2014/042508
(2014-06-16)
국제공개번호
WO2014/204844
(2014-12-24)
발명자
/ 주소
McDowell, Christopher S.
출원인 / 주소
Haemonetics Corporation
대리인 / 주소
Sunstein Kann Murphy & Timbers LLP
인용정보
피인용 횟수 :
0인용 특허 :
113
초록▼
A method for securing an RFID tag to an object includes providing an RFID tag and placing the RFID tag on the object. The RFID tag has an RFID chip and an antenna electrically connected to the RFID chip. The RFID tag also has a first and second opening extending through the RFID tag. The object has
A method for securing an RFID tag to an object includes providing an RFID tag and placing the RFID tag on the object. The RFID tag has an RFID chip and an antenna electrically connected to the RFID chip. The RFID tag also has a first and second opening extending through the RFID tag. The object has a first and second protrusion extending from a surface of the object. The first and second protrusions extend through the first and second openings when the RFID tag is placed on the object. The method also includes melting the first and second protrusions to create a single integral boss that covers at least a portion of the RFID tag and secures the RFID tag to the object. The chip may be nonfunctional prior to the securement process.
대표청구항▼
1. A method for securing an RFID tag to an object comprising: providing an RFID tag having an RFID chip and an antenna electrically connected to the RFID chip, the RFID tag also having a first and second opening extending therethrough;placing the RFID tag on the object, the object having a first and
1. A method for securing an RFID tag to an object comprising: providing an RFID tag having an RFID chip and an antenna electrically connected to the RFID chip, the RFID tag also having a first and second opening extending therethrough;placing the RFID tag on the object, the object having a first and second protrusion extending from a surface of the object, the first and second protrusions extending through the first and second openings when the RFID tag is placed on the object; andmelting the first and second protrusions to create a single integral boss, the boss covering at least a portion of the RFID tag, thereby securing the RFID tag to the object. 2. A method according to claim 1, wherein melting the first and second protrusions includes placing a heated die over the first and second protrusions. 3. A method according to claim 2, further comprising: cooling the die and boss prior to removing the die from the boss. 4. A method according to claim 2, wherein the die includes a non-stick coating, the non-stick coating preventing the boss from sticking to the die. 5. A method according to claim 1, wherein the RFID tag includes: a substrate, the RFID chip and antenna located on and the first and second openings passing through the substrate;an adhesive layer located above the substrate; anda top layer secured to the substrate via the adhesive layer, the top layer covering the antenna and RFID chip. 6. A method according to claim 1, wherein the RFID tag further includes: a second adhesive layer located on an underside of the substrate, the second adhesive layer adhering the RFID tag to the object. 7. A method according to claim 1, wherein the first opening is located on a first side of the RFID chip and the second opening is located on an opposing side of the RFID chip, such that the boss covers the RFID chip. 8. A method according to claim 1, wherein the RFID tag includes a third and fourth opening and the object includes a third and fourth protrusion, the third and fourth protrusions extending through the third and fourth openings when the RFID tag is placed on the object. 9. A method according to claim 8, further comprising: melting the third and fourth protrusions to create a second single integral boss, the second boss covering at least a portion of the RFID tag, thereby securing the RFID tag to the object. 10. A method according to claim 9, wherein the second boss covers at least a portion of the antenna. 11. A method according to claim 1, wherein the first and second protrusions are integral with the object. 12. A method according to claim 1, wherein RFID tag is non-functional prior to melting the first and second protrusions to create the boss. 13. A method according to claim 1, wherein removal of the boss during tampering damages the object. 14. A storage container comprising: a body defining the structure of the storage container;a first and second protrusion extending from the surface of the storage container; andan RFID tag configured to be secured to the surface of the storage container, the RFID tag comprising: a substrate having a first and second opening extending therethrough, the first and second openings configured to receive the first and second protrusions extending from the surface of the storage container, wherein the first and second protrusions are configured to be melted to create a single integral boss covering at least a portion of the RFID tag, thereby securing the RFID tag to the object,an RFID chip located on the substrate; andan antenna located on the substrate and electrically connected to the RFID chip. 15. A storage container according to claim 14, wherein the first and second protrusions are configured to be melted using a heated die. 16. A storage container according to claim 15, wherein the die includes a non-stick coating, the non-stick coating preventing the boss from sticking to the die. 17. A storage container according to claim 14, wherein the RFID tag further includes: an adhesive layer located on an underside of the substrate, the adhesive layer adhering the RFID tag to the object. 18. A storage container according to claim 14, wherein the RFID tag further includes: an adhesive layer located above the substrate; anda top layer secured to the substrate via the adhesive layer, the top layer covering the antenna and RFID chip. 19. A storage container according to claim 14, wherein the first and second openings are located on opposite sides of the RFID chip, such that the boss covers the RFID chip. 20. A storage container according to claim 14, wherein the RFID tag includes a third and fourth opening, and the storage container includes a third and fourth protrusion extending from the surface, the third and fourth protrusions extending through the third and fourth openings when the RFID tag is placed on the object. 21. A storage container according to claim 20, wherein the third and fourth protrusions are configured to be melted to create a second single integral boss, the second boss covering at least a portion of the RFID tag, thereby further securing the RFID tag to the object. 22. A storage container according to claim 21, wherein the second boss covers at least a portion of the antenna. 23. A storage container according to claim 14, wherein the first and second protrusions are integral with the object. 24. A storage container according to claim 14, wherein the RFID tag is non-functional prior to melting the first and second protrusions to create the boss. 25. A storage container according to claim 14, wherein removal of the boss during tampering damages the storage container. 26. A system for securing an RFID tag to an object comprising: an RFID tag having a substrate with a first and second opening extending therethrough;an RFID chip located on the substrate;an antenna located on the substrate and electrically connected to the RFID chip; anda first and second protrusion extending from a surface of the object, the first and second protrusions configured to extend through the first and second openings when the RFID tag is placed on the object, the first and second protrusions configured to be melted to create a single integral boss, the boss covering at least a portion of the RFID tag, thereby securing the RFID tag to the object. 27. A system according to claim 26, wherein the first and second protrusions are configured to be melted using a heated die. 28. A system according to claim 27, wherein the die includes a non-stick coating, the non-stick coating preventing the boss from sticking to the die. 29. A system according to claim 26, the RFID tag further including: an adhesive layer located on an underside of the substrate, the adhesive layer adhering the RFID tag to the object. 30. A system according to claim 26, the RFID tag further including: an adhesive layer located above the substrate; anda top layer secured to the substrate via the adhesive layer, the top layer covering the antenna and RFID chip. 31. A system according to claim 26, wherein the first and second openings are located on opposite sides of the RFID chip, such that the boss covers the RFID chip. 32. A system according to claim 26, wherein the RFID tag includes third and fourth openings configured to receive third and fourth protrusions extending from the surface, the third and fourth protrusions extending through the third and fourth openings when the RFID tag is placed on the object. 33. A system according to claim 32, wherein the of third and fourth protrusions are configured to be melted to create a second single integral boss, the second boss covering at least a portion of the RFID tag, thereby further securing the RFID tag to the object. 34. A system according to claim 33, wherein the second boss covers at least a portion of the antenna. 35. A system according to claim 26, wherein the first and second protrusions are integral with the object. 36. A system according to claim 26, wherein the RFID tag is non-functional prior to melting the first and second protrusions to create the boss. 37. A system according to claim 26, wherein removal of the boss during tampering damages the object.
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