Method to strip a portion of an insulated wire
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01Q-001/38
H02G-001/12
출원번호
US-0251974
(2016-08-30)
등록번호
US-9935433
(2018-04-03)
우선권정보
CH-0178/09 (2009-02-06)
발명자
/ 주소
Michalk, Manfred
출원인 / 주소
HID GLOBAL GMBH
대리인 / 주소
Sheridan Ross P.C.
인용정보
피인용 횟수 :
0인용 특허 :
11
초록▼
According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripp
According to the method of stripping a portion of a wire of the invention, the insulated wire including the wire core are first flattened before the insulation is stripped away. The flattening eases the stripping as the insulation is partially cracked and dissociated of the wire core, and the stripping is more efficiently applied on a flat surface. A wire stripping machine and a transponder antenna with stripped portions are also claim as being part of the invention.
대표청구항▼
1. A wire antenna comprising: a. an inner metal core having a circular cross section;b. an insulation layer disposed around the core;c. the metal core and insulation layer having a length defining an axis;d. the metal core further comprising a flattened portion having a first flat outer surface and
1. A wire antenna comprising: a. an inner metal core having a circular cross section;b. an insulation layer disposed around the core;c. the metal core and insulation layer having a length defining an axis;d. the metal core further comprising a flattened portion having a first flat outer surface and a second flat outer surface spaced from the first flat surface by a first dimension, and wherein the first and second flat outer surfaces each have a first edge and a second edge parallel with the wire axis, and a first curved surface interconnecting the first edges of the first and second flat outer surfaces and a second curved surface interconnecting the second edges of the first and second flat outer surfaces, and wherein the first curved surface is spaced from the second curved surface by a second dimension, and wherein the second dimension is at least twenty percent larger than the first dimension, and wherein the insulation layer is absent from at least a portion of the first flat outer portion. 2. The wire antenna of claim 1, wherein the metal core comprises one of copper or silver. 3. The wire antenna of claim 1, wherein the insulation layer comprises one of lacquer or enamel. 4. The wire antenna of claim 1, wherein the plastic properties of the metal core are different from the insulation layer. 5. The wire antenna of claim 1, wherein the insulation layer is absent from at least a portion of the second flat outer portion. 6. The wire antenna of claim 5, wherein the insulation layer is absent from substantially all of the first and second flat outer portions. 7. The wire antenna of claim 6, further comprising an aperture formed completely through the flattened portion from the first flat outer surface to the second flat outer surface. 8. The wire antenna of claim 1, wherein the second dimension is approximately fifty percent larger than the first dimension. 9. The wire antenna of claim 1, wherein the circular cross section of the wire and insulation layer at a location different from a flattened portion has a diameter equal to or less than 250 micrometres. 10. The wire antenna of claim 1, wherein the circular cross section of the wire and insulation layer at a location different from a flattened portion has a diameter equal to or less than 100 micrometres. 11. The wire antenna of claim 1, wherein the insulation layer comprises a first insulation layer and a second insulation layer disposed around the first insulation lawyer, and wherein the second insulation layer is absent from the at least first flat outer portion where the first insulation layer is absent. 12. The wire antenna of claim 11, wherein the first and second insulation layers are absent from substantially all of the first and second flat outer portions. 13. The wire antenna of claim 12, wherein the second insulation layer comprises one of baked enamel, adhesive or thermosetting plastic. 14. The wire antenna of claim 1, wherein the metal core has a first end and a second end and the flattened portion is located between the first and second ends. 15. The wire antenna of claim 1, further comprising a second flattened portion having a first flat outer surface and a second flat outer surface spaced from the first flat surface by a first dimension, and wherein the first and second flat outer surfaces each have a first edge and a second edge parallel with the wire axis, and a first curved surface interconnecting the first edges of the first and second flat outer surfaces and a second curved surface interconnecting the second edges of the first and second flat outer surfaces, and wherein the first curved surface is spaced from the second curved surface by a second dimension, and wherein the second dimension is at least twenty percent larger than the first dimension, and wherein the insulation layer is absent from at least a portion of the second flattened portion. 16. The wire antenna of claim 15, wherein the first and second flattened portions comprise a wire crossing. 17. The wire antenna of claim 15, wherein the first and second flattened portions comprise a watermark. 18. The wire antenna of claim 1, wherein the metal core has a first end and a second end and the flattened portion is located proximate the first end. 19. The wire antenna of claim 1, wherein the flattened portion forms a contact surface to connect an electronic element that includes at least one of a chip, a module, and a switch. 20. A wire antenna comprising: a. a first wire inner metal core having a circular cross section;b. a first insulation layer disposed around the first wire metal core;c. the first wire metal core and first insulation layer having a length defining an axis;d. the first metal core further comprising a first flattened portion having a first flat outer surface and a second flat outer surface spaced from the first flat surface by a first dimension, and wherein the first and second flat outer surfaces each have a first edge and a second edge parallel with the wire axis, and a first curved surface interconnecting the first edges of the first and second flat outer surfaces and a second curved surface interconnecting the second edges of the first and second flat outer surfaces, and wherein the first curved surface is spaced from the second curved surface by a second dimension, and wherein the second dimension is at least twenty percent larger than the first dimension, and wherein the insulation layer is absent from at least a portion of the first flat outer portion;e. a second wire inner metal core having a circular cross section;f. a second insulation layer disposed around the second wire metal core;g. the second wire metal core and second insulation layer having a length defining an axis;h. the second metal core further comprising a second flattened portion having a first flat outer surface and a second flat outer surface spaced from the first flat surface by a first dimension, and wherein the first and second flat outer surfaces each have a first edge and a second edge parallel with the second wire axis, and a first curved surface interconnecting the first edges of the first and second flat outer surfaces and a second curved surface interconnecting the second edges of the first and second flat outer surfaces, and wherein the first curved surface is spaced from the second curved surface by a second dimension, and wherein the second dimension is at least twenty percent larger than the first dimension, and wherein the insulation layer is absent from at least a portion of the second flat outer portion;i. and wherein the first and second flattened portions are connected.
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이 특허에 인용된 특허 (11)
Swiggett Brian E. (Huntington NY) Morino Ronald (Sea Cliff NY) Keogh Raymond J. (Huntington NY) Crowell Jonathan C. (Lakeville MA), Apparatus for making scribed circuit boards and circuit board modifications.
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