Remediation of thermal irregularities in computing environment
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
G06F-001/20
H05K-007/20
출원번호
US-0119017
(2014-04-01)
등록번호
US-9952638
(2018-04-24)
국제출원번호
PCT/CN2014/074523
(2014-04-01)
국제공개번호
WO2015/149272
(2015-10-08)
발명자
/ 주소
Zhou, Shaorong
Wong, Hong W.
출원인 / 주소
Intel Corporation
대리인 / 주소
Patent Capital Group
인용정보
피인용 횟수 :
0인용 특허 :
2
초록▼
In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they ma
In an example, a computing device is disclosed in which processing elements and other active devices may generate thermal irregularities such as hot spots on the casing of a computing device. In some cases, these hot spots may be undesirable from a comfort and usability standpoint or because they may result in thermal damage to system components. To remediate thermal irregularities, including hot spots, a localized depression may be provided in a casing or chassis to enlarge the air gap between the heat source and the bottom casing around the hot spot, so that the bottom casing skin temperature at the hot spot can be lowered with the increased air gap. A heat spreader may also be disposed above the localized depression to better distribute heat over a surface area. In some cases, ribbing may be provided to provide structural support to a heat spreader disposed over a localized depression.
대표청구항▼
1. An apparatus, comprising: a casing for receiving a computing device, having a localized depression disposed to be proximate to a heat source of the computing device, the localized depression having a thickness less than a predominant thickness of the casing; and a heat spreader disposed above the
1. An apparatus, comprising: a casing for receiving a computing device, having a localized depression disposed to be proximate to a heat source of the computing device, the localized depression having a thickness less than a predominant thickness of the casing; and a heat spreader disposed above the localized depression;wherein the heat spreader has a dimension along a first axis greater than a dimension of the localized depression along the first axis, and a dimension along a second axis less than a dimension of the localized depression along the second axis. 2. The apparatus of claim 1, wherein the heat spreader is a graphite sheet or a metallic foil. 3. The apparatus of claim 1, wherein the heat spreader is disposed to substantially block air flow through the localized depression. 4. The apparatus of claim 1, wherein the heat spreader is disposed to substantially permit air flow through the localized depression. 5. The apparatus of claim 4, further comprising a fan with an airflow direction substantially along the second axis for impelling air into a gap between the heat spreader and the localized depression. 6. The apparatus of claim 1, further comprising ribbing disposed to structurally support the heat spreader. 7. A system, comprising: a casing having a localized depression disposed to be proximate to a heat source, the localized depression having a thickness less than a predominant thickness of the casing; anda heat spreader disposed above the localized depression;wherein the heat spreader has a dimension along a first axis greater than a dimension of the localized depression along the first axis, and a dimension along a second axis less than a dimension of the localized depression along the second axis. 8. The system of claim 7, wherein the heat spreader is a graphite or a metallic foil. 9. The system of claim 7, wherein the heat spreader is disposed to substantially block air flow through the localized depression. 10. The system of claim 7, wherein the heat spreader is disposed to substantially permit air flow through the localized depression. 11. The system of claim 10, further comprising a fan with an airflow direction substantially along the second axis for impelling air into a gap between the heat spreader and the localized depression. 12. The system of claim 7, further comprising ribbing disposed to structurally support the heat spreader. 13. A system, comprising: a heat source; anda casing including a localized depression disposed to be proximate to the heat source, the localized depression having a thickness less than a predominant thickness of the casing; anda heat spreader disposed above the localized depression;wherein the heat spreader has a dimension along a first axis greater than a dimension of the localized depression along the first axis, and a dimension along a second axis less than a dimension of the localized depression along the second axis. 14. The device of claim 13, wherein the heat spreader is a graphite sheet or metallic foil. 15. The system of claim 13, wherein the heat spreader is disposed to substantially block air flow through the localized depression. 16. The system of claim 13, wherein the heat spreader is disposed to substantially permit air flow through the localized depression. 17. The system of claim 16, further comprising a fan with an airflow direction substantially along the second axis and disposed to impel air into a gap between the heat spreader and the localized depression. 18. The system of claim 13, further comprising ribbing disposed to structurally support the heat spreader.
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이 특허에 인용된 특허 (2)
Dighde, Rajesh Manohar; Schultz, Bernie; Abzarian, David, Adaptive flow for thermal cooling of devices.
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