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A flexible circuit board whose entire surface has flexibility includes a first substrate portion and a second substrate portion that are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board. The first substrate portion includes a plurali

A flexible circuit board whose entire surface has flexibility includes a first substrate portion and a second substrate portion that are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board. The first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and the second substrate portion includes a plurality of resin layers, which are integrated with one another by intermolecular bonding of a thermoplastic resin.

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1. A flexible circuit board comprising: a first substrate portion; anda second substrate portion; whereinthe first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;the first subs

1. A flexible circuit board comprising: a first substrate portion; anda second substrate portion; whereinthe first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;the first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and has flexibility;the second substrate portion includes a plurality of resin layers, which are stacked on top of one another and integrated with one another by intermolecular bonding of a thermoplastic resin, and has flexibility;the second substrate portion includes a space that accommodates at least a portion of the first substrate portion;in a stacking direction in which the plurality of resin layers of the second substrate portion are stacked, a dimension of the space is greater than or equal to a dimension of the portion of the first substrate portion that is accommodated in the space; andboth the first substrate portion and the second substrate portion include a bending portion. 2. The flexible circuit board according to claim 1, wherein at least one of the first substrate portion and the second substrate portion includes an interlayer connection conductor extending through the resin layer; andat least another one of the first substrate portion and the second substrate portion includes a joint conductor that is directly joined to the interlayer connection conductor. 3. The flexible circuit board according to claim 1, further comprising a bonding resin that is bonded to at least a portion of the first substrate portion and at least a portion of the second substrate portion. 4. The flexible circuit board according to claim 1, wherein the plurality of resin layers of the second substrate portion are greater than the plurality of resin layers of the first substrate portion. 5. The flexible circuit board according to claim 1, wherein a thickness of the first substrate portion is smaller than a thickness of the second substrate portion. 6. The flexible circuit board according to claim 1, wherein a bend angle of the first substrate portion is larger than a bend angle of the second substrate portion. 7. The flexible circuit board according to claim 1, wherein the resin layers of the second substrate portion are made of a liquid crystal polymer resin. 8. The flexible circuit board according to claim 1, wherein the resin layers of the first substrate portion are made of a polyimide. 9. The flexible circuit board according to claim 1, wherein the second substrate portion is provided with an active element, and the first substrate portion is not provided with an active element. 10. A flexible circuit board comprising: a first substrate portion; anda second substrate portion; whereinthe first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;the first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and has flexibility;the second substrate portion includes a plurality of resin layers, which are stacked on top of one another and integrated with one another by intermolecular bonding of a thermoplastic resin, and has flexibility;the second substrate portion includes a space that accommodates at least a portion of the first substrate portion;in a stacking direction in which the plurality of resin layers of the second substrate portion are stacked, a dimension of the space is greater than or equal to a dimension of the portion of the first substrate portion that is accommodated in the space; andthe second substrate portion is configured to be connected to an antenna. 11. The flexible circuit board according to claim 10, wherein at least one of the first substrate portion and the second substrate portion includes an interlayer connection conductor extending through the resin layer; andat least another one of the first substrate portion and the second substrate portion includes a joint conductor that is directly joined to the interlayer connection conductor. 12. The flexible circuit board according to claim 10, further comprising a bonding resin that is bonded to at least a portion of the first substrate portion and at least a portion of the second substrate portion. 13. The flexible circuit board according to claim 10, wherein the plurality of resin layers of the second substrate portion are greater than the plurality of resin layers of the first substrate portion. 14. The flexible circuit board according to claim 10, wherein a thickness of the first substrate portion is smaller than a thickness of the second substrate portion. 15. The flexible circuit board according to claim 10, wherein the first substrate portion and the second substrate portion are bent; anda bend angle of the first substrate portion is larger than a bend angle of the second substrate portion. 16. The flexible circuit board according to claim 10, wherein the resin layers of the second substrate portion are made of a liquid crystal polymer resin. 17. The flexible circuit board according to claim 10, wherein the resin layers of the first substrate portion are made of a polyimide. 18. The flexible circuit board according to claim 10, wherein the second substrate portion is provided with an active element, and the first substrate portion is not provided with an active element. 19. A device comprising: a flexible circuit board including: a first substrate portion; anda second substrate portion;a first circuit board; anda second circuit board; whereinthe first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;the first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and has flexibility;the second substrate portion includes a plurality of resin layers, which are stacked on top of one another and integrated with one another by intermolecular bonding of a thermoplastic resin, and has flexibility;the second substrate portion includes a space that accommodates at least a portion of the first substrate portion;in a stacking direction in which the plurality of resin layers of the second substrate portion are stacked, a dimension of the space is greater than or equal to a dimension of the portion of the first substrate portion that is accommodated in the space;both the first substrate portion and the second substrate portion include a bending portion; andthe first substrate portion is connected to the first circuit board, the second substrate portion is connected to the second circuit board, and the first circuit board and the second circuit board are connected to each other through the flexible circuit board. 20. The device according to claim 19, wherein at least one of the first substrate portion and the second substrate portion includes an interlayer connection conductor extending through the resin layer; andat least another one of the first substrate portion and the second substrate portion includes a joint conductor that is directly joined to the interlayer connection conductor. 21. The device according to claim 19, wherein the second substrate portion is provided with an active element, and the first substrate portion is not provided with an active element. 22. A device comprising: a flexible circuit board including: a first substrate portion; anda second substrate portion;a first circuit board; anda second circuit board; whereinthe first substrate portion and the second substrate portion are adjacent to each other and electrically connected to each other in a planar direction of the flexible circuit board;the first substrate portion includes a plurality of resin layers, which are bonded together with an adhesive, and has flexibility;the second substrate portion includes a plurality of resin layers, which are stacked on top of one another and integrated with one another by intermolecular bonding of a thermoplastic resin, and has flexibility;the second substrate portion includes a space that accommodates at least a portion of the first substrate portion;in a stacking direction in which the plurality of resin layers of the second substrate portion are stacked, a dimension of the space is greater than or equal to a dimension of the portion of the first substrate portion that is accommodated in the space;the second substrate portion is configured to be connected to an antenna; andthe first substrate portion is connected to the first circuit board, the second substrate portion is connected to the second circuit board, the second circuit board includes the antenna, and the first circuit board and the second circuit board are connected to each other through the flexible circuit board. 23. The device according to claim 22, wherein at least one of the first substrate portion and the second substrate portion includes an interlayer connection conductor extending through the resin layer; andat least another one of the first substrate portion and the second substrate portion includes a joint conductor that is directly joined to the interlayer connection conductor. 24. The device according to claim 22, wherein the second substrate portion is provided with an active element, and the first substrate portion is not provided with an active element.