A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the
A data center cooling system includes a thermosiphon, an actuator coupled to the thermosiphon, and a controller. The thermosiphon includes an evaporator; a condenser; and at least one conduit coupled between the evaporator and the condenser to transport a working fluid between the evaporator and the condenser. The controller is coupled to the actuator and configured to operate the actuator to adjust a liquid level of the working fluid in the evaporator based, at least in part, on a parameter associated with a heat load of one or more data center heat generating computing devices.
대표청구항▼
1. A server tray sub-assembly comprises: a motherboard;a plurality of heat generating electronic devices mounted on the motherboard;a thermosiphon mounted on the motherboard, the thermosiphon comprising: an evaporator in heat transfer communication with the plurality of heat generating electronic de
1. A server tray sub-assembly comprises: a motherboard;a plurality of heat generating electronic devices mounted on the motherboard;a thermosiphon mounted on the motherboard, the thermosiphon comprising: an evaporator in heat transfer communication with the plurality of heat generating electronic devices;a condenser fluidly coupled to the evaporator with a fluid conduit that slopes downward from the condenser to the evaporator; anda multi-phase fluid contained in the thermosiphon; anda control system comprising: a sensing device operable to sense a value associated with an amount of heat generated by the plurality of heat generating electronic devices; andan actuator operatively coupled to the thermosiphon to adjust an amount of the multi-phase fluid in the evaporator based, at least in part, on the sensed value. 2. The server tray sub-assembly of claim 1, wherein the actuator is operatively coupled to the condenser and is configured to adjust the condenser based, at least in part, on the sensed value. 3. The server tray sub-assembly of claim 2, wherein the actuator is configured to adjust at least one of a vertical distance between the condenser and the evaporator; a working volume of the condenser; or an angular position of the condenser relative to the motherboard. 4. The server tray sub-assembly of claim 2, wherein the actuator comprises a piston mounted in an interior volume of the condenser. 5. The server tray sub-assembly of claim 4, wherein the piston is configured to adjust a working volume of the condenser based, at least in part, on the sensed value. 6. The server tray sub-assembly of claim 1, wherein the actuator is configured to vibrate the condenser. 7. The server tray sub-assembly of claim 1, wherein the actuator is configured to adjust a flow of a liquid phase of the multi-phase fluid from the condenser to the evaporator based, at least in part, on the sensed value. 8. The server tray sub-assembly of claim 1, wherein the actuator comprises a valve arranged in a liquid line of the fluid conduit. 9. The server tray sub-assembly of claim 1, wherein the actuator comprises a wicking material mounted in a liquid line of the fluid conduit. 10. The server tray sub-assembly of claim 9, wherein the fluid conduit is flexible. 11. The server tray sub-assembly of claim 9, wherein the wicking material comprises an absorbent material. 12. The server tray sub-assembly of claim 11, wherein the absorbent material is configured to absorb a portion of a liquid phase of the multi-phase fluid. 13. The server tray sub-assembly of claim 1, wherein the sensed value comprises at least one of: a temperature of air adjacent the plurality of heat generating electronic devices, a temperature of air adjacent the condenser, a temperature of the plurality of heat generating electronic devices, a temperature of the motherboard, a liquid level of the multi-phase fluid in the evaporator, a pressure of the multi-phase fluid, a temperature of the multi-phase fluid, a power usage of the plurality of heat generating electronic devices, a frequency of one or more of the plurality of heat generating electronic devices, or a utilization of one or more of the plurality of heat generating electronic devices. 14. The server tray sub-assembly of claim 1, wherein the fluid conduit comprises copper or aluminum. 15. The server tray sub-assembly of claim 1, further comprising a fan mounted to the motherboard. 16. The server tray sub-assembly of claim 15, wherein the fan is configured to circulate airflow across the condenser. 17. The server tray sub-assembly of claim 16, further comprising an enhanced heat transfer surface coupled to the condenser. 18. The server tray sub-assembly of claim 17, wherein the fan is positioned on the motherboard to circulate the airflow across the enhanced heat transfer surface coupled to the condenser. 19. The server tray sub-assembly of claim 1, wherein the plurality of heat generating electronic devices comprise at least one data center server device. 20. The server tray sub-assembly of claim 19, wherein the at least one data center server device comprises a processor.
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이 특허에 인용된 특허 (4)
Berchowitz, David M., CPU cooling device using thermo-siphon.
Dante Patrick Bonaquist ; John Fredric Billingham ; Jalal Zia ; Nancy Jean Lynch ; Bayram Arman, Thermo-siphon method for providing refrigeration to a refrigeration load.
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