초록 ▼

Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include

Disclosed are optical devices and methods of manufacturing optical devices. An optical device can include a substrate; an optical emitter chip affixed to the front surface of the substrate; and an optical sensor chip affixed to the front surface of the substrate. The optical sensor chip can include a main sensor and a reference sensor. The optical device can include an opaque dam separating the main optical sensor and the reference sensor. The optical device can include a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor and a second transparent encapsulation block encapsulating the main optical sensor. The optical device can include an opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block with a first opening above the main optical sensor and a second opening above the optical emitter chip.

대표청구항 ▼

1. An optical device comprising: a substrate comprising a front surface;an optical emitter chip comprising a front surface and a rear surface, the rear surface of the optical emitter chip affixed to the front surface of the substrate;an optical sensor chip comprising a front surface and a rear surfa

1. An optical device comprising: a substrate comprising a front surface;an optical emitter chip comprising a front surface and a rear surface, the rear surface of the optical emitter chip affixed to the front surface of the substrate;an optical sensor chip comprising a front surface and a rear surface, the rear surface of the optical sensor chip affixed to the front surface of the substrate, the optical sensor chip further comprising at least one main sensor and at least one reference sensor on the front surface of the optical sensor chip;an opaque dam disposed on the front surface of the optical sensor chip and at least a portion of the front face of the substrate, the dam separating the main optical sensor and the reference sensor;a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor;a second transparent encapsulation block encapsulating the main optical sensor; andan opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block, the opaque encapsulation material comprising a first opening above the main optical sensor and a second opening above the optical emitter chip,wherein the opaque encapsulation material extends between the first transparent encapsulation block and the second transparent encapsulation block and abuts the opaque dam. 2. The optical device of claim 1, wherein the opaque dam further comprises a channel into which the opaque encapsulation material extends. 3. The optical device of claim 1, wherein the opaque encapsulation material further comprises a channel into which the opaque dam extends. 4. The optical device of claim 1, wherein the opaque dam is formed from a first opaque epoxy and the opaque encapsulation material is formed from a second opaque epoxy. 5. The optical device of claim 4, wherein the first opaque epoxy has a first viscosity and the second opaque epoxy has a second viscosity, the second viscosity different from the first viscosity. 6. The optical device of claim 1 further comprising: at least one trench formed in the substrate,wherein the opaque encapsulation material extends into the at least one trench. 7. The optical device of claim 1, wherein a thickness of the opaque dam disposed over the substrate material is different than a second thickness of the opaque dam disposed over the optical sensor chip. 8. The optical device of claim 1, wherein a first portion of the opaque dam disposed on the front surface of the optical sensor has a first thickness, andwherein a second portion of the opaque dam disposed on at least a portion of the front face of the substrate has a second thickness, the first thickness being less than the second thickness. 9. An optical device comprising: a substrate comprising a front surface;an optical emitter chip comprising a front surface and a rear surface, the rear surface of the optical emitter chip affixed to the front surface of the substrate;an optical sensor chip comprising a front surface and a rear surface, the rear surface of the optical sensor chip affixed to the front surface of the substrate, the optical sensor chip further comprising at least one main sensor and at least one reference sensor on the front surface of the optical sensor chip;an opaque dam disposed on the front surface of the optical sensor chip and at least a portion of the front face of the substrate, the dam separating the main optical sensor and the reference sensor;a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor, the first transparent encapsulation block comprising a first passive optical element over the optical emitter chip;a second transparent encapsulation block encapsulating the main optical sensor, the second transparent encapsulation block comprising a second passive optical element over the main optical sensor;first opaque coating material disposed on the first transparent encapsulation block around the first passive optical element;second opaque coating material disposed on the second transparent encapsulation block around the second passive optical element; andan opaque encapsulation material encapsulating the first transparent encapsulation block and the second transparent encapsulation block, the opaque encapsulation material comprising a first opening aligned with the first passive optical element and a second opening aligned with the second optical element,wherein the opaque encapsulation material extends between the first transparent encapsulation block and the second transparent encapsulation block and abuts the opaque dam. 10. The optical device of claim 9, wherein the opaque dam further comprises a channel into which the opaque encapsulation material extends. 11. The optical device of claim 9, wherein the opaque encapsulation material further comprises a channel into which the opaque dam extends. 12. The optical device of claim 9, wherein the opaque dam is formed from a first opaque epoxy and the opaque encapsulation material is formed from a second epoxy. 13. The optical device of claim 12, wherein the first opaque epoxy has a first viscosity and the second opaque epoxy has a second viscosity, the second viscosity different from the first viscosity. 14. The optical device of claim 9 further comprising: at least one trench formed in the substrate,wherein the opaque encapsulation material extends into the at least one trench. 15. The optical device of claim 9, wherein a thickness of the opaque dam disposed over the substrate material is different than a second thickness of the opaque dam disposed over the optical sensor chip. 16. The optical device of claim 9, wherein a first portion of the opaque dam disposed on the front surface of the optical sensor has a first thickness, andwherein a second portion of the opaque dam disposed on at least a portion of the front face of the substrate has a second thickness, the first thickness being less than the second thickness. 17. The optical device of claim 9, wherein first passive optical element is a lens element, the second passive optical element is a lens element, or the first and second passive optical elements are lens elements. 18. An optical device comprising: a substrate comprising a front surface;an optical emitter chip comprising a front surface and a rear surface, the rear surface of the optical emitter chip affixed to the front surface of the substrate;an optical sensor chip comprising a front surface and a rear surface, the rear surface of the optical sensor chip affixed to the front surface of the substrate, the optical sensor chip further comprising at least one main sensor and at least one reference sensor on the front surface of the optical sensor chip;an opaque dam disposed on the front surface of the optical sensor chip and at least a portion of the front face of the substrate, the dam separating the main optical sensor and the reference sensor;a first transparent encapsulation block encapsulating the optical emitter chip and the reference optical sensor, the first transparent encapsulation block comprising a first passive optical element over the optical emitter chip;a second transparent encapsulation block encapsulating the main optical sensor, the second transparent encapsulation block comprising a second passive optical element over the main optical sensor;first opaque coating material disposed on the first transparent encapsulation block around the first passive optical element, the first opaque coating material covering substantially all of a top surface of the first transparent encapsulation block;second opaque coating material disposed on the second transparent encapsulation block around the second passive optical element, the second opaque coating material covering substantially all of a top surface of the second encapsulation block; andan opaque encapsulation material encapsulating a plurality of side surfaces of the first transparent encapsulation block and encapsulating a plurality of side surfaces of the second transparent encapsulation block,wherein the opaque encapsulation material extends between the first transparent encapsulation block and the second transparent encapsulation block and abuts the opaque dam, andwherein the opaque encapsulation material abuts the first opaque coating material along one or more edges between the top surface of the first transparent encapsulation block and the one or more side surfaces of the first transparent encapsulation block, andwherein the opaque encapsulation material abuts the second opaque coating material along one or more edges between the top surface of the second transparent encapsulation block and the one or more side surfaces of the second transparent encapsulation block. 19. The optical device of claim 18, wherein the opaque dam further comprises a channel into which the opaque encapsulation material extends. 20. The optical device of claim 18, wherein the opaque encapsulation material further comprises a channel into which the opaque dam extends. 21. The optical device of claim 18, wherein the opaque dam is formed from a first opaque epoxy and the opaque encapsulation material is formed from a second epoxy. 22. The optical device of claim 21, wherein the first opaque epoxy has a first viscosity and the second opaque epoxy has a second viscosity, the second viscosity different from the first viscosity. 23. The optical device of claim 18 further comprising: at least one trench formed in the substrate,wherein the opaque encapsulation material extends into the at least one trench. 24. The optical device of claim 18, wherein a thickness of the opaque dam disposed over the substrate material is different than a second thickness of the opaque dam disposed over the optical sensor chip. 25. The optical device of claim 18, wherein first passive optical element is a lens element, the second passive optical element is a lens element, or the first and second passive optical elements are lens elements.