초록 ▼

In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two comp

In the case of a method according to the invention for connecting at least two components of an endoscope, at least one brazing preform, which contains a high-temperature brazing solder, is introduced into at least one brazing solder reservoir of at least one of the components, the at least two components are held in relation to one another in such a way that at least one brazing gap that is in capillary connection with the at least one brazing solder reservoir is formed between joining regions of the at least two components that are assigned to one another, and the arrangement (1, 22) comprising the at least two components and the at least one brazing preform is heated to a brazing temperature of the high-temperature brazing solder. The invention also relates to a component of an endoscope and to an endoscope.

대표청구항 ▼

1. Method for connecting at least two components of an endoscope or medical instrument, the method comprising: introducing at least one brazing preform, which contains a high-temperature brazing solder, into at least one brazing solder reservoir of at least one of the components,arranging the at lea

1. Method for connecting at least two components of an endoscope or medical instrument, the method comprising: introducing at least one brazing preform, which contains a high-temperature brazing solder, into at least one brazing solder reservoir of at least one of the components,arranging the at least two components so that the at least two components are held in relation to one another in such a way that at least one brazing gap, that is in capillary connection with the at least one brazing solder reservoir, is formed between joining regions of the at least two components that are assigned to one another, the at least one brazing solder reservoir and the at least one brazing gap being formed such that a volume of the at least one brazing solder reservoir is greater than a volume of the brazing gap by at least an amount that corresponds to a proportion of a binder in the at least one brazing preform, andheating the at least two components and the at least one brazing preform to a brazing temperature of the high-temperature brazing solder. 2. The method according to claim 1, wherein, for forming the at least one brazing gap, the at least two components are held against one another with interlocking, frictional or material-bonding engagement. 3. The method according to claim 1, wherein the at least two components have a plurality of joining locations that are formed by joining regions assigned to one another and to which at least one brazing solder reservoir is respectively assigned. 4. The method according to claim 1, wherein more than two components are connected to one another, at least two joining locations that are formed by joining regions assigned to one another being provided. 5. The method according to claim 1, wherein the high-temperature brazing solder is a nickel-based solder or an iron-based solder. 6. The method according to claim 1, wherein the brazing preform is produced from a brazing mat. 7. The method according to claim 1, wherein the at least one brazing preform introduced into the at least one brazing solder reservoir is fixed in the at least one brazing solder reservoir. 8. The method according to claim 7, wherein the at least one brazing preform introduced into the at least one brazing solder reservoir is fixed in the at least one brazing solder reservoir by adhesion or with interlocking engagement. 9. The method according to claim 1, wherein the at least one brazing solder reservoir and the at least one brazing preform are at least dimensioned in such a way that the brazing solder reservoir is substantially filled by the brazing preform when the brazing preform is introduced into the at least one brazing solder reservoir and, during the heating, the brazing gap is substantially filled completely with brazing solder. 10. The method according to claim 1, wherein the at least one brazing solder reservoir includes at least a first brazing solder reservoir and a second brazing solder reservoir, wherein one of the at least two components is a shank having a first disk flange provided at a proximal end thereof and a second disk flange provided at a distal end thereof, the first disk flange having an annular groove extending around an outer periphery thereof, the annular groove of the first disk flange forming the first brazing solder reservoir and the second disk flange having an annular groove extending around an outer periphery thereof, the annular groove of the second disk flange forming the second brazing solder reservoir,wherein the at least one brazing preform includes at least a first brazing preform and a second brazing preform,wherein the introducing of the at least one brazing preform includes introducing the first brazing preform into the first brazing solder reservoir of the first disk flange and introducing the second brazing preform into the second brazing solder reservoir,wherein another one of the at least two components is a hollow housing, andwherein the arranging of the at least two components includes sliding the shank inside the hollow housing after introducing the first brazing preform and the second brazing preform.