Methods for surface attachment of flipped active components
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-023/00
H01L-023/31
H01L-025/075
H01L-025/07
H01L-021/683
H05K-001/18
출원번호
US-0423159
(2017-02-02)
등록번호
US-10008465
(2018-06-26)
발명자
/ 주소
Bower, Christopher
출원인 / 주소
X-Celeprint Limited
대리인 / 주소
Choate, Hall & Stewart LLP
인용정보
피인용 횟수 :
1인용 특허 :
128
초록▼
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of th
An active substrate includes a plurality of active components distributed over a surface of a destination substrate, each active component including a component substrate different from the destination substrate, and each active component having a circuit and connection posts on a process side of the component substrate. The connection posts may have a height that is greater than a base width thereof, and may be in electrical contact with the circuit and destination substrate contacts. The connection posts may extend through the surface of the destination substrate contacts into the destination substrate connection pads to electrically connect the connection posts to the destination substrate contacts.
대표청구항▼
1. An active component, comprising: a circuit structure having a post surface and an opposing stamp surface, the circuit structure including an electronic circuit;a plurality of electrically conductive connection posts protruding from the post surface, wherein the connection posts are physically con
1. An active component, comprising: a circuit structure having a post surface and an opposing stamp surface, the circuit structure including an electronic circuit;a plurality of electrically conductive connection posts protruding from the post surface, wherein the connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; anda fractured component tether physically connected to the circuit structure. 2. The active component of claim 1, wherein the stamp surface is configured for adhesion to a pillar feature of a stamp. 3. The active component of claim 2, wherein the connection posts have a connection post height and wherein the pillar feature of the stamp has a height that is greater than or equal to the connection post height. 4. The active component of claim 1, wherein the connection posts each have a height that is greater than its base width. 5. The active component of claim 1, wherein the connection posts each have a base width that is greater than its peak width. 6. The active component of claim 1, wherein the connection posts each have a base area that is greater than its peak area. 7. The active component of claim 1, wherein the electrical connections comprise a conductive metal. 8. The active component of claim 6, wherein the conductive metal is aluminum, titanium, tungsten, copper, silver, or gold. 9. The active component of claim 1, wherein the connection posts each have a peak that is a sharp point, and wherein the connection posts comprise a high elastic modulus metal. 10. The active component of claim 1, wherein the active component is one or more of an integrated circuit, a transistor, and a capacitor. 11. The active component of claim 1, wherein the first surface of the active component has a dimension from 5 microns to 5000 microns. 12. The active component of claim 1, wherein the active component is an LED. 13. A wafer comprising: a circuit structure having a post surface and an opposing stamp surface, the circuit structure including an electronic circuit;a plurality of electrically conductive connection posts protruding from the post surface, wherein the connection posts are physically connected to the circuit structure and electrically connected to the electronic circuit; anda breakable component tether releasably attaching the circuit structure to the wafer. 14. A printed structure comprising: a destination substrate;one or more active components on the destination substrate, each active component having a post surface and an opposing stamp surface and comprising a plurality of conductive connection posts protruding from the post surface and a broken tether; andwherein the destination substrate has two or more electrical contacts and each connection post extends into or through an electrical contact of the destination substrate to electrically connect the electrical contacts to the connection posts. 15. The printed structure of claim 14, wherein the two or more electrical contacts have a composition softer than that of the connection posts. 16. The printed structure of claim 14, wherein the connection posts adhere to the electrical contacts. 17. The printed structure of claim 14, comprising an adhesive layer over the destination electrical contacts to adhere the active components to the destination substrate. 18. The printed structure of claim 14, wherein a surface area of each of the electrical contacts is greater than a peak area of each of the connection posts. 19. The printed structure of claim 14, wherein a surface area of each of the electrical contacts is greater than a base area of each of the connection posts. 20. The printed structure of claim 14, wherein the connection posts of a given active component are separated by a distance that is greater than a distance separating their corresponding electrical contacts. 21. The printed structure of claim 14, wherein the connection posts are separated by a distance that is greater than a dimension of the electrical contacts. 22. The printed structure of claim 14, wherein the one or more active components comprises an array of active components.
연구과제 타임라인
LOADING...
LOADING...
LOADING...
LOADING...
LOADING...
이 특허에 인용된 특허 (128)
Ellinger, Carolyn R.; Kane, Paul J., 2D/3D switchable color display apparatus with narrow band emitters.
Lebby Michael S. ; Stafford John W. ; Richard Fred V., Integrated electro-optical package with LED display chip and substrate with drivers and central opening.
Kim, Tae-hyung; Sone, Cheol-soo; Yang, Jong-in; Song, Sang-yeob; Lee, Si-hyuk, Light-emitting device including a connection layer formed on a side surface thereof.
Suzuki Tsutomu (Toyohashi JPX) Suzuki Ikuo (Toyohashi JPX), Method for engraving and/or etching with image-carrying mask and photo-sensitive laminate film for use in making the mas.
Kasuga,Masashi; Kamakura,Tomoyuki; Miyazawa,Wakao; Tsuchihashi,Fukumi, Method of manufacturing electronic device including aligning first substrate, second substrate and mask, and transferring object from first substrate to second substrate, including irradiating object.
Iwafuchi, Toshiaki; Yanagisawa, Yoshiyuki; Oohata, Toyoharu, Method of transferring a device, a method of producing a device holding substrate, and a device holding substrate.
Bower, Christopher; Menard, Etienne; Meitl, Matthew, Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby.
Chai Bruce H. T. (Oviedo FL), Modified wurtzite structure oxide compounds as substrates for III-V nitride compound semiconductor epitaxial thin film g.
Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao, Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp.
Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
Nuzzo, Ralph G.; Rogers, John A.; Menard, Etienne; Lee, Keon Jae; Khang, Dahl-Young; Sun, Yugang; Meitl, Matthew; Zhu, Zhengtao; Ko, Heung Cho; Mack, Shawn, Printable semiconductor structures and related methods of making and assembling.
Rogers, John A.; Kim, Tae Ho; Choi, Won Mook; Kim, Dae Hyeong; Meitl, Matthew; Menard, Etienne; Carlisle, John, Printable, flexible and stretchable diamond for thermal management.
Rogers, John A.; Nuzzo, Ralph G.; Meitl, Matthew; Ko, Heung Cho; Yoon, Jongseung; Menard, Etienne; Baca, Alfred J., Release strategies for making transferable semiconductor structures, devices and device components.
Rogers, John A.; Nuzzo, Ralph G.; Meitl, Matthew; Ko, Heung Cho; Yoon, Jongseung; Menard, Etienne; Baca, Alfred J., Release strategies for making transferable semiconductor structures, devices and device components.
Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
Rogers, John A.; Khang, Dahl-Young; Sun, Yugang; Menard, Etienne, Stretchable form of single crystal silicon for high performance electronics on rubber substrates.
Hotelling, Steve Porter; Chen, Wei; Krah, Christoph Horst; Elias, John Greer; Yao, Wei Hsin; Zhong, John Z.; Hodge, Andrew Bert; Land, Brian Richards; Boer, Willem den, Touch screen liquid crystal display.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.