Thermoelectric refrigeration system control scheme for high efficiency performance
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F25B-021/04
F25B-021/02
출원번호
US-0888791
(2013-05-07)
등록번호
US-10012417
(2018-07-03)
발명자
/ 주소
Edwards, Jesse W.
Therrien, Robert Joseph
June, M. Sean
출원인 / 주소
Phononic, Inc.
대리인 / 주소
Withrow & Terranova, PLLC
인용정보
피인용 횟수 :
1인용 특허 :
201
초록▼
A method of controlling a heat exchanger including thermoelectric coolers to maintain set point temperature of a chamber. The method includes receiving temperature data indicative of a temperature of the chamber and selectively controlling two or more subsets of thermoelectric coolers based on the t
A method of controlling a heat exchanger including thermoelectric coolers to maintain set point temperature of a chamber. The method includes receiving temperature data indicative of a temperature of the chamber and selectively controlling two or more subsets of thermoelectric coolers based on the temperature of the chamber. Selectively controlling the two or more subsets includes operating each thermoelectric cooler in a first subset at or near the point where the coefficient of performance is maximized (QCOPmax) by providing a current or voltage with amplitude corresponding to QCOPmax (ICOPmax, VCOPmax) when the temperature of the chamber is within a predefined steady state range including the set point temperature.
대표청구항▼
1. A method of controlling a heat exchanger comprising a plurality of thermoelectric coolers to maintain a set point temperature of a chamber, the method comprising: receiving temperature data indicative of a temperature of the chamber; andselectively controlling two or more subsets of thermoelectri
1. A method of controlling a heat exchanger comprising a plurality of thermoelectric coolers to maintain a set point temperature of a chamber, the method comprising: receiving temperature data indicative of a temperature of the chamber; andselectively controlling two or more subsets of thermoelectric coolers in the plurality of thermoelectric coolers based on the temperature of the chamber;wherein selectively controlling the two or more subsets of thermoelectric coolers comprises operating each thermoelectric cooler in a first subset of thermoelectric coolers from the plurality of thermoelectric coolers at or near the point where the coefficient of performance is maximized (QCOPmax) by providing a current or voltage with amplitude corresponding to QCOPmax (ICOPmax, VCOPmax) when the temperature of the chamber is within a predefined steady state range including the set point temperature. 2. The method of claim 1, wherein each subset of thermoelectric coolers includes one or more different thermoelectric coolers from the plurality of thermoelectric coolers. 3. The method of claim 1, wherein each thermoelectric cooler in the plurality of thermoelectric coolers is a thin film thermoelectric device. 4. The method of claim 1, wherein selectively controlling the two or more subsets of thermoelectric coolers based on the temperature of the chamber further comprises: activating the first subset of thermoelectric coolers from the plurality of thermoelectric coolers when the temperature of the chamber is within the steady state range including the set point temperature; andmaintaining a second subset of thermoelectric coolers from the plurality of thermoelectric coolers in an inactive state such that each thermoelectric cooler in the second subset of thermoelectric coolers is dormant when the temperature of the chamber is within the steady state range. 5. The method of claim 1, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: determining if the temperature of the chamber exceeds an upper threshold of the steady state range. 6. The method of claim 5, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: increasing a duty cycle of the first subset of thermoelectric coolers in response to determining that the temperature of the chamber exceeds the upper threshold of the steady state range. 7. The method of claim 5, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises, in response to determining that the temperature of the chamber exceeds the upper threshold of the steady state range, increasing a current provided to the first subset of thermoelectric coolers. 8. The method of claim 5, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises, in response to determining that the temperature of the chamber exceeds the upper threshold of the steady state range, activating a second subset of thermoelectric coolers from the plurality of thermoelectric coolers. 9. The method of claim 5, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises, in response to determining that the temperature of the chamber exceeds the upper threshold of the steady state range: activating one or more additional subsets of thermoelectric coolers from the plurality of thermoelectric coolers. 10. The method of claim 9, wherein activating the one or more additional subsets of thermoelectric coolers comprises activating the one or more additional subsets of thermoelectric coolers to operate at QCOPmax. 11. The method of claim 9, wherein activating the one or more additional subsets of thermoelectric coolers further comprises increasing a capacity of the one or more additional subsets of thermoelectric coolers from QCOPmax to a value up to or equal to Qmax. 12. The method of claim 1, wherein the heat exchanger further includes a second plurality of thermoelectric coolers, and the method further comprises: selectively controlling two or more subsets of thermoelectric coolers in the second plurality of thermoelectric coolers separately of the two or more subsets of thermoelectric coolers in the plurality of thermoelectric coolers. 13. The method of claim 12, wherein selectively controlling the two or more subsets of thermoelectric coolers in the second plurality of thermoelectric coolers comprises: activating at least one of the two or more subsets of thermoelectric coolers in the second plurality of thermoelectric coolers when the temperature of the chamber exceeds an upper threshold of the steady state range including the set point temperature. 14. The method of claim 1, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: determining if the temperature of the chamber is less than a lower threshold of the steady state range including the set point temperature. 15. The method of claim 14, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: decreasing a current provided to at least one subset of the two or more subsets of thermoelectric coolers in response to determining that the temperature of the chamber is less than the lower threshold of the steady state range. 16. The method of claim 1, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: determining if the temperature of the chamber exceeds a maximum allowable temperature for the chamber. 17. The method of claim 16, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: determining if a temperature at a reject side of the heat exchanger exceeds a maximum allowable temperature for the reject side of the heat exchanger. 18. The method of claim 17, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: decreasing a current provided to at least one of the two or more subsets of thermoelectric coolers when the temperature of the chamber exceeds the maximum allowable temperature for the chamber and the temperature at the reject side of the heat exchanger exceeds the maximum allowable temperature for the reject side of the heat exchanger. 19. The method of claim 17, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises: deactivating at least one of the two or more subsets of thermoelectric coolers when the temperature of the chamber exceeds the maximum allowable temperature for the chamber and the temperature at the reject side of the heat exchanger exceeds the maximum allowable temperature for the reject side of the heat exchanger. 20. The method of claim 17, wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises, in response to determining that the temperature of the chamber is above the maximum allowable temperature for the chamber and determining that the temperature at the reject side of the heat exchanger is below the maximum allowable temperature for the reject side of the heat exchanger: increasing a current provided to at least one of the two or more subsets of thermoelectric coolers up to Imax; andactivating at least one subset of the two or more subsets of thermoelectric coolers that was previously deactivated. 21. The method of claim 1, further comprising: determining that a temperature at a reject side of the heat exchanger exceeds a maximum allowable temperature for the reject side of the heat exchanger;wherein selectively controlling the two or more subsets of thermoelectric coolers further comprises controlling the two or more subsets of thermoelectric coolers to reduce the temperature at the reject side of the heat exchanger in response to determining that the temperature at the reject side of the heat exchanger exceeds the maximum allowable temperature for the reject side of the heat exchanger. 22. The method of claim 21, wherein controlling the two or more subsets of thermoelectric coolers to reduce the temperature at the reject side of the heat exchanger comprises: deactivating at least one of the two or more subsets of thermoelectric coolers. 23. The method of claim 1, wherein the chamber is a cooling chamber. 24. A system comprising: a plurality of thermoelectric coolers; anda controller associated with the plurality of thermoelectric coolers, the controller configured to: receive temperature data indicative of a temperature of a chamber; andselectively control two or more subsets of thermoelectric coolers in the plurality of thermoelectric coolers based on the temperature of the chamber such that each in a first subset of thermoelectric coolers from the two or more subsets of thermoelectric coolers operates at or near the point where the coefficient of performance is maximized (QCOPmax) by providing a current or voltage with amplitude corresponding to QCOPmax (ICOPmax, VCOPmax) when the temperature of the chamber is within a steady state range including a set point temperature. 25. A system comprising: a heat exchanger comprising a plurality of thermoelectric coolers;a controller associated with the plurality of thermoelectric coolers configured to: select one or more control schemes from a set of control schemes of the controller based on temperature data and a desired performance profile, the set of control schemes comprising two or more of a group consisting of: separately controlling activation and deactivation of each subset of thermoelectric coolers of one or more subsets of thermoelectric coolers in the plurality of thermoelectric coolers, separately controlling a current provided to each subset of the one or more subsets of thermoelectric coolers in the plurality of thermoelectric coolers, and separately controlling a duty cycle of each subset of thermoelectric coolers of the one or more subsets of thermoelectric coolers in the plurality of thermoelectric coolers; andcontrol the one or more subsets of thermoelectric coolers in the plurality of thermoelectric coolers according to the one or more control schemes selected from the set of control schemes of the controller such that each thermoelectric cooler in a first subset of thermoelectric coolers from the one or more subsets of thermoelectric coolers operates at or near QCOPmax when a temperature of a chamber is within a steady state range including a set point temperature. 26. The system of claim 25, wherein the temperature data comprises a temperature of a cooling chamber associated with the heat exchanger. 27. The system of claim 25, wherein the one or more control schemes selected from the set of control schemes comprise the control scheme of separately controlling the activation and deactivation of each subset of thermoelectric coolers, and the controller is further configured to: activate at least one subset of thermoelectric coolers in the one or more subsets of thermoelectric coolers and deactivate at least one subset of thermoelectric coolers in the one or more subsets of thermoelectric coolers for a steady state mode of operation. 28. The system of claim 25, wherein the one or more control schemes selected from the set of control schemes comprise the control scheme of separately controlling the current provided to each subset of thermoelectric coolers, and the controller is further configured to: control the current provided to at least one subset of thermoelectric coolers to be approximately ICOPmax for a steady state mode of operation.
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Rockenfeller Uwe (Boulder City NV) Kirol Lance D. (Boulder City NV), Refrigerators/freezers incorporating solid-vapor sorption reactors capable of high reaction rates.
Radermacher K. Reinhard H. (Silver Spring MD) Kim Kwangil (Hyattsville MD) Kopko William L. (Springfield VA) Pannock Jurgen (Stevensville MI), Tandem refrigeration system.
Phillips, Alfred L.; Khrustalev, Dmitry K.; Wert, Kevin L.; Wilson, Michael J.; Wattelet, Jonathan P.; Broadbent, John, Thermal bus for electronics systems.
Chrysler Gregory M. (Poughkeepsie NY) Chu Richard C. (Poughkeepsie NY) Simons Robert E. (Poughkeepsie NY) Vader David T. (Mechanicsburg PA), Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability.
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Koch Gerd,DEX ; Leipertz Alfred,DEX ; Grischke Martin,DEX, Use of plasma polymer layer sequences as functional layers in material transport or heat exchanger systems.
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