초록 ▼

A package, able to encapsulate at least one component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of the side walls includes exterior electrical connection elements linked electrically to the interior of t

A package, able to encapsulate at least one component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of the side walls includes exterior electrical connection elements linked electrically to the interior of the cavity, the exterior connection elements able to interconnect with an exterior circuit such that the side wall faces the exterior circuit when the exterior connection elements are interconnected with the circuit.

대표청구항 ▼

1. A package, able to encapsulate at least one RF frequency component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of said side walls includes exterior electrical connection elements provided on an exterior

1. A package, able to encapsulate at least one RF frequency component, forming a closed cavity of Faraday cage type having side walls resting on a base and that are surmounted by a cover, wherein at least one of said side walls includes exterior electrical connection elements provided on an exterior face of said at least one side wall, the exterior electrical connection elements are linked electrically to an interior of said cavity, said exterior electrical connection elements being able to interconnect with an exterior circuit such that the exterior face of said at least one side wall faces said exterior circuit. 2. The package as claimed in claim 1, wherein said exterior electrical connection elements are conductive balls. 3. The package as claimed in claim 1, wherein said at least one side wall comprises an insulating material covered on an exterior side with a layer comprising a plurality of conductive surfaces that are insulated electrically from one another and covered on an interior side with a single conductive surface, said exterior electrical connection elements being fixed on said conductive surfaces. 4. The package as claimed in claim 3, wherein said exterior electrical connection elements form a monolithic block with said conductive surfaces. 5. The package as claimed in claim 3, wherein, with the base including an exterior conductive surface forming a ground, a conductive surface of said at least one side wall is linked electrically to said surface forming a ground. 6. The package as claimed in claim 1, wherein at least one of said plurality of electrical connection elements is linked electrically to the interior of said cavity by a metalized hole, said metalized hole being linked electrically by one end to the respective exterior electrical connection element and by another end to an interior conductive surface of said base. 7. The package as claimed in claim 5, wherein said base includes an interior conductive surface forming a pad for receiving said at least one RF frequency component and able to be linked electrically to a ground, said interior conductive surface being linked electrically to the exterior conductive surface of said base by at least one metalized hole passing through the insulating material of said base, said at least one RF frequency component having signal inputs and outputs connected to an interior surface of said base linked electrically to the exterior electrical connection elements. 8. The package as claimed in claim 5, wherein said base includes a part without insulating material so as to enable the mounting of said at least one RF frequency component directly on the exterior conductive surface of said base. 9. The package as claimed in claim 1, wherein at least one other side wall comprises an insulating material covered with at least one conductive layer. 10. The package as claimed in claim 1, wherein at least one other wall includes at least one receiving pad suitable for the mounting of at least one other component, said other component having signal inputs and outputs linked electrically to an interior conductive surface of said base, which is itself linked electrically to the exterior electrical connection elements. 11. The package as claimed in claim 1, wherein the other side walls are made entirely of metal. 12. The package as claimed in claim 1, wherein the cover comprises an insulating material covered with at least one conductive layer. 13. The package as claimed in claim 1, wherein the cover includes at least one receiving pad suitable for the mounting of at least one other component, said other component having inputs and outputs-linked electrically to an interior conductive surface of said base, which is itself linked electrically to the exterior electrical connection elements. 14. The package as claimed in claim 1, wherein the cover is made entirely of metal. 15. An assembly comprising a package as claimed in claim 1 and a multilayer circuit including at least one ground plane and conductive tracks, at least one metalized hole being produced in said circuit facing at least one of said exterior electrical connection elements of said package linked electrically to the ground of said at least one RF frequency component, the exterior electrical connection elements being linked to said conductive tracks, said package being mounted such that a plane of said base of said package is perpendicular to the at least one ground plane of said circuit.