Metal-laminated polyimide substrate, and method for production thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B32B-015/08
C23C-018/22
C23C-018/32
H05K-003/38
C23C-018/16
C23C-018/20
H05K-003/18
B32B-015/20
B32B-027/28
C23C-018/30
H05K-001/03
출원번호
US-0666872
(2008-06-26)
등록번호
US-10021789
(2018-07-10)
우선권정보
JP-2007-174504 (2007-07-02)
국제출원번호
PCT/JP2008/001677
(2008-06-26)
§371/§102 date
20091228
(20091228)
국제공개번호
WO2009/004774
(2009-01-08)
발명자
/ 주소
Ochi, Shinya
Nakagami, Ryuichi
Kohtoku, Makoto
Hamada, Mika
출원인 / 주소
EBARA-UDYLITE CO., LTD.
대리인 / 주소
Wenderoth, Lind & Ponack, L.L.P.
인용정보
피인용 횟수 :
0인용 특허 :
9
초록▼
An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal lay
An object is to provide a laminated polyimide substrate, and a method for the production thereof, in which various properties are ensured and/or provided by effectively controlling changes over time under stringent conditions, while ensuring sufficient adhesion between a polyimide film and metal layer. A laminated polyimide substrate comprises a polyimide layer, an alkali-treated layer derived from the polyimide layer, and a metal layer, arranged in that order, wherein the alkali-treated layer contains an anionic functional group, and is a laminated structure having a layer containing a metal catalyst arranged on the metal layer side and a layer containing a complex of the metal catalyst arranged on the polyimide layer side.
대표청구항▼
1. A method for producing a laminated polyimide substrate, comprising: subjecting a surface of a polyimide layer to alkali treatment to form an alkali-treated layer containing an anionic functional group derived from the polyimide layer;subjecting the alkali-treated layer to a palladium catalyst-imp
1. A method for producing a laminated polyimide substrate, comprising: subjecting a surface of a polyimide layer to alkali treatment to form an alkali-treated layer containing an anionic functional group derived from the polyimide layer;subjecting the alkali-treated layer to a palladium catalyst-imparting treatment to introduce a complex of the palladium catalyst;subjecting the alkali-treated layer containing the complex of the palladium catalyst to a reducing treatment to form a laminated structure having a layer containing the palladium catalyst on a surface side of the alkali-treated layer and a layer containing the complex of the palladium catalyst on a polyimide layer side of the alkali-treated layer; andforming a metal layer on the surface of the polyimide layer, wherein the metal layer is a laminated structure having a layer formed by electroless nickel phosphorous plating and a layer formed by electrolytic plating, and wherein a peel strength between the metal layer and the polyimide layer is at least 0.35 N/mm before and after 168 hours of exposure in a 150° C. environment when a total thickness of the metal layer is greater than or equal to 8 μm and less than 18 μm,wherein the alkali-treated layer has a thickness of 40 nm or less,wherein during said subjecting of the alkali-treated layer to the reducing treatment, the layer containing the palladium catalyst and the layer containing the complex of the palladium catalyst are adjusted to a film thickness ratio of 1:7 to 7:1,wherein the layer containing the palladium catalyst and the layer containing the complex of the palladium catalyst each have a thickness of 1 to 15 nm,wherein the layer formed by electroless nickel phosphorous plating has a phosphorus-rich layer on the alkali-treated layer side and a non-phosphorus-rich layer on the surface side, andwherein the layer formed by electroless nickel phosphorous plating has ratio of phosphorus concentrations between the phosphorus-rich layer and the non-phosphorus-rich layer of 10:5 to 10:8, as determined by Auger electron microscopy, and wherein the layer formed by electroless nickel phosphorous plating has ratio of thickness between the phosphorus-rich layer and the non-phosphorus-rich layer of 1:9 to 9:1. 2. The method according to claim 1, wherein the reducing treatment is carried out using at least one kind of reducing agent selected from the group consisting of NaBH4, KBH4hydrazine, dimethylamine borane, and trimethylamine borane. 3. The method according to claim 1, wherein during said subjecting of the alkali-treated layer to the reducing treatment, the layer containing the palladium catalyst and the layer containing the complex of the palladium catalyst are adjusted to a film thickness ratio of 1:4 to 4:1. 4. The method according to claim 1, wherein the alkali-treated layer has a thickness of 5 to 40 nm. 5. The method according to claim 1, wherein the peel strength between the metal layer and the polyimide layer is at least 0.40 N/mm before and after 168 hours of exposure in a 150° C. environment when a total thickness of the metal layer is greater than or equal to 8 μm and less than 18 μm. 6. The method according to claim 1, wherein the alkali-treated layer is present in a thickness of no more than 10% of a thickness of the polyimide layer. 7. The method according to claim 1, wherein the anionic functional group is a carboxyl group. 8. The method according to claim 1, wherein the polyimide layer has a thickness of about 1 μm to 100 μm. 9. The method according to claim 1, wherein the polyimide layer has a 10-point mean roughness of 100 nm or less measured in accordance with JIS B0601 (1994). 10. The method according to claim 1, wherein the alkali treatment comprises immersing the polyimide layer for about 10 seconds to 50 minutes in an alkali solution having a concentration of about 0.01 to 10 mol/L at a temperature ranging from about 20 to 100° C., thereby opening the imide rings of the polyimide layer by means of hydrolysis, and resulting in polyamic acid ions and carboxyl groups. 11. The method according to claim 1, wherein the complex of the palladium catalyst is Formula (I) wherein L is an alkylene group,wherein R is an amino group or guanidyl group, andwherein the complex of the palladium catalyst is a trans isomer, which is shown in Formula (I), or a cis isomer of Formula (I), or mixtures thereof. 12. The method according to claim 11, wherein the alkylene group in Formula (I) has 1 to 20 carbon atoms. 13. The method according to claim 1, wherein the palladium catalyst-imparting treatment is carried out at a temperature in the range of about 20 to 100° C. for about 1 second to 10 hours, and allows cationic groups in the complex of the palladium catalyst to interact with anionic functional groups in the alkali-treated layer of the polyimide layer so that the complex of the palladium catalyst is introduced into the alkali-treated layer. 14. The method according to claim 1, wherein the reducing treatment is carried out by immersing the alkali-treated layer in a solution containing a reducing agent, or by spraying or applying the solution. 15. The method according to claim 1, further comprising at least one treatment selected from the group consisting of physical roughening treatment, surface degreasing treatment, solvent washing or water washing, corrosion resistance treatment, drying, and combinations thereof.
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이 특허에 인용된 특허 (9)
Brummett Charles Roscoe (Harrisburg PA) Shaak Ray Ned (Lebanon PA) Andrews Daniel Marshall (Harrisburg PA), Catalyst for electroless deposition of metals.
Rychwalski James E. (Medway MA) Ciccolo Paul J. (Ashland MA) Currie Robert B. (Berkley MA) Knudsen Philip D. (Northboro MA), Conditioning process for electroless plating of polyetherimides.
Shirk ; Albert ; Redmond ; John Peter, Process for rendering kapton or other polyimide film photo sensitive to catalyst for the deposition of various metals i.
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