초록 ▼

A thermal-pumping apparatus according to a non-limiting example embodiment may include a first volume structure defining a first inlet opening and a first outlet opening in fluid communication with a first volume, a second volume structure defining a second inlet opening and a second outlet opening

A thermal-pumping apparatus according to a non-limiting example embodiment may include a first volume structure defining a first inlet opening and a first outlet opening in fluid communication with a first volume, a second volume structure defining a second inlet opening and a second outlet opening in fluid communication with a second volume, and a connection structure joining the first outlet opening of the first volume structure to the second inlet opening of the second volume structure. The connection structure may include a one-directional valve configured to allow fluid flow between the first and second volume structures in one direction only from the first volume of the first volume structure to the second volume of the second volume structure.

대표청구항 ▼

1. A thermal-pumping apparatus, comprising: a plurality of volume structures, the plurality of volume structures including a first volume structure and a second volume structure,the first volume structure defining a first volume, the first volume structure defining a first inlet opening and a first

1. A thermal-pumping apparatus, comprising: a plurality of volume structures, the plurality of volume structures including a first volume structure and a second volume structure,the first volume structure defining a first volume, the first volume structure defining a first inlet opening and a first outlet opening in fluid communication with the first volume,the second volume structure defining a second volume, the second volume structure defining a second inlet opening and a second outlet opening in fluid communication with the second volume;a plurality of connection structures connecting the plurality of volume structures in series such that each one of the plurality of connection structures connects a corresponding two adjacent volume structures among the plurality of volume structures,at least three of the plurality of volume structures being arranged end-to-end and extending laterally in a same direction,the at least three of the plurality of volume structures each having a length greater than a width and the same direction corresponding to the lengths of the at least three of the plurality of volume structures,the plurality of connection structures each including a one-directional valve configured to allow fluid flow between the corresponding two adjacent volume structures among the plurality of volume structures,the plurality of connection structures including a first connection structure joining the first outlet opening of the first volume structure to the second inlet opening of the second volume structure, the one-directional valve of the first connection structure configured to allow fluid flow between the first volume structure and the second volume structure in one direction only from the first volume of the first volume structure to the second volume of the second volume structure;a heat transfer structure that is a closed system with respect to the first volume structure, the heat transfer structure being configured to transfer thermal energy to the first volume structure using at least one of conduction and radiation such that a pressure in the first volume structure increases; anda distributed control and information system (DCIS), the DCIS including a first volume structure sensor, a second volume structure sensor, and a connection structure sensor,the first volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the first volume structure,the second volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the second volume structure,the connection structure sensor being configured to measure a flow rate of fluid through the first connection structure. 2. The thermal-pumping apparatus of claim 1, further comprising: at least one disc independently connected to a corresponding one of the first and second volume structures through a pipe portion and configured to relieve an internal pressure of the corresponding one of the first and second volume structures if the internal pressure of the corresponding one of the first and second volume structures bursts the disc. 3. The thermal-pumping apparatus of claim 1, wherein the first and second volume structures are pipes,the first connection structure is a flange joining one end of the first volume structure to one end of the second volume structure,the one-directional valve of the first connection structure is one of, surrounded by the first volume structure,surrounded by the second volume structure, andat an interface between the first and second volume structures. 4. The thermal-pumping apparatus of claim 1, further comprising at least one of an electrically-powered pump and a mechanically-powered pump that is not directly connected to the second volume structure and is not configured to increase a pressure in the second volume of the second volume structure. 5. The thermal-pumping apparatus of claim 1, wherein a bottom surface of the first volume structure defines the first outlet opening, the bottom surface of the first volume structure being opposite a top surface of the first volume structure, the first connection structure includes an equalizing line connected to the one-directional valve of the first connection structure and the second inlet opening of the second volume structure,the equalizing line is configured to allow fluid flow from the first volume of the first volume structure through the one-directional valve of the first connection structure to the second volume of the second volume structure if the one-directional valve is open such that the bottom surface of the first volume structure is in a primary flow path of fluid flow from the first volume of the first volume structure to the second volume of the second volume structure, andthe connection structure sensor is configured to measure the flow rate of fluid through the equalizing line. 6. The thermal-pumping apparatus of claim 5, further comprising: at least one exhaust valve connected to a corresponding one of the first volume structure and the second volume structure, whereinthe corresponding one of the first volume structure and the second volume structure defines an exhaust opening that is spaced apart from a corresponding one of the first outlet opening and the second outlet opening in the corresponding one of the first volume structure and the second volume structure,the exhaust valve is connected to the exhaust opening, andthe DCIS is configured to open the exhaust valve in order to provide a path for air or gas to escape from or enter the corresponding one of the first volume structure and the second volume structure. 7. The thermal-pumping apparatus of claim 5, further comprising: a bypass valve, whereinthe first volume structure defines a first bypass opening in fluid communication with the first volume,the equalizing line defines a first bypass hole,the bypass valve is connected to the first bypass opening and the first bypass hole, andthe bypass valve is configured to selectively allow fluid flow from the first volume of the first volume structure through the first bypass hole into the equalizing line. 8. The thermal-pumping apparatus of claim 1, wherein the one-directional valve of the first connection structure is configured to open if a pressure of the first volume is greater than a pressure of the second volume, and a differential pressure between the first volume and the second volume is greater than or equal to a threshold of the one-directional valve of the first connection structure,the one-directional valve of the first connection structure is configured to close if the differential pressure between the first volume and the second volume is less than the threshold of the one-directional valve of the first connection structure, andthe one-directional valve of the first connection structure is also configured to close if the pressure of the first volume is less than the pressure of the second volume. 9. The thermal-pumping apparatus of claim 1, further comprising: at least one input pipe connected to the first inlet opening of the first volume structure. 10. The thermal-pumping apparatus of claim 9, wherein the plurality of volume structures and connection structures form a conduit,the plurality of connection structures connect at least 4 of the plurality of volume structures in series, andthe conduit is configured to thermally-pump a fluid in the one direction only from the first volume structure through the plurality of connection structures to a terminal one of the plurality of volume structures, using at least one of conduction and radiation to develop differential pressures across the plurality of connection structures that transfer the fluid the one direction. 11. The thermal-pumping apparatus of claim 1, further comprising at least one of an electrically-powered pump and a mechanically-powered pump that is not directly connected to the second volume structure and is not configured to increase a pressure in the second volume of the second volume structure,the plurality of volume structures are a plurality of pipes, andthe plurality of connection structures are flanges connecting the plurality of pipes end-to-end in series. 12. The thermal-pumping apparatus of claim 1, further comprising: discs, whereineach one of the discs is independently connected to a corresponding one of the plurality of volume structures through respective pipe portions and is configured to relieve an internal pressure of the corresponding one of the plurality of volume structures if the internal pressure of the corresponding one of the plurality of volume structures bursts the one of the discs. 13. The thermal-pumping apparatus of claim 1, wherein the heat transfer structure is one of a heat exchanger, a thermal collection device, and a reflector. 14. The thermal-pumping apparatus of claim 1, further comprising: an input pipe, whereina first end of the input pipe is connected to the first inlet opening of the first volume structure,a pump connected to a second end of the input pipe,the pump is configured to be electrically-powered or mechanically-powered, andthe pump is configured to supply a fluid from a fluid source structure to the input pipe for delivering the fluid to the first volume structure. 15. A method of manufacturing a thermal-pumping apparatus comprising: connecting a plurality of volume structures to each other in series using a plurality of connection structures having one-direction valves such that each one of the plurality of connection structures connects a corresponding two adjacent volume structures among the plurality of volume structures, at least three of the plurality of volume structures being arranged end-to-end and extending laterally in a same direction,the at least three of the plurality of volume structures each having a length greater than a width and the same direction corresponding to the lengths of the at least three of the plurality of volume structures,the connecting the plurality of volume structures including connecting a first volume structure to a second volume structure among the plurality of volume structures with a first connection structure among the plurality of connection structures,the first volume structure defining a first volume,the first volume structure defining a first inlet opening and a first outlet opening in fluid communication with the first volume,the second volume structure defining a second volume,the second volume structure defining a second inlet opening and a second outlet opening in fluid communication with the second volume,the first connection structure joining the first outlet opening of the first volume structure to the second inlet opening of the second volume structure, andthe first connection structure including a one-directional valve configured to allow fluid flow between the first volume structure and the second volume structure in one direction only from the first volume of the first volume structure to the second volume of the second volume structure;connecting a heat transfer structure to a corresponding one of the first volume structure and the second volume structures, the heat transfer structure being a closed system with respect to the corresponding one of the first volume structure and the second volume structure, the heat transfer structure being configured to transfer thermal energy to a corresponding one of the first volume structure and the second volume structure using at least one of conduction and radiation such that a pressure in the corresponding one of the first volume structure and the second volume structure increases; andconnecting a distributed control and information system (DCIS) to the first volume structure, the first connection structure, and the second volume structure, the DCIS including first volume structure sensor, a second volume structure sensor, and a connection structure sensor,the first volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the first volume structure,the second volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the second volume structure, andthe first connection structure sensor is configured to measure a flow rate of fluid through the first connection structure. 16. The method of claim 15, further comprising: connecting a disc to the corresponding one of the first volume structure and the second volume structure, whereinthe disc is connected to the corresponding one of the first volume structure and the second volume structure through a pipe portion,the disc is configured to relieve an internal pressure of the corresponding one of the first volume structure and the second volume structure if the internal pressure of the corresponding one of the volume structure and the second volume structure bursts the disc. 17. The method of claim 15, wherein each one of the one-directional valves of the plurality of connection structures is one of surrounded by a corresponding one of the plurality connection structures and at an interface between two of the plurality of connection structures, andat least one of an electrically-powered pump and a mechanically-powered pump is provided and is not directly connected to the first volume structure and is not configured to increase a pressure in the first volume of the first volume structure. 18. The method of claim 15, wherein a bottom surface of the first volume structure defines the first outlet opening,the first connection structure includes an equalizing line,the connecting the plurality of connection structures includes connecting the equalizing line to the one-directional valve of the first connection structure and the second inlet opening of the second volume structure,the equalizing line is configured to allow fluid flow from the first volume of the first volume structure through the one-directional valve of the first connection structure to the second volume of the second volume structure if the one-directional valve of the first connection structure is open,the first connection structure sensor is configured to measure the flow rate of fluid through the equalizing line. 19. A method of operating a thermal-pumping apparatus including first to Nth volume structures serially-connected to each other, a heat transfer structure configured to transfer thermal energy to the first volume structure such that a pressure inside the first volume structure increases, and respective one-directional valves controlling fluid flow between adjacent volume structures, the one-directional valves including a first one-directional valve between the first and second volume structures, the method comprising: thermally-pumping a fluid from the first volume structure through the first one-directional valve to the second volume structure, based on transferring thermal energy from the heat transfer structure to the first volume structure using at least one of conduction and radiation to activate the first one-directional valve, the heat transfer structure being a closed system with respect to the first volume structure, the thermally-pumping the fluid including thermally pumping a mixed liquid and vapor phase of the fluid through the first and second volume structures, whereinthe thermal-pumping apparatus includes a distributed control and information system (DCIS), the DCIS including a first volume structure sensor, a second volume structure sensor, and a connection structure sensor,the first volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the first volume structure,the second volume structure sensor being configured to measure at least one of a temperature, a level, and a pressure of fluid in the second volume structure,the connection structure sensor being configured to measure a flow rate of fluid through the first one-directional valve. 20. The method of claim 19, wherein the thermally-pumping includes: increasing the pressure in the first volume structure using the thermal energy;opening the first one-directional valve if the pressure in the first volume structure is greater than a pressure in the second volume structure, and a differential pressure between the first volume structure and the second volume structure is greater than or equal to a threshold of the first one-directional valve; andclosing the first one-directional valve if at least one of, the differential pressure between the first and second volume structures is less than the threshold of the first one-directional valve, andthe pressure in the first volume structure is less than the pressure in the second volume structure. 21. The method of claim 19, further comprising: thermally pumping the fluid from the second volume structure to the Nth volume structure based on using thermal energy to activate the one-directional valves between the second volume structure and the Nth volume structure.