초록 ▼

A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polish

A polishing pad is provided. The polishing pad includes a polishing layer, which includes a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region. At least one annular groove is located in the main polishing region of the polishing layer. A peripheral groove is located in the peripheral region, and the peripheral groove includes grid-shaped grooves. At least one radial extending groove is located in the main polishing region of the polishing layer, and the at least one radial extending groove is connected with the at least one annular groove. A polishing system including the polishing pad and a polishing method using the polishing pad are provided.

대표청구항 ▼

1. A polishing pad, comprising: a polishing layer comprising a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region;at least one annular groove located in the main polishing region of the polishing layer;a peripheral groove loc

1. A polishing pad, comprising: a polishing layer comprising a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region;at least one annular groove located in the main polishing region of the polishing layer;a peripheral groove located in the peripheral region of the polishing layer and comprising a grid-shaped groove; andat least one radial extending groove located in the main polishing region of the polishing layer and connected with the at least one annular groove,wherein each groove of the peripheral groove that is not connected with the at least one radial extending groove comprises: a first end point located on an outer side of the main polishing region and comprising an end surface; anda second end point located on an outer side of the peripheral region and not comprising an end surface. 2. The polishing pad according to claim 1, wherein the polishing layer comprises a rotation center at a center position of the polishing layer, and the at least one annular groove is arranged concentrically around the rotation center. 3. The polishing pad according to claim 1, wherein the grid-shaped groove of the peripheral groove has a shape of a square grid, a rectangular grid, a rhombic grid, a trapezoidal grid, a triangular grid, a polygonal grid, or a combination of the foregoing. 4. The polishing pad according to claim 1, wherein the at least one radial extending groove extends to the peripheral region and is connected with the peripheral groove. 5. The polishing pad according to claim 4, wherein the at least one radial extending groove is an extension of a portion of the grid-shaped groove of the peripheral groove. 6. The polishing pad according to claim 1, further comprising a central groove located in the central region of the polishing layer and comprising a grid-shaped groove. 7. The polishing pad according to claim 6, wherein the grid-shaped groove of the central groove has a shape of a square grid, a rectangular grid, a rhombic grid, a trapezoidal grid, a triangular grid, a polygonal grid, or a combination of the foregoing. 8. The polishing pad according to claim 6, wherein the at least one radial extending groove extends to the central region and is connected with the central groove. 9. The polishing pad according to claim 6, wherein the at least one radial extending groove is an extension of a portion of the grid-shaped groove of the central groove. 10. The polishing pad according to claim 1, wherein in a radial direction of the polishing layer, the central region has a first width, the main polishing region has a second width, and the peripheral region has a third width. 11. The polishing pad according to claim 10, wherein: the first width is 5%-25% of a radius of the polishing layer,the second width is 50%-90% of the radius of the polishing layer, andthe third width is 5%-25% of the radius of the polishing layer. 12. A polishing system, comprising: a polishing pad, comprising:a polishing layer comprising a central region, a peripheral region, and a main polishing region located between the central region and the peripheral region;at least one annular groove located in the main polishing region of the polishing layer;a peripheral groove located in the peripheral region of the polishing layer and comprising a grid-shaped groove; andat least one radial extending groove located in the main polishing region of the polishing layer and connected with the at least one annular groove, wherein each groove of the peripheral groove that is not connected with the at least one radial extending groove comprises: a first end point located on an outer side of the main polishing region and comprising an end surface; anda second end point located on an outer side of the peripheral region and not comprising an end surface; andan object to be polished disposed on the polishing pad and comprising an inner region and an outer region encircling the inner region,wherein in a polishing process, the inner region of the object to be polished is in contact with the at least one annular groove and the at least one radial extending groove of the polishing layer, and the outer region of the object to be polished is in contact with the at least one annular groove, the peripheral groove, and the at least one radial extending groove of the polishing layer. 13. The polishing system according to claim 12, wherein the polishing layer comprises a rotation center at a center position of the polishing layer, and the at least one annular groove is arranged concentrically around the rotation center. 14. The polishing system according to claim 12, wherein the grid-shaped groove of the peripheral groove has a shape of a square grid, a rectangular grid, a rhombic grid, a trapezoidal grid, a triangular grid, a polygonal grid, or a combination of the foregoing. 15. The polishing system according to claim 12, wherein the at least one radial extending groove extends to the peripheral region and is connected with the peripheral groove. 16. The polishing system according to claim 15, wherein the at least one radial extending groove is an extension of a portion of the grid-shaped groove of the peripheral groove. 17. The polishing system according to claim 12, further comprising a central groove located in the central region of the polishing layer and comprising a grid-shaped groove. 18. The polishing system according to claim 17, wherein the grid-shaped groove of the central groove has a shape of a square grid, a rectangular grid, a rhombic grid, a trapezoidal grid, a triangular grid, a polygonal grid, or a combination of the foregoing. 19. The polishing system according to claim 17, wherein the at least one radial extending groove extends to the central region and is connected with the central groove. 20. The polishing system according to claim 17, wherein the at least one radial extending groove is an extension of a portion of the grid-shaped groove of the central groove. 21. The polishing system according to claim 12, wherein in a radial direction of the polishing layer, the central region has a first width, the main polishing region has a second width, and the peripheral region has a third width. 22. The polishing system according to claim 21, wherein: the first width is 5%-25% of a radius of the polishing layer,the second width is 50%-90% of the radius of the polishing layer, andthe third width is 5%-25% of the radius of the polishing layer. 23. A polishing method, comprising: providing a polishing pad as claimed in claim 1;disposing an object to be polished on the polishing pad, wherein the object to be polished comprises an inner region and an outer region encircling the inner region; andapplying a pressure on the object to be polished to press the object to be polished against the polishing pad to perform a polishing process, in which the object to be polished is moving relative to the polishing pad in the polishing process. 24. The polishing method according to claim 23, wherein in the polishing process, the object is polished along a back-and-forth swinging direction, wherein when the object to be polished swings outward away from the rotation center, the outer region of the object to be polished corresponds to the peripheral region of the polishing layer; and when the object to be polished swings inward toward the rotation center, the outer region of the object to be polished corresponds to the central region of the polishing layer. 25. The polishing method according to claim 23, wherein in the polishing process, the object to be polished does not have a back-and-forth swinging direction, such that the inner region of the object to be polished corresponds to the main polishing region of the polishing layer, and the outer region of the object to be polished corresponds to the peripheral region of the polishing layer.