When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15%
When a Cu—Sn—Bi had—particle based sliding material is used for sliding, Cu of Cu matrix flows and covers up Bi phase. Seizure resistance lowers as time passes. A Pb-free sliding material preventing the reduction of seizure resistance is provided. (1) Composition: from 1 to 15% of Sn, from 1 to 15% of Bi, from 0.02 to 0.2% of P, and from 1 to 10% of hard particles having an average diameter of from 50 to 70 μm, with the balance being Cu and unavoidable impurities. (2) Structure: Bi phase and the hard particles are dispersed in the copper matrix, and all of said hard particles are bonded to the copper matrix.
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1. A method for producing a homogeneous Pb-free sintered sliding material under observation using an optical microscope at a magnification of 100 times, by sintering, comprising: preparing a powder of a Cu—Bi alloy and hard particles, wherein the hard particles have an average particle diameter of f
1. A method for producing a homogeneous Pb-free sintered sliding material under observation using an optical microscope at a magnification of 100 times, by sintering, comprising: preparing a powder of a Cu—Bi alloy and hard particles, wherein the hard particles have an average particle diameter of from 5 to 70 μm and include an Fe—P based compound, and wherein the Fe—P based compound comprises at least one selected from the group consisting of Fe3P and Fe2P;mixing the Cu—Bi alloy powder and the hard particles, so that a mixture obtained by mixing consists of, by mass %, 1 to 10% of the hard particles, with the balance being Cu—Bi alloy, containing from 1 to 15% of Bi, and unavoidable impurities;heating the mixture of the Cu—Bi alloy powder and the hard particles to a sintering temperature of 700° C. to 900° C., thereby forming a liquid phase of Bi, which is present as a Bi phase around at boundaries of a Cu matrix after sintering, and presenting said hard particles at boundaries of the Cu matrix; and,controlling a temperature—elevating gradient, in terms of ° C./min, in a temperature range of from room temperature to 600° C., to 300 to 1000° C./min, wherein all of the hard particles are bonded with the Cu matrix without any intermediary of the Bi phase and are bonded with the Bi phase at a length ratio of less than 100%, in a sintered structure in which the Bi phase and the hard particles are present at boundaries of the Cu matrix. 2. The method according to claim 1, wherein said Cu—Bi alloy consists of, by mass %, from 1 to 15% of Bi, with the balance being Cu and unavoidable impurities. 3. The method according to claim 1, wherein said Cu—Bi alloy consists of, by mass %, from 1 to 15% of Bi, 0.02 to 0.2% of P, with the balance being Cu and unavoidable impurities. 4. The method according to claim 1, wherein the Pb-free sintered sliding material is in the form of a sliding member having a sliding surface, on which surface all of said hard particles are bonded with the Cu matrix, at a depth of from 10 to 80 μm. 5. The method according to claim 1, wherein the sintering is carried out for 5 to 30 minutes. 6. The method according to claim 5, wherein the sintering is carried out in an electric furnace. 7. The method according to claim 1, wherein the sintering steps are repeated twice with an intermediate rolling. 8. The method according to claim 2, wherein the sintering steps are repeated twice with an intermediate rolling.
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