[특허]Layered structures on thin substrates

[미국특허] Layered structures on thin substrates 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B32B-003/00 B41M-005/52 G01K-017/00 G01K-007/16 B05D-005/12 H05K-003/04 H05K-003/06 H05K-003/12
출원번호	US-0380467 (2016-12-15)
등록번호	US-10046584 (2018-08-14)
발명자 / 주소	Wolkin, Michal V. Arias, Ana C.
출원인 / 주소	Palo Alto Research Center Incorporated
대리인 / 주소	Hollingsworth Davis, LLC
인용정보	피인용 횟수 : 0 인용 특허 : 40

초록 ▼

A thin substrate has a layered structure on one surface, and can also have a layered structure on the other. Each layered structure can include a part of at least one patterned layer that, if patterned by photolithography, would frequently result in damage to the substrate due to fragility. For example, the substrate could be a 3 mil (76.2 μm) or thinner polyimide film and one patterned layer could be a semiconductor material such as vanadium oxide, while another could be metal in electrical contact with semiconductor material. The layer part, however, can be patterned by a printing operation or can include a printed patterned artifact such as an uneven boundary or an alignment. The printing operation can be direct printing or printing of a mask for etching or liftoff or both. The layered structure can include an array of cells, each with layer parts on each substrate surface.

대표청구항 ▼

1. A thermal sensing device comprising: a support structure with a surface; anda layered structure on the surface; the layered structure including a component that responds electrically to thermal signals; the layered structure including a layer part having one or more printed patterned artifacts. 2. The device of claim 1 in which the device is a calorimeter. 3. The device of claim 1 in which the printed patterned artifacts include at least one of liftoff artifacts, masked etch artifacts, and direct printing artifacts. 4. The device of claim 1 in which the support structure includes one of a polymer layer or a silicon nitride layer. 5. The device of claim 4 in which the support structure includes a polymer layer that includes polyimide. 6. The device of claim 1 in which the component that responds electrically to thermal signals is a resistive thermal sensor. 7. The device of claim 6 in which the resistive thermal sensor includes a thermistor. 8. The device of claim 1 in which the component that responds electrically to thermal signals includes a patterned layer part, the patterned layer part including semiconductor or metal material; at least one of the printed patterned artifacts being in the patterned layer part. 9. The device of claim 8 in which the patterned layer part includes semiconductor material that includes vanadium oxide. 10. The device of claim 1 in which the printed patterned artifacts include an uneven boundary portion of a part of a patterned layer that includes at least one of semiconductor material, metal material, electrically conductive material, thermally conductive material, electrically insulating material, and thermally insulating material. 11. The device of claim 1 in which the layered structure further includes a part of a patterned layer of electrically conductive material; at least one of the printed patterned artifacts being in the part of the patterned layer of electrically conductive material. 12. The device of claim 11 in which the electrically conductive material includes metal. 13. The device of claim 1 in which the layered structure further includes a protective layer in which contact vias are defined; at least one of the printed patterned artifacts being at the boundary of one of the contact vias. 14. The device of claim 13 in which the protective layer includes parylene; the protective layer including the layer part that includes the printed patterned artifact. 15. The device of claim 13 in which the layered structure further includes, in at least one of the contact vias, a contact pad layer part; at least one of the printed patterned artifacts being in the contact pad layer part. 16. The device of claim 13 in which the printed patterned artifacts include an uneven boundary portion of a contact via. 17. The device of claim 1 in which the layered structure further includes a part of a patterned layer of thermally conductive material; at least one of the printed patterned artifacts being in the part of the patterned layer of thermally conductive material. 18. The device of claim 17 in which the thermally conductive material includes copper. 19. The device of claim 1 in which the printed patterned artifacts include alignment of a part of a patterned layer with a position of a lower layer or with an alignment mark or alignment structure. 20. An array that includes the device of claim 1; the array comprising: one or more cells, each cell including: a respective region of the surface of the support structure; anda respective part of the layered structure on the cell's region of the surface; the part of the layered structure of one of the cells including the component that responds electrically to thermal signals and the layer part having one or more printed patterned artifacts. 21. The array of claim 20 in which the support structure includes a polymer layer.

이 특허에 인용된 특허 (40) 인용/피인용 타임라인 분석

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[미국특허] Layered structures on thin substrates 원문보기

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