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An equipment platform system and a wafer transfer method used to a wafer processing is provided. The equipment platform system comprises: a working platform, each side of the working platform is used to mount process chamber; a top-loading wafer device fixed on the top surface of working platform, the top-loading wafer device includes: a cassette or FOUP loading unit, a wafer loading unit installed disposed opposite the cassette or FOUP loading unit, the wafer loading unit has an inside cavity; a central robot, located between the cassette or FOUP loadin...
An equipment platform system and a wafer transfer method used to a wafer processing is provided. The equipment platform system comprises: a working platform, each side of the working platform is used to mount process chamber; a top-loading wafer device fixed on the top surface of working platform, the top-loading wafer device includes: a cassette or FOUP loading unit, a wafer loading unit installed disposed opposite the cassette or FOUP loading unit, the wafer loading unit has an inside cavity; a central robot, located between the cassette or FOUP loading unit and the wafer loading unit; a loading gate used to open or close the inside cavity; a wafer tray, which is in the inside cavity; a shutoff gate, which is at the bottom of the inside cavity, used to open or close the internal of the working platform; there is an opening at the top of the working platform, the opening is located at the lower part of the inside cavity, and disposed opposite the shutoff gate, the shutoff gate can seal the opening. The equipment platform system of the invention can decrease the floor space, increase the space efficiency, and the wafer transfer efficiency.
대표
청구항
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1. An equipment platform system for wafer processes, comprising: a working platform, each side of the working platform is used for mounting process chambers;a top-loading wafer device, fixed at a top surface of the working platform; the top-loading wafer device includes:a cassette or FOUP loading unit, which is used for loading the cassette or FOUPs;a wafer loading unit, used for loading wafers, disposed opposite the cassette or FOUP loading unit, and the wafer loading unit has an inside cavity;a central robot, which has a rotatable arm, the central robo...
1. An equipment platform system for wafer processes, comprising: a working platform, each side of the working platform is used for mounting process chambers;a top-loading wafer device, fixed at a top surface of the working platform; the top-loading wafer device includes:a cassette or FOUP loading unit, which is used for loading the cassette or FOUPs;a wafer loading unit, used for loading wafers, disposed opposite the cassette or FOUP loading unit, and the wafer loading unit has an inside cavity;a central robot, which has a rotatable arm, the central robot is located between the cassette or FOUP loading unit and the wafer loading unit, used to support the rotatable arm; the rotatable arm is installed on the central robot, and rotates around the central robot, used for transferring the wafers between the cassette or FOUP loading unit and the wafer loading unit;a loading gate, located on the wafer loading unit, disposed opposite the cassette or FOUP loading unit, the inside cavity of the wafer loading unit is opened or closed by the open/close of the loading gate;a wafer tray, locating in the inside cavity, and moving upward and downward for transferring the wafers between the inside cavity and the internal of the working platform;a shutoff gate, located at the bottom of the inside cavity, the inside cavity and the internal of the working platform can be opened or closed at the same time by the open/close of the shutoff gate, in order to connect or separate the space of the internal of the working platform and the inside cavity;the top of the working platform has an opening, the opening is under the inside cavity, used for enabling the wafer tray carrying with wafers to move between the inside cavity and the internal of the working platform; the opening is disposed opposite the shutoff gate, and the shutoff gate can seal the opening. 2. The equipment platform system according to claim 1, wherein the working platform is a polygon shaped working platform. 3. The equipment platform system according to claim 2, wherein the polygamous working platform is a hexagonal working platform. 4. The equipment platform system according to claim 1, further comprising a built-in vacuum robot located inside the working platform, the arm of the built-in vacuum robot can extend to a lower part of the opening. 5. The equipment platform system according to claim 1, wherein the wafer tray includes a wafer pallet and a retractable shaft. 6. The equipment platform system according to claim 5, wherein the wafer pallet has a multilayer slot for carrying the wafers. 7. The equipment platform system according to claim 1, wherein the size of the opening allows the wafer tray to pass the opening, and the every edge of the opening is smaller than the every edge of the shutoff gate. 8. The equipment platform system according to claim 1, wherein the open/close direction of the loading gate is vertical. 9. The equipment platform system according to claim 1, wherein the central robot can move upward and downward. 10. The equipment platform system according to claim 1, wherein the loading gate is disposed opposite the cassette or FOUP loading unit. 11. The equipment platform system according to claim 1, wherein the shutoff gate is vertical to the loading gate. 12. The equipment platform system according to claim 1, wherein the wafer loading unit includes a vacuum pump for pumping down the internal of the wafer loading unit into a vacuum state. 13. A wafer transfer method that adopts the equipment platform system described in claim 1; the method comprises a multi-wafer input procedure, the wafer input procedure comprising: Step 01: the rotatable arm of the central robot takes out a wafer from the cassette or FOUP of the cassette or FOUP loading unit;Step 02: the loading gate is opened, the rotatable arm carries the wafer to the wafer tray of the internal of the wafer loading unit, then the rotatable arm returns back to the outside of the loading gate, and moves to the cassette or FOUP to take the next wafer;Step 03: the loading gate is closed, the vacuum pump pumps down the internal of the wafer loading unit into a vacuum state;Step 04: the shutoff gate is opened, the arm of the built-in vacuum robot of the working platform moves to a lower part of the opening at the top of the working platform;Step 05: the wafer tray carrying the wafer moves downward, and passes the opening and enters the internal of the working platform, the arm of the built-in vacuum robot takes out the wafer from the wafer tray;Step 06: the wafer tray moves upward, returns back to the internal of the wafer loading unit, and then the shutoff gate is closed;Step 07: the arm of the built-in vacuum robot transfers the wafer into a process chamber of said process chambers, meanwhile, the Step 02 to Step 06 are carried out repeatedly, for transferring the next processed wafer;Step 08: repeating the Step 01 to Step 07, for transferring a multi-wafer. 14. The wafer transfer method according to claim 13, further comprising a multi-wafer output procedure, the multi-wafer output procedure comprising: Step 11: the loading gate is closed, the vacuum pump pumps down the internal of the wafer loading unit into a vacuum state;Step 12: the shutoff gate is opened, the wafer tray moves downward and passes the opening and enters the internal of the working platform;Step 13: the arm of the built-in vacuum robot takes out the processed wafer from the process chamber and carries and places it into the wafer tray, then the arm of the built-in vacuum robot moves to another process chamber to take out the next processed wafer;Step 14: the wafer tray carrying the wafer moves upward, returns back to the internal of the wafer loading unit, then the shutoff gate is closed;Step 15: when the wafer loading unit vents to atmosphere, the loading gate is opened, the rotatable arm of the central robot takes out the wafer from the wafer tray, and places it into the cassette or FOUP of the wafer loading unit, meanwhile, the Step 11 to Step 14 are carried out repeatedly, for transferring the next processed wafer;Step 16: repeating the Step 11 to Step 15, to transfer the multi-wafer. 15. The wafer transfer method according to claim 14, wherein the multi-wafer input procedure and the multi-wafer output procedure can alternately be in progress. 16. The wafer transfer method according to claim 13, wherein the wafer transfer method includes a multi-wafer input procedure, the multi-wafer input procedure includes: Step 31: the rotatable arm of the central robot takes out the wafer from the cassette or FOUP of the cassette or FOUP loading unit;Step 32: the rotatable arm moves between the cassette or FOUP and the wafer tray to transfer the multi-wafer until the multi-wafer have been carried in the wafer tray;Step 33: then the loading gate is closed, the vacuum pump pumps down the internal of the wafer loading unit into a vacuum state;Step 34: the shutoff gate is opened, the arm of the built-in vacuum robot of the working platform moves to the lower part of the top opening of the working platform;Step 35: the wafer tray carrying the wafer moves downward, passes the opening and enters the internal of the working platform, the arm of the built-in vacuum robot moves between the individual process chamber and the wafer tray to transfer the wafer, until all of the wafers in the wafer tray have been carried to the individual process chambers;Step 36: the wafer tray moves upward, returns back to the internal of the wafer loading unit, and then the shutoff gate is closed;Step 37: repeating the Step 31 to Step 36, to transfer the multi-wafer. 17. The wafer transfer method according to claim 16, wherein the method includes a multi-wafer output procedure, the multi-wafer output procedure includes: Step 41: the vacuum pump pumps the internal of the wafer loading unit into a vacuum state after the loading gate being closed;Step 42: the shutoff gate is opened, the wafer tray moves downward and passes the opening to enter the internal of the working platform;Step 43: the arm of the built-in vacuum robot moves between individual process chambers and the wafer tray to transfer the wafers, until all of the processed wafers are carried and placed into the wafer tray;Step 44: the wafer tray with the wafers moves upward, and returns back to the wafer loading unit, then the shutoff gate is closed;Step 45: when the wafer loading unit vents to atmosphere, the loading gate is opened, the rotatable arm moves between the cassette or FOUP and the wafer tray, to transfer the wafers, until all of the wafers on the wafer tray are carried and placed into the cassette or FOUP;Step 46: repeating the Step 41 to 45, to transfer the multi-wafer. 18. The wafer transfer method according to the claim 17, wherein the multi-wafer input procedure and the multi-wafer output procedure can alternately be in progress.
