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Methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent

Methods for processing semiconductor wafers, methods for loading semiconductor wafers into wafer carriers, and semiconductor wafer carriers. The methods and wafer carriers can be used for increasing the rigidity of wafers, e.g., large and thin wafers, by intentionally bowing the wafers to an extent that does not break the wafers. In some examples, a method for processing semiconductor wafers includes loading each semiconductor wafer into a respective semiconductor wafer slot of a semiconductor wafer carrier, horizontally bowing each semiconductor wafer, and moving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed.

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1. A method for processing semiconductor wafers, the method comprising: providing a plurality of semiconductor wafers;loading each semiconductor wafer of the plurality of semiconductor wafers into a respective semiconductor wafer slot of a semiconductor wafer carrier, the semiconductor wafer carrier

1. A method for processing semiconductor wafers, the method comprising: providing a plurality of semiconductor wafers;loading each semiconductor wafer of the plurality of semiconductor wafers into a respective semiconductor wafer slot of a semiconductor wafer carrier, the semiconductor wafer carrier comprising: left and right rods extending in a horizontal direction, the left rod comprising a plurality of left-side notches and the right rod comprising a plurality of right-side notches; andone or more bottom rods extending in the horizontal direction, each of the one or more bottom rods comprising a plurality of bottom notches, wherein the one or more bottom rods are joined to the left and right rods so that the left-side notches face the right-side notches and the bottom notches face vertically upwards into a space between the left-side notches and the right-side notches, defining the plurality of semiconductor wafer slots between the left-side notches, the right-side notches, and the bottom notches;horizontally bowing each semiconductor wafer of the plurality of semiconductor wafers loaded into the semiconductor wafer slots; andmoving the semiconductor wafer carrier into a processing station and processing the semiconductor wafers at the processing station while the semiconductor wafers are loaded into the semiconductor wafer carrier and horizontally bowed. 2. The method of claim 1, wherein horizontally bowing each semiconductor wafer of the plurality of semiconductor wafers loaded into the semiconductor wafer slots comprises sliding, in the horizontal direction, the one or more bottom rods relative to the left and right rods. 3. The method of claim 2, wherein sliding the one or more bottom rods relative to the left and right rods comprises one or more of: rotating a rotatable knob coupled to a leadscrew coupled to the one or more bottom rods; pushing or pulling on a push-and-pull knob coupled to a linear motion stage coupled to the one or more bottom rods; and activating an electrically-controlled linear actuator coupled to the one or more bottom rods. 4. The method of claim 1, wherein loading each semiconductor wafer of a plurality of semiconductor wafers into a respective semiconductor wafer slot comprises loading each semiconductor wafer into a respective semiconductor wafer slot between front and back plates each extending laterally between the left and right rods. 5. The method of claim 4, wherein moving the semiconductor wafer carrier into a processing station comprises attaching front and back transport interface handles to the front and back plates and lifting the semiconductor wafer carrier by the front and back transport interface handles. 6. A method for loading a plurality of semiconductor wafers into a semiconductor wafer carrier, the method comprising, for each semiconductor wafer: gripping the semiconductor wafer using a robotic gripper of an automation system;horizontally bowing the semiconductor wafer using the robotic gripper; andloading the semiconductor wafer in the semiconductor wafer carrier so that the semiconductor wafer sits in horizontally aligned left and right notches in left and right rods of the semiconductor wafer carrier, and so that the semiconductor wafer sits in at least one bottom notch in a bottom rod that is horizontally offset from the left and right notches in the left and right rods,wherein loading the semiconductor wafer comprises loading the semiconductor wafer between front and back plates of the semiconductor wafer carrier each extending laterally between the left and right rods, and wherein the left and right rods are fixed to the front and back plates and extend horizontally from the front plate to the back plate, and wherein the bottom rod is fixed to the front and back plates and extends horizontally from the front plate to the back plate at a lower vertical height than the left and right rods. 7. The method of claim 6, wherein: loading the semiconductor wafer comprises inserting the semiconductor wafer to a first depth in the semiconductor wafer carrier so that the semiconductor wafer engages the horizontally aligned left and right notches;horizontally bowing the semiconductor wafer comprises horizontally bowing the semiconductor after inserting the semiconductor wafer to the first depth; andloading the semiconductor wafer comprises, after horizontally bowing the semiconductor wafer, further inserting the semiconductor wafer to a second depth in the semiconductor wafer carrier so that the semiconductor wafer engages the at least one bottom notch. 8. The method of claim 7, wherein horizontally bowing the semiconductor wafer comprises horizontally bowing the semiconductor wafer prior to loading the semiconductor wafer into the semiconductor wafer carrier. 9. The method of claim 6, comprising attaching front and back transport interface handles to the front and back plates. 10. A semiconductor wafer carrier comprising: left and right rods extending in a horizontal direction, the left rod comprising a plurality of left-side notches and the right rod comprising a plurality of right-side notches;one or more bottom rods extending in the horizontal direction, each of the one or more bottom rods comprising a plurality of bottom notches, wherein the one or more bottom rods are joined to the left and right rods so that the left-side notches face the right-side notches and the bottom notches face vertically upwards into a space between the left-side notches and the right-side notches, defining a plurality of semiconductor wafer slots between the left-side notches, the right-side notches, and the bottom notches; anda mechanical rod-slider coupled to the one or more bottom rods, the mechanical rod-slider comprising a leadscrew configured for sliding, in the horizontal direction, the one or more bottom rods relative to the left and right rods, for horizontally bowing a plurality of semiconductor wafers loaded into the semiconductor wafer slots. 11. The semiconductor wafer carrier of claim 10, wherein the mechanical rod-slider comprises a rotatable knob coupled to the leadscrew. 12. The semiconductor wafer carrier of claim 10, wherein the mechanical rod-slider comprises a push-and-pull knob coupled to a linear motion stage. 13. The semiconductor wafer carrier of claim 10, wherein the mechanical rod-slider comprises an electrically-controlled linear actuator. 14. The semiconductor wafer carrier of claim 10, comprising front and back plates each extending laterally between the left and right rods. 15. The semiconductor wafer carrier of claim 14, comprising front and back transport interface handles detachably coupled to the front and back plates. 16. The semiconductor wafer carrier of claim 14, wherein the left and right rods are fixed to the front and back plates and extend horizontally from the front plate to the back plate. 17. The semiconductor wafer carrier of claim 14, wherein the one or more bottom rods are slidably joined to the front and back plates and extend horizontally from the front plate to the back plate at a lower vertical height than the left and right rods. 18. The semiconductor wafer carrier of claim 14, wherein each of the one or more bottom rods is joined to the front and back plates at a respective hermetically-sealed moving joint. 19. The semiconductor wafer carrier of claim 10, wherein each of the plurality of semiconductor wafer slots is sized to receive a polycrystalline solar wafer having at least one dimension of five or six inches or longer.