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Cooling system for a computer system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • G06F-001/20
  • H05K-007/20
  • F28D-015/00
출원번호 US-0626393 (2017-06-19)
등록번호 US-10078354 (2018-09-18)
발명자 / 주소
  • Eriksen, André Sloth
출원인 / 주소
  • Asetek Danmark A/S
대리인 / 주소
    Finnegan, Henderson, Farabow, Garrett & Dunner LLP
인용정보 피인용 횟수 : 0  인용 특허 : 64

초록

A cooling system for a computer system comprises at least one unit such as a central processing unit (CPU) generating thermal energy and a reservoir having an amount of cooling liquid, said cooling liquid intended for accumulating and transferring of thermal energy dissipated from the processing uni

대표청구항

1. A cooling system for a computer system processing unit, comprising: a reservoir configured to circulate a cooling liquid therethrough, the reservoir including: an upper chamber and a lower chamber, wherein the upper chamber and the lower chamber are vertically displaced fluid-containing chambers

이 특허에 인용된 특허 (64)

  1. Sanjay K. Roy, Active cold plate/heat sink.
  2. Salmonson Richard B., Air or liquid cooled computer module cold plate.
  3. Wayburn,Lewis S.; Spearing,Ian G.; Schmidt, Jr.,Charles R., Apparatus and method having mechanical isolation arrangement for controlling the temperature of an electronic device under test.
  4. Robert A. Schmidt ; Bruce A. Smetana ; Thomas T. Weir, Brushless coolant pump and cooling system.
  5. Chien Chuan-Fu,TWX, CPU cooling system.
  6. Hamilton Robin E. ; Fagan Thomas J. ; Kennedy Paul G. ; Woodward William S., Closed loop liquid cooling for semiconductor RF amplifier modules.
  7. Scott, Alexander Robin Walter, Computer cooling apparatus.
  8. Chang,Hung, Computer system with a liquid-cooling thermal module having a plurality of pumps.
  9. Campbell,Levi A.; Chu,Richard C.; Ellsworth, Jr.,Michael J.; Iyengar,Madhusudan K.; Schmidt,Roger R.; Simons,Robert E., Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled.
  10. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover.
  11. Koga, Shinya; Sakai, Toshisuke; Niwatsukino, Kyou; Kubota, Toshiyuki, Cooling device and centrifugal pump to be used in the same device.
  12. Eriksen, André Sloth, Cooling system for a computer system.
  13. Eriksen, André Sloth, Cooling system for a computer system.
  14. Eriksen, André Sloth, Cooling system for a computer system.
  15. Cheon Kioan, Cooling system for computer.
  16. Kelly, Kevin W.; Harris, Chad R.; Despa, Mircea S., Crossflow micro heat exchanger.
  17. Kevin W. Kelly ; Chad R. Harris ; Mircea S. Despa, Crossflow micro heat exchanger.
  18. Alvaro Nicolino,ITX, Device for controlling a synchronous electric motor with a permanent magnet rotor.
  19. Sato,Katsuya; Oikawa,Hironori, Electronic equipment provided with cooling system.
  20. Nakahama Takafumi,JPX ; Ishii Takayuki,JPX ; Tanimoto Tomohiko,JPX, Enclosed control device.
  21. Wilson ; Edward A. ; Fredenberg ; James D., Fluid cooling systems for electronic systems.
  22. Batchelder John Samuel, Heat exchange apparatus.
  23. Batchelder John Samuel, Heat exchange apparatus.
  24. Burward-Hoy Trevor (Cupertino CA), Heat exchanger for electronic equipment.
  25. Hsieh Hsin-Mao,TWX, Heat radiating device for notebook computer.
  26. Rife William B. ; Pare Rodney H., Heat sink assembly with adjustable mounting clip.
  27. Reichard Jeffrey A. (Menomonee Falls WI), Heat sink for electrical circuit components.
  28. Frankeny Richard F. (Elgin TX) Hermann Karl (Austin TX), Heat sink for utilization with high density integrated circuit substrates.
  29. Lin Andy,TWX, Heat sink mounting structure.
  30. Tata Peter D., Heatsink assembly with adjustable retaining clip.
  31. Gektin, Vadim; Novotny, Shlomo; Vogel, Marlin R., Heatsink with active liquid base.
  32. Carroll Charles B. (Trenton NJ) Lai Ching-Yue (Lawrenceville NJ), High intensity heat exchanger system.
  33. Malone,Christopher G.; Simon,Glenn C.; Barsun,Stephan K., High serviceability liquid cooling loop using flexible bellows.
  34. Wang, Chin-Wen, Hydronic pump type heat radiator.
  35. Roy,Sanjay K., Impeller driven active heat sink.
  36. Mark W. Peters ; Richard H. Hodge, Independently controlling passive and active cooling in a computer system.
  37. Groshong Leroy E. (Portland OR) Groshong Judson C. (Beaverton OR) Brawn ; deceased R. James (late of Portland OR by Stanley C. Fisher ; administrator), Infusion pump.
  38. Morris, Terrel L.; Belady, Christian L, Integrated EMI containment and spray cooling module utilizing a magnetically coupled pump.
  39. Chen Shiaw-Jong S. ; Hooey Roger J. ; Radke Robert E., Integrated active cooling device for board mounted electric components.
  40. Jahns Thomas M. (Schenectady NY), Integrated current sensor torque control for ac motor drives.
  41. Wu, Bo Jiu; Zhang, Jia Ju; Wu, Zhong Ming, Integrated fluid cooling system for electronic components.
  42. Lee,Hsieh Kun; Lai,Cheng tien; Zhou,Shi Wen, Integrated liquid cooling system for electronic components.
  43. Jairazbhoy,Vivek A.; Reddy,Prathap A.; Trublowski,John, Liquid cooled semiconductor device.
  44. Minamitani, Rintaro; Kitano, Makoto; Ashiwake, Noriyuki; Ohashi, Shigeo; Kondo, Yoshihiro; Naganawa, Takashi; Yoshitomi, Yuji; Nakagawa, Tsuyoshi, Liquid cooling system and personal computer using the same.
  45. Gwin, Paul J.; Konstad, Rolf A., Liquid cooling system for processors.
  46. Duan,Qiang Fei; Lo,Lieh Feng, Liquid-cooling heat dissipation apparatus.
  47. Weber, Richard M.; Barson, George F.; Koehler, Michael D., Method and apparatus for cooling heat-generating structure.
  48. Abbondanti Alberto (Penn Hills PA), Method and apparatus for sampling output AC currents in a voltage-fed inverter power supply.
  49. Tseng, Chao Kun; Gu, Jianhua, Mounting assembly for heat sink.
  50. Iversen Arthur H. (Saratoga CA), Multi-chip module cooling.
  51. Hamilton Robin E. ; Kennedy Paul G. ; Vale Christopher R., Non-mechanical magnetic pump for liquid cooling.
  52. Lenehan, Daniel J.; Goodson, Kenneth; Kenny, Thomas W.; Munch, Mark; Sahu, Saroj, Pump and fan control concepts in a cooling system.
  53. Bingler, Douglas J., Pump system for use in a heat exchange application.
  54. Hata,Yukihiko; Tomioka,Kentaro, Pump, electronic apparatus, and cooling system.
  55. Lustwerk Ferdinand, Sealed motor driven centrifugal fluid pump.
  56. Doll, Wade J., Semiconductor circular and radial flow cooler.
  57. Nakano, Masao; Ikeda, Akira; Ashitani, Hiromasa, Semiconductor cooling device.
  58. Hill James A. (Pittsfield PA) Marsh Gregory A. (Erie PA) Smith Myron L. (Fairview PA), Shuttered radiator system with control.
  59. Simpkins, Haskell; Thomas, Stephen M.; Labarge, William J., Solid oxide fuel cell having a monolithic heat exchanger and method for managing thermal energy flow of the fuel cell.
  60. Komatsu Fumito (1632-12 Nomura ; Ooazo Hiroaka ; Shiojini Nagand-ken JPX), Start-up method for synchronous motors.
  61. Purson Herv (Drme FRX) Girardin Denis (Drme FRX), Synchronous motor having selectable rotation direction.
  62. Stefanoski,Zoran; Kim,Jeong H., System for efficiently cooling a processor.
  63. Hamman, Brian Alan, System processor heat dissipation.
  64. Neng-Chao Chang TW, Water/air dual cooling arrangement for a CPU.
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