초록 ▼

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide thermal management or

Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide thermal management or cooling of semiconductor devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, microchannels, fins, and even integrated microjets and fins. Other embodiments of the invention are directed to heat spreaders (e.g. heat pipes or vapor chambers) that provide enhanced thermal management via enhanced wicking structures and/or vapor creation and flow structures. Other embodiments provide enhanced methods for making such arrays and spreaders.

대표청구항 ▼

1. A heat spreader for an electronic heat generating component, comprising: (a) an enclosed chamber comprising a floor, a lid, and side walls, wherein the floor of the chamber provides an external surface that may be placed in contact with or in proximity to a heat generating electronic component;(b

1. A heat spreader for an electronic heat generating component, comprising: (a) an enclosed chamber comprising a floor, a lid, and side walls, wherein the floor of the chamber provides an external surface that may be placed in contact with or in proximity to a heat generating electronic component;(b) a heat transfer fluid located within the chamber;(c) a condensation region located within the chamber comprising a first array of fins having a first spacing;(d) a vaporization region located with the chamber comprising a plurality of evaporation pores;(e) an intermediate region located within the chamber and between the condensation region and the evaporation region comprising at least one second array of fins having a second spacing;(f) a wicking structure located on or in proximity to the floor and extending from the condensation region to the vaporization region,(g) a space extending from the evaporation region to the condensation region through which vaporized heat transfer fluid may travel, such that upon application of sufficient heat to the external surface of the floor by the electronic component, a portion of liquid heat transfer fluid is evaporated from the evaporation pores, flows through the space, and condenses at the condensation surface, and by capillary force is moved from the condensation region to the evaporation region via the wicking structure in a continuous flow that moves heat from the evaporation region to the condensation region,wherein at least one of the first array of fins, the at least one second array of fins, or the wicking structure comprise a plurality of solid structures having an average size in the range of 20-60 microns that are spaced laterally from one another by gaps having average widths in the range of 5-50 microns and wherein the solid structures are joined vertically to one another in a laterally offset manner,wherein the solid structures are formed from vertically stacked, planarized layers of electrodeposited material, andwherein at least a portion of the solid structures have micron and submicron surface texturing with an average spacing of texturing features being less than 2 microns and an average size of texturing features being less than 2 microns. 2. The heat spreader of claim 1 wherein the wicking structure has a thickness in the range of 30-150 microns and has an average pore size in the range of 10-50 microns. 3. The heat spreader of claim 1 wherein the evaporation region also comprises an array of third fins. 4. The heat spreader of claim 1 wherein the 20-60 micron structures are formed into clusters having average lateral dimensions in the range of 100-600 microns. 5. The heat spreader of claim 4 wherein the clusters form individual fins. 6. The heat spreader of claim 5 wherein the fins are condensation fins. 7. The heat spreader of claim 5 wherein the fins are intermediate region fins. 8. The heat spreader of claim 4 wherein individual clusters are grouped into structured wick arrays having dimensions in the 1000-10000 micron range. 9. The heat spreader of claim 1 wherein a plurality of the solid structures form the wicking structure. 10. The heat spreader of claim 1 wherein at least a portion of the solid structures have micron and submicron surface texturing with an average spacing of texturing features being less than 1 micron and an average size of texturing features being less than 2 microns. 11. The heat spreader of claim 1 wherein at least a portion of the solid structures have micron and submicron surface texturing with an average spacing of texturing features being less than 0.5 microns and an average size of texturing features being less than 2 microns. 12. A heat spreader for an electronic heat generating component, comprising: (a) an enclosed chamber comprising a floor, a lid, and side walls, wherein the floor of the chamber provides an external surface that may be placed in contact with or in proximity to a heat generating electronic component;(b) a heat transfer fluid located within the chamber;(c) a condensation region located within the chamber comprising a first array of fins having a first spacing;(d) a vaporization region located with the chamber comprising a plurality of evaporation pores;(e) an intermediate region located within the chamber and between the condensation region and the evaporation region comprising at least one second array of fins having a second spacing;(f) a wicking structure located on or in proximity to the floor and extending from the condensation region to the vaporization region,(g) a space extending from the evaporation region to the condensation region through which vaporized heat transfer fluid may travel, such that upon application of sufficient heat to the external surface of the floor by the electronic component, a portion of liquid heat transfer fluid is evaporated from the evaporation pores, flows through the space, and condenses at the condensation surface, and by capillary force is moved from the condensation region to the evaporation region via the wicking structure in a continuous flow that moves heat from the evaporation region to the condensation region,wherein at least one of the first array of fins, the at least one second array of fins, or the wicking structure comprise a plurality of solid structures having an average size in the range of 20-60 microns that are spaced laterally from one another by gaps having average widths in the range of 5-50 microns and wherein the solid structures are joined vertically to one another in a laterally offset manner,wherein the first fin spacing is smaller than the second fin spacing and wherein the first fins have a height in the range of 200-600 microns with a base size of 100-300 microns and with an average pore size of 10-60 microns. 13. A heat spreader for an electronic heat generating component, comprising: (a) an enclosed chamber comprising a floor, a lid, and side walls, wherein the floor of the chamber provides an external surface that may be placed in contact with or in proximity to a heat generating electronic component;(b) a heat transfer fluid located within the chamber;(c) a condensation region located within the chamber comprising a first array of fins having a first spacing;(d) a vaporization region located with the chamber comprising a plurality of evaporation pores;(e) an intermediate region located within the chamber and between the condensation region and the evaporation region comprising at least one second array of fins having a second spacing;(f) a wicking structure located on or in proximity to the floor and extending from the condensation region to the vaporization region,(g) a space extending from the evaporation region to the condensation region through which vaporized heat transfer fluid may travel, such that upon application of sufficient heat to the external surface of the floor by the electronic component, a portion of liquid heat transfer fluid is evaporated from the evaporation pores, flows through the space, and condenses at the condensation surface, and by capillary force is moved from the condensation region to the evaporation region via the wicking structure in a continuous flow that moves heat from the evaporation region to the condensation region,wherein at least one of the first array of fins, the at least one second array of fins, or the wicking structure comprise a plurality of solid structures having an average size in the range of 20-60 microns that are spaced laterally from one another by gaps having average widths in the range of 5-50 microns and wherein the solid structures are joined vertically to one another in a laterally offset manner,wherein the first fins have first average lateral dimension and the second fins have a second average lateral dimension which is larger than the first average lateral dimension. 14. A heat spreader for an electronic heat generating component, comprising: (a) an enclosed chamber comprising a floor, a lid, and side walls, wherein the floor of the chamber provides an external surface that may be placed in contact with or in proximity to a heat generating electronic component;(b) a heat transfer fluid located within the chamber;(c) a condensation region located within the chamber comprising a first array of fins having a first spacing;(d) a vaporization region located with the chamber comprising a plurality of evaporation pores;(e) an intermediate region located within the chamber and between the condensation region and the evaporation region comprising at least one second array of fins having a second spacing;(f) a wicking structure located on or in proximity to the floor and extending from the condensation region to the vaporization region,(g) a space extending from the evaporation region to the condensation region through which vaporized heat transfer fluid may travel, such that upon application of sufficient heat to the external surface of the floor by the electronic component, a portion of liquid heat transfer fluid is evaporated from the evaporation pores, flows through the space, and condenses at the condensation surface, and by capillary force is moved from the condensation region to the evaporation region via the wicking structure in a continuous flow that moves heat from the evaporation region to the condensation region,wherein at least one of the first array of fins, the at least one second array of fins, or the wicking structure comprise a plurality of solid structures having an average size in the range of 20-60 microns that are spaced laterally from one another by gaps having average widths in the range of 5-50 microns and wherein the solid structures are joined vertically to one another in a laterally offset manner,wherein the evaporation region also comprises an array of third fins, having an average height which is less than an average height of the first or second fins. 15. An electronic component with a heat spreader, comprising: (a) an electronic component;(b) an enclosed chamber comprising a floor, a lid, and side walls, wherein the floor of the chamber comprises a surface of the heat generating component;(c) a heat transfer fluid located within the chamber;(d) a condensation region located within the chamber comprising a first array of fins having a first spacing;(e) a vaporization region located within the chamber comprising a plurality of evaporation pores;(f) an intermediate region located within the chamber and between the condensation region and the evaporation region comprising at least one second array of fins having a second spacing;(g) a wicking structure located on or in proximity to the floor and extending from the condensation region to the vaporization region,(h) a space extending from the evaporation region to the condensation region through which vaporized heat transfer fluid may travel, such that upon application of sufficient heat to the external surface of the floor by the electronic component, a portion of liquid heat transfer fluid is evaporated from the evaporation pores, flows through the space, and condenses at the condensation surface, and by capillary force is moved from the condensation region to the evaporation region via the wicking structure in a continuous flow that moves heat from the evaporation region to the condensation region,wherein at least one of the first array of fins, the second array of fins, or the wicking structure comprise a plurality of solid structures having an average size in the range of 20-60 micron that are spaced laterally from one another by gaps having average widths in the range of 5-50 microns and wherein the solid structures are joined vertically to one another in a laterally offset manner,wherein the solid structures are formed from vertically stacked, planarized layers of electrodeposited material, andwherein at least a portion of the solid structures have micron and submicron surface texturing with an average spacing of texturing features being less than 2 microns and an average size of texturing features being less than 2 microns. 16. The electronic component of claim 15 wherein the wicking structure comprises texturing formed on the surface of the electronic component via an etching operation. 17. The electronic component of claim 16 wherein the wicking structure comprises material deposited on to the surface of the electronic component prior to attaching the walls on lid of the heat spreader to the electronic component. 18. The electronic component of claim 17 wherein the first and second fin areas are attached to the lid or walls of the heat spreader prior to attaching the lid and walls to the electronic device. 19. The electronic component of claim 17 additionally comprising a mesh located between the first and second fin arrays and the electronic component.