Tamper-respondent assemblies with region(s) of increased susceptibility to damage
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H05K-003/10
H05K-001/02
H05K-001/09
출원번호
US-0865591
(2015-09-25)
등록번호
US-10098235
(2018-10-09)
발명자
/ 주소
Dangler, John R.
Long, David C.
Peets, Michael T.
출원인 / 주소
INTERNATIONAL BUSINESS MACHINES CORPORATION
대리인 / 주소
Poltavets, Esq., Tihon
인용정보
피인용 횟수 :
0인용 특허 :
123
초록▼
Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible laye
Tamper-respondent assemblies and methods of fabrication are provided which include a tamper-respondent electronic circuit structure. The tamper-respondent electronic circuit structure includes a tamper-respondent sensor. The tamper-respondent sensor includes, for instance, at least one flexible layer having opposite first and second sides, and circuit lines forming, at least in part, at least one tamper-detect network, such as one or more resistive networks. The circuit lines are disposed on at least one of the first side or the second side of the at least one flexible layer. At least one region of the tamper-respondent sensor is fabricated with increased susceptibility to damage from mechanical stress associated with a tamper event. The at least one region of increased susceptibility to damage facilitates detection of the tamper event by the tamper-respondent sensor.
대표청구항▼
1. A tamper-respondent assembly comprising: an enclosure enclosing, at least in part, at least one electronic component to be protected;a tamper-respondent electronic circuit structure comprising a tamper-respondent sensor secured to an inner surface of the enclosure, the tamper-respondent sensor be
1. A tamper-respondent assembly comprising: an enclosure enclosing, at least in part, at least one electronic component to be protected;a tamper-respondent electronic circuit structure comprising a tamper-respondent sensor secured to an inner surface of the enclosure, the tamper-respondent sensor being a first tamper-respondent sensor, and comprising: at least one flexible layer having opposite first and second sides;circuit lines forming, at least in part, at least one tamper-detect network, the circuit lines being disposed on at least one of the first side or the second side of the at least one flexible layer; andat least one region of the tamper-respondent sensor having an increased susceptibility to damage from mechanical stress associated with a tamper event, the at least one region of increased susceptibility to damage facilitating detection of the tamper event by the tamper-respondent sensor;a multilayer circuit board, the at least one electronic component being mounted on a main surface of the multilayer circuit board;an embedded tamper-respondent sensor embedded within the multilayer circuit board as part of the multilayer circuit board, the embedded tamper-respondent sensor being a second tamper-respondent sensor; andthe enclosure being affixed to the main surface of the multilayer circuit board to seal the at least one electronic component between the enclosure and the multilayer circuit board, and the tamper-respondent sensor secured to the inner surface of the enclosure and the embedded tamper-respondent sensor within the multilayer circuit board facilitating defining a secure volume about the at least one electronic component. 2. The tamper-respondent assembly of claim 1, wherein the inner surface of the enclosure comprises a rigid surface, and wherein the tamper-respondent sensor comprises first circuit lines, of the circuit lines, the first circuit lines being disposed at the first side of the at least one flexible layer, and being adhesively bonded to the rigid surface of the tamper-respondent assembly to define the at least one region of increased susceptibility to damage from mechanical stress associated with the tamper event. 3. The tamper-respondent assembly of claim 2, wherein the first circuit lines of the tamper-respondent sensor are exposed at the first side of the at least one flexible layer, and are bonded to the rigid surface of the tamper-respondent assembly via an adhesive. 4. The tamper-respondent assembly of claim 3, wherein the adhesive secures the first circuit lines to the rigid surface with an equal or greater bond strength than a bond strength of the first circuit lines to the first side of the at least one flexible layer. 5. The tamper-respondent assembly of claim 3, further comprising set-off elements disposed between the first side of the at least one flexible layer and the rigid surface of the tamper-respondent assembly, the set-off elements facilitating defining a gap between the first side of the at least one flexible layer, having the first circuit lines, and the rigid surface of the tamper-respondent assembly, the gap being substantially filled with the adhesive. 6. The tamper-respondent assembly of claim 5, wherein the set-off elements comprise spherical elements dispersed throughout the adhesive within the gap. 7. The tamper-respondent assembly of claim 2, wherein: the tamper-respondent sensor further comprises second circuit lines, of the circuit lines, the second circuit lines being disposed at the second side of the at least one flexible layer, and being adhesively bonded to another rigid surface of the tamper-respondent assembly, to define between the inner surface of the electronic enclosure and the another rigid surface of the tamper-respondent assembly, the at least one region of the tamper-respondent sensor of increased susceptibility to damage from mechanical stress associated with the tamper event. 8. The tamper-respondent assembly of claim 1, wherein the tamper-respondent sensor includes at least one cutout area, the at least one cutout area defining, at least in part, at least one stress-concentrating inner edge within the tamper-respondent sensor, the at least one region of increased susceptibility to damage adjoining the at least one stress-concentrating inner edge within the tamper-respondent sensor. 9. The tamper-respondent assembly of claim 8, wherein the at least one cutout area comprises at least one channel extending into the tamper-respondent sensor on at least one of the first side or the second side of the at least one flexible layer, the at least one channel providing the at least one stress-concentrating inner edge within the tamper-respondent sensor. 10. The tamper-respondent assembly of claim 8, wherein the at least one cutout area comprises, at least in part, at least one opening that extends through the at least one flexible layer with the circuit lines, the at least one opening providing the at least one stress-concentrating inner edge within the at least one tamper-respondent sensor. 11. The tamper-respondent assembly of claim 8, wherein multiple regions of the tamper-respondent sensor have increased susceptibility to damage from mechanical stress associated with the tamper event, and wherein the multiple regions of increased susceptibility to damage are associated with multiple cutout areas in the tamper-respondent sensor, the multiple cutout areas being disposed at a periphery of the tamper-respondent sensor, and defining respective stress-concentrating inner edges within the tamper-respondent sensor, wherein each region of increased susceptibility to damage of the multiple regions of increased susceptibility to damage adjoins a respective stress-concentrating inner edge of the multiple stress-concentrating inner edges defined by the multiple cutout areas at the periphery of the tamper-respondent sensor. 12. The tamper-respondent assembly of claim 1, wherein one or more circuit lines of the circuit lines of the tamper-respondent sensor are disposed, at least in part, within the at least one region of the tamper-respondent sensor having the increased susceptibility to damage from mechanical stress associated with the tamper event. 13. A tamper-respondent assembly comprising: an electronic assembly comprising at least one electronic component to be protected;an electronic enclosure surrounding, at least in part, the at least one electronic component;a tamper-respondent electronic circuit structure associated with the electronic enclosure, the tamper-respondent electronic circuit structure comprising a tamper-respondent sensor secured to an inner surface of the electronic enclosure, the tamper-respondent sensor being a first tamper-respondent sensor, and comprising: at least one flexible layer having opposite first and second sides;circuit lines forming, at least in part, at least one tamper-detect network, the circuit lines being disposed on at least one of the first side or the second side of the at least one flexible layer; andat least one region of the tamper-respondent sensor having an increased susceptibility to damage from mechanical stress associated with a tamper event, the at least one region of increased susceptibility to damage facilitating detection of the tamper event by the tamper-respondent sensor;a multilayer circuit board, the at least one electronic component being mounted to a main surface of the multilayer circuit board;an embedded tamper-respondent sensor embedded within the multilayer circuit board as part of the multilayer circuit board, the embedded tamper-respondent sensor being a second tamper-respondent sensor; andthe electronic enclosure being affixed to the main surface of the multilayer circuit board to seal the at least one electronic component between the enclosure and the multilayer circuit board, and the tamper-respondent sensor secured to the inner surface of the enclosure and the embedded tamper-respondent sensor within the multilayer circuit board facilitating defining a secure volume about the at least one electronic component. 14. The tamper-respondent assembly of claim 13, wherein the inner surface of the electronic enclosure comprises a rigid surface, and wherein the tamper-respondent sensor comprises first circuit lines, of the circuit lines, the first circuit lines being disposed at the first side of the at least one flexible layer, and being adhesively bonded to the rigid surface of the electronic enclosure to define the at least one region of increased susceptibility to damage from mechanical stress associated with the tamper event, the first circuit lines of the tamper-respondent sensor being exposed at the first side of the at least one flexible layer, and being bonded to the rigid surface of the electronic enclosure via an adhesive. 15. The tamper-respondent assembly of claim 14, wherein the adhesive secures the first circuit lines to the rigid surface with an equal or greater bond strength than a bond strength of the first circuit lines to the first side of the at least one flexible layer. 16. The tamper-respondent assembly of claim 13, wherein the tamper-respondent sensor includes at least one cutout area, the at least one cutout area defining, at least in part, at least one stress-concentrating inner edge within the tamper-respondent sensor, the at least one region of increased susceptibility to damage adjoining the at least one stress-concentrating inner edge within the tamper-respondent sensor. 17. The tamper-respondent assembly of claim 1, wherein the multilayer circuit board includes a groove in the main surface thereof, and the enclosure mounts to the multilayer circuit board within the groove in the main surface of the multilayer circuit board.
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