Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-co
Various embodiments of a sealed package and a method of forming such package are disclosed. The package can include a non-conductive substrate that includes a cavity disposed in a first major surface. A cover layer can be disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a sealed enclosure. The sealed package can also include a feedthrough that includes a via between a recessed surface of the cavity and a second major surface of the substrate, and a conductive material disposed in the via. An external contact can be disposed over the via on the second major surface of the non-conductive substrate, where the external contact is electrically connected to the conductive material disposed in the via. The sealed package can also include an electronic device disposed within the sealed enclosure that is electrically connected to the external contact.
대표청구항▼
1. A hermetically-sealed package, comprising: a non-conductive substrate comprising a first major surface, a second major surface, and a cavity disposed in the first major surface, wherein the cavity comprises a recessed surface;a cover layer disposed over the cavity and attached to the first major
1. A hermetically-sealed package, comprising: a non-conductive substrate comprising a first major surface, a second major surface, and a cavity disposed in the first major surface, wherein the cavity comprises a recessed surface;a cover layer disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a hermetically-sealed enclosure;a feedthrough comprising: a via between the recessed surface of the cavity and the second major surface of the substrate;a conductive material disposed in the via; andan external contact disposed over the via on the second major surface of the non-conductive substrate, wherein the external contact is electrically connected to the conductive material disposed in the via, and wherein the external contact is hermetically sealed to the second major surface of the non-conductive substrate by a laser bond surrounding the via;an electronic device disposed within the hermetically-sealed enclosure, wherein the electronic device comprises a device contact that is electrically connected to the conductive material disposed in the via such that the electronic device is electrically connected to the external contact; anda conductor disposed on the recessed surface and electrically connected to the electronic device. 2. The package of claim 1, further comprising an internal contact disposed over the via on the recessed surface of the cavity of the non-conductive substrate, wherein the internal contact is electrically connected to the conductive material in the via, and further wherein the device contact is electrically connected to the internal contact. 3. The package of claim 1, wherein the external contact is adapted to provide an electrical signal to tissue of a patient. 4. The package of claim 1, wherein the cover layer is hermetically sealed to the first major surface of the non-conductive substrate by a laser bond. 5. The package of claim 1, wherein the non-conductive substrate is substantially transmissive to light having a wavelength in a range of 200 nm to 30 μm. 6. The package of claim 1, further comprising a conductor disposed on the second major surface of the non-conductive substrate and electrically connected to the external contact. 7. The package of claim 1, wherein the cover layer comprises sapphire. 8. The package of claim 1, further comprising a power source disposed in the cavity and electrically connected to the electronic device. 9. An implantable medical device system that comprises a lead comprising a lead body and the hermetically-sealed package of claim 1 disposed in a distal portion of the lead body. 10. The implantable medical device system of claim 9, wherein the external contact of the hermetically-sealed package is electrically connected to a conductor of the lead. 11. A method of forming a hermetically-sealed package, comprising: forming a cavity in a first major surface of a non-conductive substrate;forming a via between a recessed surface of the cavity and a second major surface of the non-conductive substrate;forming an external contact over the via on the second major surface of the non-conductive substrate;disposing conductive material in the via such that the external contact is electrically connected to the conductive material in the via;disposing an electronic device at least partially within the cavity such that a device contact of the electronic device is electrically connected to the conductive material in the via;disposing a conductor on the recessed surface that is electrically connected to the electronic device;disposing a cover layer over the cavity; andattaching the cover layer to the first major surface of the non-conductive substrate to form a hermetically-sealed enclosure, wherein the electronic device is disposed within the hermetically-sealed enclosure. 12. The method of claim 11, wherein forming the cavity comprises etching the first major surface of the non-conductive substrate. 13. The method of claim 11, wherein forming the cavity comprises ablating the first major surface of the non-conductive substrate. 14. The method of claim 11, wherein forming an external contact comprises: disposing a conductive layer on the second major surface over the via; andremoving a portion of the conductive layer to form the external contact over the via. 15. The method of claim 11, further comprising forming an internal contact on the recessed surface of the cavity over the via such that the internal contact is electrically connected to the conductive material in the via, wherein the device contact of the electronic device is electrically connected to the internal contact. 16. The method of claim 11, further comprising disposing an insulative material within the hermetically-sealed enclosure. 17. The method of claim 11, wherein attaching the cover layer comprises laser bonding the cover layer to the first major surface of the non-conductive substrate. 18. The method of claim 17, wherein laser bonding the cover layer comprises forming a bond line at an interface between the first major surface of the substrate and the cover layer such that the bond line surrounds the cavity. 19. The method of claim 11, further comprising: disposing a power source at least partially within the cavity of the non-conductive substrate prior to attaching the cover layer to the first major surface of the non-conductive substrate; andelectrically connecting the power source to the electronic device. 20. A hermetically-sealed package, comprising: a non-conductive substrate comprising a first major surface, a second major surface, and a cavity disposed in the first major surface, wherein the cavity comprises a recessed surface;an internal contact disposed on the recessed surface of the cavity;an electronic device comprising a device contact electrically connected to the internal contact;a conductor disposed on the recessed surface and electrically connected to the electronic device; anda cover layer disposed over the cavity and attached to the first major surface of the non-conductive substrate to form a hermetically-sealed enclosure, wherein the electronic device is disposed within the hermetically-sealed enclosure.
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