Systems for thermal management and methods for the use thereof
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
H01L-023/10
H01L-023/34
H01L-023/373
H01L-021/02
H01L-023/427
출원번호
US-0811185
(2017-11-13)
등록번호
US-10121725
(2018-11-06)
발명자
/ 주소
Zhao, Yuan
Berhe, Mulugeta
Maslyk, Daniel
Allen, Scott Timon
출원인 / 주소
Henkel IP & Holding GmbH
대리인 / 주소
Coon, Taylor M.
인용정보
피인용 횟수 :
0인용 특허 :
10
초록▼
In accordance with the present invention, there are provided heat dispersing articles, assemblies containing same, methods for the preparation thereof, and various uses therefor. In one aspect of the present invention, there are provided heat dispersing articles. In another aspect of the present inv
In accordance with the present invention, there are provided heat dispersing articles, assemblies containing same, methods for the preparation thereof, and various uses therefor. In one aspect of the present invention, there are provided heat dispersing articles. In another aspect of the present invention, there are provided methods for producing the above-referenced articles. In yet another aspect of the present invention, there are provided assemblies containing the above-referenced articles. In still another aspect of the present invention, there are provided methods for making the above-referenced assemblies. In yet another aspect, there are provided methods to dissipate the heat generated by portable electronic devices.
대표청구항▼
1. A heat-dispersing article comprising: a first conductive/protective layer,one or more porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM) so as to substantially cover the surface and voids of said porous thermal
1. A heat-dispersing article comprising: a first conductive/protective layer,one or more porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM) so as to substantially cover the surface and voids of said porous thermally conductive, low-profile structure, wherein said formulated PCM comprises said PCM containing 5-20% by weight of a gelling agent mixed with said PCM, anda second conductive/protective layer, wherein said one or more porous thermally conductive, low-profile structure(s) are sandwiched between said first and second conductive/protective layers, andwherein said article has: a latency of at least 100 J/cc, andan effective thermal conductivity of at least 10 W/mK. 2. The article of claim 1 wherein said porous thermally conductive, low-profile structure comprises a copper mesh, a copper cloth, a copper foam, an aluminum mesh, an aluminum cloth, or an aluminum foam. 3. The article of claim 2 wherein the porous thermally conductive, low-profile structure is a wire mesh. 4. The article of claim 2, wherein the thickness of the porous thermally conductive, low-profile structure falls in the range of about 50 μm up to about 1 mm. 5. The article of claim 2 wherein the thickness of the formulated PCM is 1-2 times the thickness of the porous thermally conductive, low-profile structure. 6. The article of claim 1 wherein said porous thermally conductive, low-profile structure has an area opening ratio in the range of about 40% up to about 70%, and a volumetric opening ratio in the range of about 60% up to about 95%. 7. The article of claim 1 wherein said formulated PCM is prepared by mixing 5%-20% by weight of a gelling agent with a phase change material selected from: a paraffin (CnH2n+2), wherein n falls in the range of about 20 up to 40, ora fatty acid (CH3(CH2)2nCOOH) with similar melting temperature range, ormixtures of any two or more thereof. 8. The article of claim 7 wherein said formulated PCM is substantially uniformly gelled throughout the thickness of said porous thermally conductive, low-profile structure(s). 9. The article of claim 1 wherein said PCM is encapsulated. 10. The article of claim 9 wherein: said porous thermally conductive, low-profile structure is impregnated with said formulated PCM, and thensaid impregnated porous thermally conductive, low-profile structure is laminated with a heat conducting sheet through a pressure sensitive adhesive (PSA) layer, which prevents the PCM from leaking out. 11. The article of claim 10 wherein said heat conducting sheet is a copper foil, a copper mesh, a copper cloth, a copper foam, an aluminum foil, an aluminum mesh, an aluminum cloth, an aluminum foam, or a graphite sheet. 12. The article of claim 11 wherein said heat conducting sheet has a thickness in the range of 25 μm to 500 μm. 13. The article of claim 11 wherein said heat conducting sheet is a graphite sheet having a thickness in the range of 25 μm to 70 μm. 14. A heat-dispersing assembly comprising: 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,a conductive base layer having a thickness in the range of about 17 μm to 500 μm;25 μm to 150 μm of a porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,25 μm to 50 μm thickness of a thermal conductive/protective layer, and5 μm to 10 μm thickness of an electrical insulation layer. 15. A heat-dispersing assembly comprising: 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,a conductive base layer having a thickness in the range of about 17 μm to 500 μm;25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),25 μm to 50 μm thickness of a thermal conductive/protective layer, and5 μm to 10 μm thickness of an electrical insulation layer. 16. A heat-dispersing assembly comprising: 5 μm to 20 μm thickness of a first pressure sensitive adhesive layer,a conductive base layer having a thickness in the range of about 17 μm to 500 μm;25 μm to 150 μm of a first porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),5 μm to 10 μm thickness of a second pressure sensitive adhesive layer,25 μm to 150 μm of a second porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),5 μm to 10 μm thickness of a third pressure sensitive adhesive layer,25 μm to 150 μm of a third porous thermally conductive, low-profile structure(s), impregnated with a sufficient quantity of a formulated phase change material (PCM),25 μm to 50 μm thickness of a thermal conductive/protective layer, and5 μm to 10 μm thickness of an electrical insulation layer. 17. A method to prepare an article according to claim 1, said method comprising impregnating a porous thermally conductive, low-profile structure with a sufficient quantity of a molten form of a formulated phase change material (PCM) so as to substantially wet the porous thermally conductive, low-profile structure. 18. The method of claim 17 wherein said formulated phase change material comprises said PCM containing 5-20% by weight of a gelling agent mixed with said PCM.
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