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A thermosetting polymer formulation includes: 40 to 90 volume percent of a thermosetting polymer system; 10 to 40 volume percent, preferably 20 to 35 volume percent, preferably 20 to 30 volume percent, of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 mic

A thermosetting polymer formulation includes: 40 to 90 volume percent of a thermosetting polymer system; 10 to 40 volume percent, preferably 20 to 35 volume percent, preferably 20 to 30 volume percent, of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 micrometers, preferably 8 to 15 micrometers, and a D10 particle diameter of 3 to 7 micrometers, preferably 3 to 5 micrometers, and a D90 particle diameter of 20 to 30 micrometers, preferably 25 to 30 micrometers; a total of 0.01 to 10 volume percent of a coupling agent, an impact modifier, a curing agent, a defoamer, a colorant, a thickening agent, a release agent, an accelerator, or a combination comprising at least one of the foregoing, wherein the volume percentages are based on the total volume of the formulation.

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1. A thermosetting polymer formulation, comprising: 40 to 90 volume percent of a thermosetting polymer system;10 to 40 volume percent of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 micrometers, and a D10 particle diameter of 3 to 7 micrometers, and a D

1. A thermosetting polymer formulation, comprising: 40 to 90 volume percent of a thermosetting polymer system;10 to 40 volume percent of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 micrometers, and a D10 particle diameter of 3 to 7 micrometers, and a D90 particle diameter of 20 to 30 micrometers;a total of 0.01 to 10 volume percent of a coupling agent, an impact modifier, a curing agent, a defoamer, a colorant, a thickening agent, a release agent, an accelerator, or a combination comprising at least one of the foregoing. 2. The formulation of claim 1, comprising more than 60 volume percent of the thermosetting polymer system. 3. The formulation of claim 1, wherein the thermosetting polymer system comprises a butadiene, an isoprene, a bis-maleimide, a styrene-maleic anhydride copolymer, an epoxy, a polyurethane prepolymer composition, a cyanate ester, a styrene butadiene copolymer, a benzoxazine, or a combination comprising at least one of the foregoing. 4. The formulation of claim 1, wherein the thermosetting polymer system is a thermosetting epoxy system comprising 15 to 85 volume percent of a liquid epoxy resin component; and15 to 60 volume percent of a phenolic curing system. 5. The formulation of claim 1, comprising 35 to 45 volume percent of an epoxy resin component;18 to 26 volume percent of a curing system;25 to 40 volume percent of a plurality of hexagonal boron nitride platelets;1 to 5 volume percent of an impact modifier;0.5 to 1.5 volume percent of a curing agent;0.2 to 0.9 volume percent of an accelerator; and0.2 to 0.6 volume percent of a coupling agent, wherein the volume percentages are based on the total volume of the formulation. 6. The thermosetting polymer formulation of claim 1, comprising: 20 to 35 volume percent of the plurality of hexagonal boron nitride platelets. 7. The thermosetting polymer formulation of claim 1, comprising: 20 to 30 volume percent of the plurality of hexagonal boron nitride platelets. 8. The thermosetting polymer formulation of claim 1, wherein the plurality of hexagonal boron nitride platelets has a mean particle diameter of 8 to 15 micrometers. 9. The thermosetting polymer formulation of claim 1, wherein the plurality of hexagonal boron nitride platelets has a D10 particle diameter of 3 to 5 micrometers. 10. The thermosetting polymer formulation of claim 1, wherein the plurality of hexagonal boron nitride platelets has a D90 particle diameter of 25 to 30 micrometers. 11. A dielectric layer for the manufacture of a dielectric substrate, the dielectric layer comprising: a thermosetting polymer system; and10 to 40 volume percent, based on the total volume of the dielectric layer, of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 micrometers, and a D10 particle diameter of 3 to 7 micrometers, and a D90 particle diameter of 20 to 30 micrometers;wherein after full cure of the dielectric layer, the dielectric layer hasa dielectric constant of less than or equal to 4.5, measured over 1 MHz to 100 GHz;an in-plane thermal conductivity of greater than 0.5 Watts/meter·Kelvin;a z-axis thermal conductivity of 0.5 to 1.5 Watts/meter·Kelvin; anda thickness of less than or equal to 3.0 mils. 12. The dielectric layer of claim 11, wherein the dielectric layer is halogen-free or wherein the fully cured dielectric layer has a UL rating of V-0. 13. The dielectric layer of claim 11, wherein the thermosetting polymer system comprises a butadiene, an isoprene, a bis-maleimide, a styrene-maleic anhydride copolymer, an epoxy, a polyurethane prepolymer composition, a cyanate ester, a styrene butadiene copolymer, a benzoxazine, or a combination comprising at least one of the foregoing. 14. The dielectric layer of claim 11, wherein the thermosetting polymer system is a thermosetting epoxy system comprising, 40 to 99 volume percent of an epoxy resin component; and15 to 60 volume percent of a curing system. 15. The dielectric layer of claim 11, wherein the thermosetting polymer system comprises a liquid epoxy resin and a phenolic curing system. 16. The dielectric layer of claim 11, further comprising a total of 0.01 to 10 volume percent of a coupling agent, an impact modifier, a curing agent, a defoamer, a colorant, a thickening agent, a release agent, an accelerator, or a combination comprising at least one of the foregoing. 17. The dielectric layer of claim 11, wherein the thermosetting polymer composition is partially cured or fully cured. 18. A circuit subassembly, comprising an electrically conductive layer disposed on the dielectric layer of claim 11. 19. The circuit subassembly of claim 18, wherein the conductive layer comprises copper, or wherein the conductive layer is in the form of a patterned circuit. 20. A method of manufacture of a circuit subassembly, comprising disposing the dielectric layer of claim 11 onto a conductive layer; and partially or fully curing the dielectric layer. 21. The dielectric layer of claim 11, wherein after full cure of the dielectric layer, the dielectric layer has a dielectric constant of less than or equal to 4.0, measured over 1 MHz to 100 GHz; an in-plane thermal conductivity of greater than 2.0 Watts/meter-Kelvin; anda thickness of less than or equal to 2.5 mils. 22. The dielectric layer of claim 11, wherein after full cure of the dielectric layer, the dielectric layer has a thickness of less than or equal to 2.2 mils. 23. The dielectric layer of claim 11, wherein after full cure of the dielectric layer, the dielectric layer has a thickness of less than or equal to 2.0 mils. 24. The dielectric layer of claim 11, wherein after full cure of the dielectric layer, the dielectric layer has a thickness of 0.1 to 2.0 mils. 25. A bond ply for a circuit subassembly comprising: a first outer layer comprising a thermosetting polymer formulation;a second outer layer comprising a thermosetting polymer formulation that is of the same type as that of the first outer layer; andan intermediate layer disposed between the first and the second outer layers, and comprising a thermosetting polymer formulation that is of the same type as the first and second outer layers;wherein the thermosetting polymer formulation comprises: 40 to 90 volume percent of a thermosetting polymer system;10 to 40 volume percent, based on the total volume of the dielectric layer, of a plurality of hexagonal boron nitride platelets having a mean particle diameter of 5 to 20 micrometers, and a D10 particle diameter of 3 to 7 micrometers, and a D90 particle diameter of 20 to 30 micrometers;a total of 0.01 to 10 volume percent of a coupling agent, an impact modifier, a curing agent, a defoamer, a colorant, a thickening agent, a release agent, an accelerator, or a combination comprising at least one of the foregoing;wherein the thermosetting polymer formulation of the intermediate layer has a degree of cure that is different than a degree of cure for each of the thermosetting polymer formulations of the first and the second outer layers. 26. A circuit comprising the circuit subassembly of claim 25. 27. A multilayer circuit comprising the circuit subassembly of claim 25. 28. A handheld device comprising either the circuit of claim 25. 29. A handheld device comprising the multilayer circuit of claim 27. 30. The bond ply of claim 25, comprising: 20 to 35 volume percent of the plurality of hexagonal boron nitride platelets. 31. The bond ply of claim 25, comprising: 20 to 30 volume percent of the plurality of hexagonal boron nitride platelets. 32. The bond ply of claim 25, wherein the plurality of hexagonal boron nitride platelets has a mean particle diameter of 8 to 15 micrometers. 33. The bond ply of claim 25, wherein the plurality of hexagonal boron nitride platelets has a D10 particle diameter of 3 to 5 micrometers. 34. The bond ply of claim 25, wherein the plurality of hexagonal boron nitride platelets has a D90 particle diameter of 25 to 30 micrometers.