[특허]Thermally activatable insulating packaging

LBP Manufacturing LLC

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특허 상세정보

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Thermally activatable insulating packaging

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B65D-081/38 A47G-019/22 B31B-001/74 A47J-041/00 B31B-050/74
출원번호	US-0160035 (2016-05-20)
등록번호	US-10144573 (2018-12-04)
발명자 / 주소	Fu, Thomas Z. Cook, Matthew R.
출원인 / 주소	LBP Manufacturing LLC
대리인 / 주소	Fitch, Even, Tabin & Flannery LLP
인용정보	피인용 횟수 : 0 인용 특허 : 60

초록
▼

A method of making a container includes applying an insulating material in an inactive form to form a layer on a first substrate. The applied insulating material includes expandable microspheres. The method further includes joining a second substrate to the first substrate to adhere the first substrate to the second substrate and to create at least a portion of a multi-layer composite having at least one air gap between the first substrate and the second substrate. The method further includes heating the applied insulating material to activate expandable microspheres thereof to form expanded microspheres. The method further includes increasing the thickness of the applied insulating material layer to thereby increase the volume of the air gap between the first substrate and the second substrate of the multi-layer composite by the heating of the applied insulating material. The method further includes forming the multi-layer composite into a container having expanded microspheres.

대표
청구항
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1. A container comprising: a wall assembly comprising spaced inner and outer walls; andexpanded insulation between the inner wall and the outer wall, the expanded insulation being formed from an insulating material including expandable microspheres having a predetermined activation temperature such that the expanded insulation comprises expanded microspheres that have been exposed to the predetermined activation temperature causing the expandable microspheres to expand and shift the spaced inner and outer walls away from each other to increase the amount by which the inner and outer walls are spaced by at least 100%. 2. The container of claim 1, wherein the expanded insulation is at least 100% thicker than the insulating material prior to the expansion of the expandable microspheres. 3. The container of claim 1, wherein the insulating material prior to the expansion of the expandable microspheres is approximately 1/64th of an inch thick, and after the expansion of the expandable microspheres, the expanded insulation including the expanded microspheres is in the range of approximately 1/32nd of an inch thick to approximately 1/16th of an inch thick. 4. The container of claim 1, wherein the predetermined activation temperature of the expandable microspheres is in the range of approximately 150° F. to approximately 190° F. 5. A container comprising: an assembly including a first substrate, a second substrate spaced from the first substrate, and expanded insulation between the first substrate and the second substrate to be in contact with at least one of the first substrate and the second substrate, the expanded insulation being formed from an insulating material including expandable microspheres having a predetermined activation temperature such that the expanded insulation comprises expanded microspheres that have been exposed to the predetermined activation temperature causing the expandable microspheres to expand and shift the spaced first and second substrates away from each other to increase the amount by which the first and second substrates are spaced by at least 100%; andan adhesive material different than the expanded insulation, the adhesive material arranged between the first substrate and the second substrate to adhere the first substrate and the second substrate together,wherein at least a portion of the expanded insulation including expanded microspheres and inner facing surface portions of the first substrate and the second substrate define at least one insulative air gap. 6. The container of claim 5, wherein the expanded insulation is in contact with both the first substrate and the second substrate. 7. The container of claim 5, wherein the expanded insulation is disposed in a pattern such that at least the at least one insulative air gap comprises a plurality of insulative air gaps between the inner facing surface portions of the first substrate and the second substrate with the expanded insulation extending along the insulative air gaps. 8. The container of claim 5, wherein the first substrate and the second substrate are paper-based substrates, and the expanded insulation has a thermal conductivity property different than thermal conductivity properties of the first substrate and the second substrate and the at least one air gap. 9. The container of claim 5, wherein the expanded insulation comprises a pattern of discrete shapes of the expanded insulation that engage the first and second substrates such that the first substrate is laminated to the second substrate by the adhesive material at a first location and the first substrate is laminated to the second substrate by the discrete shapes of expanded insulation at a second location. 10. The container of claim 5, wherein the adhesive material is a seam adhesive applied in at least two lines on the first substrate and wherein at least a portion of the expanded insulation is positioned on the first substrate between and spaced from the at least two lines of seam adhesive. 11. A generally rectangular container comprising: a rectangular container body having an internal space;a wall of the rectangular container body extending about the internal space and comprising a first substrate and a second substrate spaced from the first substrate by at least one air gap;a layer of expanded insulating material disposed between the first substrate and the second substrate, the insulating material comprising expanded microspheres; andan adhesive separate from the insulating material, the adhesive arranged between the first substrate and the second substrate to adhere the first and second substrates together,wherein the expanded insulation is formed from an insulating material including expandable microspheres having a predetermined activation temperature such that the expanded insulation comprises the expanded microspheres that have been exposed to the predetermined activation temperature causing the expandable microspheres to expand and shift the spaced first and second substrates away from each other to increase the amount by which the first and second substrates are spaced by at least 100%. 12. The generally rectangular container of claim 11, wherein the layer of expanded insulating material is in the form of a repeating pattern. 13. The generally rectangular container of claim 12, wherein the repeating pattern comprises generally straight bands, curved bands, dots, waves, squares, rectangles, circles, diamonds, or any combination thereof. 14. The generally rectangular container of claim 11, wherein at least one of the first substrate and the second substrate are paper-based substrates, and the layer of insulating material has a thermal conductivity property different than thermal conductivity properties of the first substrate and the second substrate and the at least one air gap. 15. The generally rectangular container of claim 11, wherein the predetermined activation temperature does not exceed 190° F. 16. The generally rectangular container of claim 15, wherein the predetermined activation temperature is in the range of approximately 150° F. to approximately 190° F. 17. The generally rectangular container of claim 11, wherein the adhesive material is a hot melt adhesive or a cold set adhesive. 18. The container of claim 11, wherein the layer of expanded insulating material comprises a pattern of discrete shapes of the expanded insulating material that engage the first and second substrates such that first substrate is laminated to the second substrate by the adhesive at a first location and the first substrate is laminated to the second substrate by the discrete shapes of the expanded insulating material at a second location. 19. The container of claim 11, wherein the adhesive is a seam adhesive applied in at least two lines on the first substrate and wherein at least a portion of the expanded insulating material is positioned on the first substrate between and spaced from the at least two lines of seam adhesive.

이 특허에 인용된 특허 (60)

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특허 상세정보

Thermally activatable insulating packaging

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이 특허에 인용된 특허 (60)

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Thermally activatable insulating packaging

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이 특허에 인용된 특허 (60)

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상세정보조회

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IPC 상세정보(version : 201201)

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