[특허]Method of manufacturing a device module

HOSIDEN CORPORATION

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특허 상세정보

MyON담기

내보내기 페이스북 공유 트위터 공유 카카오톡 공유

Method of manufacturing a device module

특허상세정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B29C-045/14 H05K-007/02 H05K-013/04 G06F-003/038 G06F-001/16 G06F-003/041 B29C-033/12 H05K-005/02 B29K-667/00 B29L-031/34
출원번호	US-0248154 (2016-08-26)
등록번호	US-10154602 (2018-12-11)
우선권정보	JP-2012-174790 (2012-08-07)
발명자 / 주소	Isoda, Takeshi Shinoda, Koji
출원인 / 주소	HOSIDEN CORPORATION
대리인 / 주소	Kratz, Quintos & Hanson, LLP
인용정보	피인용 횟수 : 0 인용 특허 : 39

초록
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The invention provides a device module that can be manufactured with a die. The device module includes a plastic part, a device, a holder, and an external connection. The device is embedded in the plastic part. The holder is embedded in the plastic part and includes an exposed portion exposed from the plastic part in a thickness direction of the plastic part in such a manner as to close a housing recess of the die. The external connection is connected to the device and partially fixed to the holder. The external connection includes a lead-out portion insertable in the housing recess of the die. The lead-out portion is embedded in the plastic part and being led out of the plastic part in the thickness direction. Alternatively, the lead-out portion is led through and out of the holder in the thickness direction.

대표
청구항
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1. A method of manufacturing a device module, the method comprising: partially fixing an external connection directly to a holder, the external connection being flexible in its entirety and including: a fixed portion being fixed directly to the holder,a first end portion being located closer to a first end of the external connection than the fixed portion and including the first end, the first end being connected to a device that is a sensor, anda second end portion being located closer to a second end of the external connection than the fixed portion and led out of the holder and including the second end;closing first and second dies to form a cavity of the first and second dies, the closing of the first and second dies including (1) placing the device, the first end portion of the external connection, and the fixed holder into the cavity of the first and second dies, (2) inserting the second end portion of the external connection into a housing recess of the first die, and (3) closing the housing recess of the first die with the fixed holder; andafter the closing of the first and second dies, injecting plastic material into the cavity to insert-mold the device, the first end portion of the external connection, and the holder in the plastic material. 2. The method according to claim 1, wherein the closing of the housing recess includes fitting a distal portion of the holder in the housing recess of the first die. 3. The method according to claim 2, wherein the distal portion of the holder is tapered. 4. The method according to claim 2, wherein at least a part of an edge of the housing recess of the first die forms a tapered portion. 5. The method according to claim 1, wherein the closing of the housing recess includes fitting a fitting projection into a fitting recess of the holder, the fitting projection being provided on an edge of the housing recess of the first die. 6. The method according to claim 1, wherein the placing of the device, the first end portion of the external connection, and the holder into the cavity includes placing a sheet in the cavity, disposing at least a part of the external connection on the sheet, disposing the holder on the at least the part of the external connection, and bringing the holder on the sheet into contact with the first die to close the housing recess of the first die, andthe injecting of the plastic material includes injecting the plastic material on the sheet to insert-mold the device, the first end portion of the external connection, and the holder on the sheet with the plastic material. 7. The method according to claim 1, wherein the placing of the device, the first end portion of the external connection, and the holder includes bringing the holder into contact with the first die and the second die to close the housing recess of the first die. 8. The method according to claim 1, wherein the closing of the housing recess of the first die including fixing the holder to the first die. 9. The method according to claim 6, wherein a gap is left between the holder and the sheet in the cavity, andthe injecting of the plastic material into the cavity includes flowing the plastic material into the gap. 10. The method according to claim 1, wherein the holder has a through hole passing through the holder, andthe fixing of the external connection to the holder includes inserting the external connection into the through hole of the holder. 11. The method according to claim 1, wherein the fixing of the external connection to the holder includes fixing the fixed portion of the external connection to an outer face of the holder, andthe closing of the housing recess of the first die includes closing the housing recess with the fixed portion of the external connection and the holder. 12. The method according to claim 1, wherein the fixing of the external connection to the holder includes insert-molding the fixed portion of the external connection in the holder. 13. The method according to claim 1, wherein the holder includes a plurality of pieces configured to surround the fixed portion of the external connection,the fixing of the external connection to the holder includes combining the plurality of pieces to surround the fixed portion of the external connection. 14. The method according to claim 1, wherein the holder is made of plastic material that is the same as or in a same group as that of the plastic part. 15. A method of manufacturing a device module, the method comprising: partially fixing an external connection directly to a holder, the external connection being flexible in its entirety and including: a fixed portion being fixed directly to the holder,a first end portion being located closer to a first end of the external connection than the fixed portion and including the first end, the first end being connected to a device that is a circuit board, anda second end portion being located closer to a second end of the external connection than the fixed portion and led out of the holder and including the second end;closing first and second dies to form a cavity of the first and second dies, the closing of the first and second dies including (1) placing the device, the first end portion of the external connection, and the fixed holder into the cavity of the first and second dies, (2) inserting the second end portion of the external connection into a housing recess of the first die, and (3) closing the housing recess of the first die with the fixed holder; andafter the closing of the first and second dies, injecting plastic material into the cavity to insert-mold the device, the first end portion of the external connection, and the holder in the plastic material. 16. A method of manufacturing a device module, the method comprising: partially fixing an external connection directly to a holder, the external connection being flexible in its entirety and including: a fixed portion being fixed directly to the holder,a first end portion being located closer to a first end of the external connection than the fixed portion and including the first end, the first end being connected to a device that is one of a semiconductor, a resistor, a capacitor, and a coil, anda second end portion being located closer to a second end of the external connection than the fixed portion and led out of the holder and including the second end;closing first and second dies to form a cavity of the first and second dies, the closing of the first and second dies including (1) placing the device, the first end portion of the external connection, and the fixed holder into the cavity of the first and second dies, (2) inserting the second end portion of the external connection into a housing recess of the first die, and (3) closing the housing recess of the first die with the fixed holder; andafter the closing of the first and second dies, injecting plastic material into the cavity to insert-mold the device, the first end portion of the external connection, and the holder in the plastic material. 17. The method according to claim 1, wherein the external connection is a flexible printed circuit or a flexible insulating transparent film. 18. The method according to claim 15, wherein the external connection is a flexible printed circuit or a flexible insulating transparent film. 19. The method according to claim 16, wherein the external connection is a flexible printed circuit or a flexible insulating transparent film. 20. The method according to claim 1, wherein the device is a touch sensing device.

이 특허에 인용된 특허 (39)

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Method of manufacturing a device module

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Method of manufacturing a device module

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이 특허에 인용된 특허 (39)

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