System for over-molded PCB sealing ring for TEC heat exchangers
원문보기
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
F24F-005/00
A47C-021/04
F25B-021/02
F24F-013/22
출원번호
US-0624469
(2015-02-17)
등록번호
US-10161642
(2018-12-25)
발명자
/ 주소
Giraud, Michael
Mishler, Jeremy
출원인 / 주소
Marlow Industries, Inc.
인용정보
피인용 횟수 :
0인용 특허 :
4
초록▼
A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air
A thermoelectric-based air conditioning system is provided. The system includes at least a first supply air channel and a separate second supply air channel disposed in a housing. The system also includes a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel. The system further includes a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel. The system includes a printed circuit board (PCB) for each of the first and second TEC assembly, wherein each of the PCSs are configured to provide an electrical connection between a first TEC and a second TEC with each of the first and second TEC assemblies. The system further includes a mold substrate configured to over-mold the first and second TECs of the first and second TEC assemblies.
대표청구항▼
1. A thermoelectric-based air conditioning system comprising: at least a first supply air channel and a separate second supply air channel disposed in a housing;a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently con
1. A thermoelectric-based air conditioning system comprising: at least a first supply air channel and a separate second supply air channel disposed in a housing;a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel;a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel;wherein each of the first TEC assembly and the second TEC assembly include: a first TEC and a second TEC;a printed circuit board (PCB) configured to provide an electrical connection between the first TEC and the second TEC with each of the first and second TEC assemblies; anda mold substrate configured to retain the PCB within the mold substrate while in contact with at least a portion of a perimeter of a planar surface of the first TEC and the second TEC. 2. The thermoelectric-based air conditioning system of claim 1, wherein the first supply air channel is configured to independently supply conditioned air to a first air distribution layer, and wherein the second supply air channel is configured to independently supply conditioned air to a second air distribution layer. 3. The thermoelectric-based air conditioning system of claim 1, further comprising: at least one exhaust air channel separate from the first supply air channel and the second supply air channel and configured to exchange heat with planar surfaces of the TECs of the first TEC assembly that is not exposed to the first supply air channel and configured to exchange heat with planar surfaces of the TECs of the second TEC assembly that is not exposed to the second supply air channel. 4. The thermoelectric-based air conditioning system of claim 1, wherein at least one of the first supply air channel and second supply air channel is configured to supply air to one of a bed, a chair, a sleeping bag, a sleeping pad, a couch, a futon, an article of clothing, or a blanket. 5. The thermoelectric-based air conditioning system of claim 1, further comprising a controller configured to independently control a supply of air through the first supply air channel and the second supply air channel. 6. The thermoelectric-based air conditioning system of claim 1, further comprising a controller configured to independently control the first TEC assembly to condition the air in the first supply air channel and independently control the second TEC assembly to condition the air in the second supply air channel. 7. The thermoelectric-based air conditioning system of claim 1, further comprising a first supply fan configured to communicate air through the first supply air channel and a second supply fan configured to communicate air through the second supply air channel. 8. The thermoelectric-based air conditioning system of claim 1, where the first supply air channel is configured to receive air through both a top portion of the housing and a bottom portion of the housing and wherein the second supply air channel is configured to receive air through both a top portion of the housing and a bottom portion of the housing. 9. A thermoelectric cooler (TEC) assembly comprising: a first TEC and a second TEC;a printed circuit board (PCB) configured to provide an electrical connection between the first TEC and the second TEC; anda mold substrate configured to retain the PCB within the mold substrate while in contact with at least a portion of a perimeter of a planar surface of the first TEC and the second TEC. 10. The TEC assembly of claim 9, further comprising a seal gasket forming a seal between the portion of the mold substrate in contact with the planar surface of the first TEC and between the portion of the mold substrate in contact with the planar surface of the second TEC. 11. The TEC assembly of claim 10, wherein at least one of the first and second TECs and the mold substrate comprises a recess or a seat configured to retain the seal gasket between the mold substrate and the first and second TECs. 12. The TEC assembly of claim 9, wherein the mold substrate is further configured to contact at least a portion of a perimeter of another planar surface of the first TEC and the second TEC while in contact with at least the portion of the perimeter of the planar surface of the first TEC and the second TEC. 13. The TEC assembly of claim 11, further comprising another seal gasket forming a seal between the portion of the mold substrate in contact with the other planar surface of the first TEC and the second TEC. 14. The TEC assembly of claim 13, wherein at least one of the first and second TECs and the mold substrate comprises another recess or seat configured to retain the another seal gasket between the mold substrate and the first and second TECs. 15. The TEC assembly of claim 9, wherein the mold substrate comprises at least one of a polymer material, glass, or glass fragments. 16. The TEC assembly of claim 9, further comprising a connector header communicatively coupled to the PCB and configured to communicate signals between the first TEC and a controller and between the second TEC and a controller. 17. A thermoelectric-based air conditioning system comprising: at least a first supply air channel and a separate second supply air channel disposed in a housing;a first thermoelectric cooler (TEC) assembly forming at least a portion of the first supply air channel and configured to independently condition air within the first supply air channel;a second TEC assembly forming at least a portion of the second supply air channel and configured to independently condition air within the second supply air channel;a printed circuit board (PCB) for each of the first TEC assembly and the second TEC assembly, wherein each of the PCBs are nesting at least one TEC of each of the first and the second TEC assemblies; anda mold substrate configured to retain the PCBs within the mold substrate for each of the first TEC assembly and the second TEC assembly while forming a seal with at least a portion of a perimeter of a planar surface of the at least one TEC of the first TEC assembly and a planar surface of the at least one TEC of the second TEC assembly. 18. The thermoelectric-based air conditioning system of claim 17, wherein at least one of the first supply air channel and second supply air channel is configured to supply air to one of a bed, a chair, a sleeping bag, a sleeping pad, a couch, a futon, an article of clothing, or a blanket. 19. The thermoelectric-based air conditioning system of claim 17, wherein the molded substrate forming the seal with at least the portion of the perimeter of the planar surface of the first TEC and the second TEC reduces vapor ingress from the planar surface of the first TEC and the second TEC to another planar surface of the first TEC and the second TEC. 20. The thermoelectric-based air conditioning system of claim 17, further comprising at least one seal gasket to seal the portion of the mold substrate in contact with the planar surface of the first TEC and to seal the portion of the mold substrate in contact with the planar surface of the second TEC.
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이 특허에 인용된 특허 (4)
Ulicny, John C.; Yang, Jihui; Verbrugge, Mark W., Active material apparatus with activating thermoelectric device thereon and method of fabrication.
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